摘要:
A pattern inspection method including: sequentially imaging plural chip formed on a substrate; selecting at least one of pattern sections of each inspection image obtained by the imaging, while discarding other pattern sections, based on a recipe created in advance, the recipe including information for determining which pattern sections to be selected or discarded; calculating position gap between an inspection image of a chip obtained by the imaging and a reference image stored in a memory by using positional information of pattern images included in the inspection image and reference pattern images which are both corresponding to the at least one of pattern sections selected at the selecting; aligning the inspection image and the reference image by using information of the calculated position gap; and comparing the aligned inspection image with the reference image, and extracting a difference between the two images as a defect candidate.
摘要:
According to the present invention, for a pattern inspection apparatus that compares images in corresponding areas of two patterns that are identical and that determines an unmatched portion between the images is a defect, a plurality of detection systems and a plurality of corresponding image comparison methods are provided. With this configuration, the affect of uneven brightnesses for a pattern that occurs due to differences in film thicknesses can be reduced, a highly sensitive pattern inspection can be performed, a variety of defects can be revealed, and the pattern inspection apparatus can be applied for processing performed within a wide range. Furthermore, the pattern inspection apparatus also includes a unit for converting the tone of image signals of comparison images for a plurality of different processing units, and when a difference in brightness occurs in the same pattern of the images, a defect can be correctly detected.
摘要:
A defect inspecting apparatus includes a sample mounting device for mounting a sample; lighting and detecting apparatus for illuminating a patterned sample mounted on a mount and detecting the optical image of the reflected light obtained therefrom. Also included is a display for displaying the optical image detected by this lighting and detecting apparatus; an optical parameter setting device for setting and displaying optical parameters for the lighting and detecting apparatus on the display; and optical parameter adjusting apparatus for adjusting optical parameters set for the lighting and detecting apparatus according to the optical parameters set by the optical parameter setting apparatus; a storage device for storing comparative image data; and a defect detecting device for detecting defects from patterns formed on the sample by comparing the optical image detected by the optical image detecting apparatus with the comparative image data stored in the storage.
摘要:
A defect inspecting apparatus includes a sample mounting device for mounting a sample; lighting and detecting apparatus for illuminating a patterned sample mounted on a mount and detecting the optical image of the reflected light obtained therefrom. Also included is a display for displaying the optical image detected by this lighting and detecting apparatus; an optical parameter setting device for setting and displaying optical parameters for the lighting and detecting apparatus on the display; and optical parameter adjusting apparatus for adjusting optical parameters set for the lighting and detecting apparatus according to the optical parameters set by the optical parameter setting apparatus; a storage device for storing comparative image data; and a defect detecting device for detecting defects from patterns formed on the sample by comparing the optical image detected by the optical image detecting apparatus with the comparative image data stored in the storage.
摘要:
A circuit pattern inspection method and an apparatus therefor, in which the whole of a portion to be inspected of a sample to be inspected is made to be in a predetermined changed state, the portion to be inspected is irradiated with an image-forming high-density electron beam while scanning the electron beam, secondary charged particles are detected at a portion irradiated with the electron beam after a predetermined period of time from an instance when the electron beam is irradiated, an image is formed on the basis of the thus detected secondary charged particle signal, and the portion to be inspected is inspected by using the thus formed image.
摘要:
Disclosed is a method and apparatus for inspecting defects of patterns of a sample at high speed and with high sensitivity while damage of the sample arising from high-power pulsed light is reduced. Light emitted from a pulsed laser light source is transmitted through a pseudo continuous-wave forming optical system having an optical system capable of reducing energy per pulse and yet maintaining the entire amount of light of the pulsed light, a beam formation optical system, and a coherence reduction optical system, and a beam deflected by a deformation illumination optical system is made to reflect on a PBS to be irradiated on a wafer. The apparatus is configured so that the diffracted light from the wafer is focused by an objective lens, transmitted through light modulation units, focused to form a plurality of images on a plurality of image sensors in a visual-field divided parallel detection unit 12, and then defects are detected by a signal processing unit.
摘要:
In a pattern inspection apparatus for comparing images of areas corresponding to patterns each formed so as to be the same pattern and determining a non-coincident portion of the image as a defect, an image comparison processing unit configured with a processing system mounting a plurality of CPUs operating in parallel is provided, whereby an effect of brightness irregularity between the comparison images generated from a difference of a film thickness, a difference of a pattern thickness, and the like can be reduced, and a highly sensitive pattern inspection can be performed without setting parameters. Further, a feature amount of each pixel is calculated between the comparison images, and a plurality of feature amounts are compared, so that distinction between a defect and a noise, which is impossible by a luminance value, can be performed with high accuracy.
摘要:
A method and apparatus for detecting a defect in which image signals of a same area of a sample are obtained by imaging the sample under different optical conditions, and the obtained image signals are analyzed and optical conditions are selected which modify a contrast in the image signal. Image signals of the sample under the selected optical conditions are obtained by imaging the sample with an inspection system, and the images under the selected optical conditions are evaluated to adjust optical conditions for inspection including an inspection threshold, which is greater than a maximum contrast difference among false defects detected at the step of obtaining and with which a maximum number of actual defects can be detected. A defect of the sample is detected by processing the image signals of the sample obtained through the inspection system under the adjusted optical conditions.
摘要:
An apparatus for inspecting pattern defects, the apparatus including: a defect candidate extraction unit configured to perform a defect candidate extraction process by comparing a detected image signal with a reference image signal; and a defect detection unit configured to perform a defect detection process and a defect classification process based on a partial image containing a defect candidate that is extracted by the defect candidate extraction unit, wherein the processes performed by the defect candidate extraction unit and/or the defect detection unit are performed asynchronously with an image acquisition process.
摘要:
This invention provides a defect inspection method and apparatus that can easily and quickly determine, from among a plurality of inspection conditions, a condition that allows for an inspection with high sensitivity. The inspection apparatus has a variety of optical functions to cover a variety of kinds of defects to be inspected (shape, material, nearby pattern, etc.). For each optical function, grayscale depths of defects that the operator wants detected and of pseudo defects that he or she wants undetected are accumulated for future use, so that conditions conducive to a higher sensitivity and a lower pseudo defect detection rate can be selected efficiently. Conditions that can be selected for optical systems include a bright-field illumination, a dark-field illumination and a bright-/dark-field composite illumination, illumination wavelength bands, polarization filters and spatial filters.