Semiconductor device and fabrication method of the same
    92.
    发明授权
    Semiconductor device and fabrication method of the same 失效
    半导体装置及其制造方法

    公开(公告)号:US06875628B1

    公开(公告)日:2005-04-05

    申请号:US08811742

    申请日:1997-03-06

    摘要: Nickel is introduced to a predetermined region of a peripheral circuit section, other than a picture element section, on an amorphous silicon film to crystallize from that region. After forming gate electrodes and others, sources, drains and channels are formed by doping impurities, and laser is irradiated to improve the crystallization. After that, electrodes/wires are formed. Thereby an active matrix type liquid crystal display whose thin film transistors (TFT) in the peripheral circuit section are composed of the crystalline silicon film whose crystal is grown in the direction parallel to the flow of carriers and whose TFTs in the picture element section are composed of the amorphous silicon film can be obtained.

    摘要翻译: 在非晶硅膜上将镍引入除了像素部分之外的外围电路部分的预定区域以从该区域结晶。 在形成栅电极等之后,通过掺杂杂质形成源极,漏极和沟道,照射激光以改善结晶。 之后,形成电极/电线。 由此,外围电路部的薄膜晶体管(TFT)由结晶硅晶体构成的有源矩阵型液晶显示器,晶体硅膜的晶体沿平行于载流子的方向生长,并且其像素部分中的TFT构成 的非晶硅膜。

    Transistor device employing crystallization catalyst
    95.
    发明授权
    Transistor device employing crystallization catalyst 失效
    晶体管器件采用结晶催化剂

    公开(公告)号:US5646424A

    公开(公告)日:1997-07-08

    申请号:US477941

    申请日:1995-06-07

    摘要: A thin film transistor includes a crystallized amorphous silicon film having a gate insulating film and a gate electrode formed thereon. The device includes impurities implanted in a self-aligned manner and a catalyst that accelerates the crystallization of the silicon film. The catalyst is introduced in the silicon film by adhering a coating containing the catalyst element and annealing the resulting structure at a temperature lower than the deformation temperature of the substrate to activate the doped impurities. The catalyst element can also be incorporated into the silicon film by means of ion implantation and the like. Also disclosed is a thin film transistor, which comprises a gate electrode, a gate insulating film, an amorphous silicon film having impurities implanted therein to form source and drain regions as the impurity regions, and a catalyst element introduced into the impurity regions by adhering a coating containing the catalyst element or by means of ion doping and the like, wherein the resulting structure is annealed at a temperature lower than the deformation temperature of the substrate to activate the doped impurities.

    摘要翻译: 薄膜晶体管包括具有形成在其上的栅绝缘膜和栅电极的结晶非晶硅膜。 该装置包括以自对准方式注入的杂质和加速硅膜结晶的催化剂。 将催化剂通过粘附含有催化剂元素的涂层并在低于基板的变形温度的温度下退火所得结构而引入到硅膜中,以激活掺杂的杂质。 催化剂元件也可以通过离子注入等并入硅膜中。 还公开了一种薄膜晶体管,其包括栅极,栅极绝缘膜,注入杂质的非晶硅膜,以形成源极和漏极区域作为杂质区域;以及催化剂元件,通过粘附到杂质区域 包含催化剂元素的涂层或通过离子掺杂等方法,其中所得结构在低于衬底的变形温度的温度下退火以活化掺杂的杂质。

    Process of fabricating a semiconductor device in which one portion of an
amorphous silicon film is thermally crystallized and another portion is
laser crystallized
    96.
    发明授权
    Process of fabricating a semiconductor device in which one portion of an amorphous silicon film is thermally crystallized and another portion is laser crystallized 失效
    制造半导体器件的方法,其中非晶硅膜的一部分被热结晶,另一部分被激光结晶

    公开(公告)号:US5624851A

    公开(公告)日:1997-04-29

    申请号:US207173

    申请日:1994-03-08

    摘要: A semiconductor circuit and a process for fabricating the same, said process comprising forming in contact with an amorphous silicon film, a substance containing a catalytic element; crystallizing selected portions of the amorphous silicon film by annealing said film at a temperature lower than the ordinary crystallization temperature of an amorphous silicon film; and then crystallizing the rest of the portions by irradiating thereto laser beam or an intense light having an intensity equivalent thereto. A process similar to the one above, wherein, the catalytic element is incorporated directly into the amorphous silicon film instead of bringing a substance containing the same into contact with the amorphous silicon film.

    摘要翻译: 一种半导体电路及其制造方法,所述方法包括与非晶硅膜接触,含有催化元素的物质; 通过在比非晶硅膜的普通结晶温度低的温度下对所述膜进行退火,使非晶硅膜的选定部分结晶; 然后通过向其上照射激光束或具有与其强度相当的强度的光来结晶其余部分。 类似于上述方法的方法,其中催化元素直接并入非晶硅膜中,而不是使含有该催化剂的物质与非晶硅膜接触。

    Thin film transistors having anodized metal film between the gate wiring and drain wiring
    98.
    发明授权
    Thin film transistors having anodized metal film between the gate wiring and drain wiring 失效
    在栅极布线和漏极布线之间具有阳极氧化金属膜的薄膜晶体管

    公开(公告)号:US06979840B1

    公开(公告)日:2005-12-27

    申请号:US08223823

    申请日:1994-04-06

    CPC分类号: H01L29/66757 H01L27/1255

    摘要: A thin-film semiconductor device or integrated circuit comprising an insulating substrate, TFTs (thin-film transistors) formed on the substrate, and multilayer conductive interconnections. The circuit has a first metallization layer becoming gate electrodes and gate interconnections. The surface of the first metallization layer is oxidized by anodic oxidation to form an insulating coating on the surface of the first metallization layer. A second metallization layer becoming source and drain electrodes or conductive interconnections is then formed on the insulating coating directly or via an interlayer insulator. An improvement in the production yield and improved reliability are accomplished.

    摘要翻译: 包括绝缘基板,形成在基板上的TFT(薄膜晶体管)和多层导电互连的薄膜半导体器件或集成电路。 该电路具有成为栅电极和栅极互连的第一金属化层。 通过阳极氧化将第一金属化层的表面氧化,以在第一金属化层的表面上形成绝缘涂层。 然后在绝缘涂层上直接或经由层间绝缘体形成成为源极和漏电极或导电互连的第二金属化层。 实现了产量的提高和可靠性的提高。