Air intake device
    91.
    发明授权
    Air intake device 有权
    进气装置

    公开(公告)号:US08955497B2

    公开(公告)日:2015-02-17

    申请号:US13426652

    申请日:2012-03-22

    IPC分类号: F02B29/04

    摘要: An air intake device includes a cooler and a surge tank accommodating the cooler. The air intake device is to be connected to a cylinder head of an engine. The cylinder head includes an intake port that accommodates an intake valve. The cooler has a refrigerant passage through which refrigerant flows and an air passage through which intake air flows. The surge tank has a connector connected to the cylinder head. The cooler has a protrusion protruding from the connector toward the intake valve.

    摘要翻译: 进气装置包括冷却器和容纳冷却器的缓冲罐。 进气装置将连接到发动机的气缸盖。 气缸盖包括容纳进气阀的进气口。 冷却器具有制冷剂流过的制冷剂通道和吸入空气流过的空气通道。 缓冲罐具有连接到气缸盖的连接器。 冷却器具有从连接器朝向进气阀突出的突起。

    Method for manufacturing SOI substrate and semiconductor device
    93.
    发明授权
    Method for manufacturing SOI substrate and semiconductor device 有权
    制造SOI衬底和半导体器件的方法

    公开(公告)号:US08598013B2

    公开(公告)日:2013-12-03

    申请号:US12247470

    申请日:2008-10-08

    IPC分类号: H01L21/30 H01L21/46

    摘要: To provide a method for manufacturing an SOI substrate provided with a semiconductor layer which can be used practically even when a substrate having a low heat-resistant temperature, such as a glass substrate or the like is used. The semiconductor layer is transferred to a supporting substrate by the steps of irradiating a semiconductor wafer with ions from one surface to form a damaged layer; forming an insulating layer over one surface of the semiconductor wafer; attaching one surface of the supporting substrate to the insulating layer formed over the semiconductor wafer and performing heat treatment to bond the supporting substrate to the semiconductor wafer; and performing separation at the damaged layer into the semiconductor wafer and the supporting substrate. The damaged layer remaining partially over the semiconductor layer is removed by wet etching and a surface of the semiconductor layer is irradiated with a laser beam.

    摘要翻译: 为了提供一种制造具有半导体层的SOI衬底的方法,即使使用诸如玻璃衬底等的耐热温度低的衬底也可以实际使用。 通过以下步骤将半导体层转移到支撑衬底:从一个表面照射半导体晶片以形成损伤层; 在所述半导体晶片的一个表面上形成绝缘层; 将所述支撑基板的一个表面附接到形成在所述半导体晶片上的绝缘层,并进行热处理以将所述支撑基板接合到所述半导体晶片; 并且在所述损伤层处进行到所述半导体晶片和所述支撑基板的分离。 通过湿蚀刻除去半导体层上部分残留的损伤层,并用激光束照射半导体层的表面。

    Laser treatment apparatus, laser treatment method, and manufacturing method of semiconductor device
    94.
    发明授权
    Laser treatment apparatus, laser treatment method, and manufacturing method of semiconductor device 有权
    激光治疗装置,激光治疗方法及半导体装置的制造方法

    公开(公告)号:US08188402B2

    公开(公告)日:2012-05-29

    申请号:US12153646

    申请日:2008-05-22

    IPC分类号: B23K26/02

    摘要: The invention relates to a laser treatment apparatus including a laser oscillator, an interlock provided in the laser oscillator, a movable table which moves with a certain movement period, a timer, an interlock provided in the timer, a sensor which can detect movement of the movable table, and a computer, in which the timer starts measuring time when the sensor senses passage of the movable table, and when the movable table does not pass the sensor even after the movement period, conduction between contacts of the interlock provided in the timer is blocked to operate the interlock in the laser oscillator, thereby stopping laser output. The invention also relates to a laser treatment method using the laser treatment apparatus.

    摘要翻译: 本发明涉及一种激光治疗装置,包括激光振荡器,设置在激光振荡器中的联锁装置,以一定运动周期移动的可移动工作台,定时器,定时器中设置的互锁装置,能够检测 活动台和计算机,其中定时器开始测量时间,当传感器感测到可移动台的通过时,并且当移动台甚至在移动时段之后也不通过传感器时,设置在定时器中的互锁装置的触点之间的传导 被阻止在激光振荡器中操作互锁,从而停止激光输出。 本发明还涉及使用激光治疗装置的激光治疗方法。

    Semiconductor device with interconnection structure for reducing stress migration
    95.
    发明授权
    Semiconductor device with interconnection structure for reducing stress migration 有权
    具有用于减少应力迁移的互连结构的半导体器件

    公开(公告)号:US07807567B2

    公开(公告)日:2010-10-05

    申请号:US11703701

    申请日:2007-02-08

    IPC分类号: H01L21/4763

    摘要: The semiconductor device of the present invention includes a first interconnection, a via-plug that is connected to the first interconnection, and a second interconnection that is formed as a single unit with the via-plug. The cross-sectional shape of the via-plug is such that the plug sidewall angle, which indicates the angle of the via-plug sidewall with respect to the surface of the first interconnection, is a positive angle; and moreover, at least two points exist between the base and the top of the via-plug on at least one sidewall of the two sidewalls of the cross-sectional shape of the via-plug at which the plug sidewall angle attains a maximum value. Since shapes that would give rise to the occurrence of concentrations of stress are not formed in the via-plug sidewalls, metal is more effectively embedded in the via-hole, and the incidence of voids is prevented.

    摘要翻译: 本发明的半导体器件包括第一互连,连接到第一互连的通孔,以及与通孔连接形成为单个单元的第二互连。 通孔塞的横截面形状使得指示通孔塞侧壁相对于第一互连件的表面的角度的插塞侧壁角度为正角度; 此外,在插塞侧壁角达到最大值的过孔塞的横截面形状的两个侧壁的至少一个侧壁上,在通孔塞的基部和顶部之间至少存在两个点。 由于在通孔塞侧壁中不会形成会产生应力集中的形状,所以金属更有效地嵌入到通路孔中,能够防止空隙的发生。

    Light exposure apparatus and manufacturing method of semiconductor device using the same
    97.
    发明授权
    Light exposure apparatus and manufacturing method of semiconductor device using the same 失效
    曝光装置及使用其的半导体装置的制造方法

    公开(公告)号:US07695985B2

    公开(公告)日:2010-04-13

    申请号:US10582616

    申请日:2005-12-21

    IPC分类号: H01L21/66

    摘要: When annealing of a semiconductor film is conducted using a plurality of lasers, each of the distances between laser irradiation regions is different. When a lithography step is conducted in accordance with a marker which is formed over a substrate in advance after the step, light-exposure is not correctly conducted to a portion crystallized by laser. By using a laser irradiation region obtained on a laser irradiation step as a marker, light-exposure is conducted by making a light-exposure position of a stepper coincide with a large grain size region in the laser irradiation region. A large grain size region and a poorly crystalline region are detected by utilizing a thing that scattering intensity of light is different between the large grain size region and the poorly crystalline region, thereby determining a light-exposure position.

    摘要翻译: 当使用多个激光器进行半导体膜的退火时,激光照射区域之间的距离各不相同。 当根据在步骤之后预先在衬底上形成的标记进行光刻步骤时,曝光不能正确地传导到通过激光结晶的部分。 通过使用在激光照射步骤中获得的激光照射区域作为标记,通过使激光照射区域中的步进曝光位置与大粒径区域一致来进行曝光。 通过利用在大晶粒尺寸区域和不良结晶区域之间的散射光强度不同的物质来检测大晶粒尺寸区域和不良结晶区域,从而确定曝光位置。

    Laser irradiation method and method for manufacturing crystalline semiconductor film
    98.
    发明授权
    Laser irradiation method and method for manufacturing crystalline semiconductor film 有权
    激光照射方法及制造结晶半导体膜的方法

    公开(公告)号:US07608527B2

    公开(公告)日:2009-10-27

    申请号:US11017900

    申请日:2004-12-22

    IPC分类号: H01L21/20 H01L21/36

    摘要: Even when the laser irradiation is performed under the same condition with the energy distribution of the beam spot shaped as appropriate, the energy given to the irradiated surface is not yet homogeneous. When a semiconductor film is crystallized to form a crystalline semiconductor film using such inhomogeneous irradiation energy, the crystallinity becomes inhomogeneous in this film, and the characteristic of semiconductor elements manufactured using this film varies. In the present invention, an irradiated object formed over a substrate is irradiated with a laser beam having the pulse width that is an order of picosecond (10−12 second) or less.

    摘要翻译: 即使当在相同条件下进行激光照射,并且适当地形成束斑的能量分布时,给予照射表面的能量还不均匀。 当使用这种不均匀的照射能量使半导体膜结晶以形成晶体半导体膜时,该膜中的结晶度变得不均匀,并且使用该膜制造的半导体元件的特性变化。 在本发明中,用脉冲宽度为微秒级(10-12秒)以下的激光照射在基板上形成的照射物体。

    Laser irradiation apparatus, laser irradiation method and method for manufacturing semiconductor device
    99.
    发明授权
    Laser irradiation apparatus, laser irradiation method and method for manufacturing semiconductor device 有权
    激光照射装置,激光照射方法及半导体装置的制造方法

    公开(公告)号:US07551655B2

    公开(公告)日:2009-06-23

    申请号:US10997868

    申请日:2004-11-29

    IPC分类号: H01S3/10

    摘要: The object of the present invention is to provide a laser irradiation apparatus being able to enlarge the beam spot to a large degree compared with that of the CW laser, to suppress the thermal damage to the glass substrate, and to form an aggregation of crystal grains including a single crystal extending long in a scanning direction by growing the crystal continuously in the scanning direction. The laser irradiation of the present invention comprises a pulsed laser oscillator, a non-linear optical element for converting the wavelength of the laser light emitted from the pulsed laser oscillator, and an optical system for condensing the laser light whose wavelength is converted on a semiconductor film, wherein the pulsed laser oscillator has a repetition rate in the range of 10 MHz to 100 GHz.

    摘要翻译: 本发明的目的是提供一种能够与CW激光相比大幅度地扩大光束点的激光照射装置,以抑制对玻璃基板的热损伤,并且形成晶粒的聚集体 包括通过在扫描方向上连续地生长晶体而沿扫描方向长延伸的单晶。 本发明的激光照射包括脉冲激光振荡器,用于转换从脉冲激光振荡器发射的激光的波长的非线性光学元件,以及用于会聚在半导体上波长被转换的激光的光学系统 膜,其中所述脉冲激光振荡器具有在10MHz至100GHz范围内的重复频率。