摘要:
A semiconductor device having a super junction MOS transistor includes: a semiconductor substrate; a first semiconductor layer on the substrate; a second semiconductor layer on the first semiconductor layer; a channel forming region on a first surface portion of the second semiconductor layer; a source region on a first surface portion of the channel forming region; a source contact region on a second surface portion of the channel forming region; a gate electrode on a third surface portion of the channel forming region; a source electrode on the source region and the source contact region; a drain electrode on a backside of the substrate; and an anode electrode on a second surface portion of the second semiconductor layer. The anode electrode provides a Schottky barrier diode.
摘要:
A semiconductor device includes: a semiconductor substrate having a first surface and a second surface, wherein the substrate has a first conductive type; a first trench extending from the first surface of the semiconductor substrate in a depth direction; and an epitaxial semiconductor layer having a second conductive type, wherein the epitaxial semiconductor layer is disposed in the first trench. The first trench includes an inner wall as an interface between the semiconductor substrate and the epitaxial semiconductor layer so that the interface provides a PN junction. The first trench has an aspect ratio equal to or larger than 1.
摘要:
A semiconductor device includes: a MOS transistor; a protection diode; and a semiconductor substrate. The MOS transistor and the protection diode are disposed in the semiconductor substrate. The drain of the MOS transistor is connected to the cathode of the protection diode. The source of the MOS transistor is connected to the anode of the protection diode. The MOS transistor has a withstand voltage defined as VT. The protection diode has a withstand voltage defined as VD, a parasitic resistance defined as RD, and a maximum current defined as IRmax. They satisfy a relationship of VT>VD+IRmax×RD. The maximum current of IRmax is equal to or larger than 45 Amperes.
摘要翻译:半导体器件包括:MOS晶体管; 保护二极管; 和半导体衬底。 MOS晶体管和保护二极管设置在半导体衬底中。 MOS晶体管的漏极连接到保护二极管的阴极。 MOS晶体管的源极连接到保护二极管的阳极。 MOS晶体管具有被定义为V T T的耐受电压。 保护二极管具有定义为V SUB的耐受电压,定义为R D D的寄生电阻,以及定义为I Rmax的最大电流。 它们满足V SUB> V + D + I Rmax×R×D 的关系。 I Rmax SUB>的最大电流等于或大于45安培。
摘要:
A semiconductor device includes a base P region, a source N+ region, and a drain N+ region formed in a surface layer portion on a principal surface in an N− silicon layer. In the surface layer portion on the principal surface, an N well region is formed deeper than the drain N+ region in a region including the drain N+ region and is in contact with the base P region. A trench is formed so as to penetrate the base P region in a direction toward the drain N+ region from the source N+ region as a planar structure. A gate electrode is formed via a gate insulating film in the inside of the trench.
摘要:
First and second trenches are formed on an n+ type substrate at a power MOSFET formation region and a peripheral device formation region, respectively. An n− type epitaxial film, a p type epitaxial film, and an n+ type epitaxial film are deposited on the substrate and in the trenches, and then flattening is performed. As a result, an n− type region is provided in the second trench of the peripheral device formation region. Then, a p type well layer is formed in the n− type region by ion-implantation. Accordingly, a power MOSFET and a peripheral device can been formed at the power MOSFET formation region and the peripheral device formation region easily.
摘要:
The present invention provides thermally activated adhesive compositions comprising polymer and polyester wherein the adhesive polymer comprises a polymer having hydroxyl and phenyl groups and adhesive films made from the adhesive compositions.
摘要:
In a semiconductor device, a p-type base region is provided in an n−-type substrate to extend from a principal surface of the substrate in a perpendicular direction to the principal surface. An n+-type source region extends in the p-type base region from the principal surface in the perpendicular direction, and an n+-type drain region extends in the substrate separately from the p-type base region with a drift region interposed therebetween. A trench is formed to penetrate the p-type base region from the n+-type source region in a direction parallel to the principal surface. A gate electrode is formed in the trench through a gate insulating film. Accordingly, a channel region can be formed with a channel width in a depth direction of the trench when a voltage is applied to the gate electrode.
摘要翻译:在半导体器件中,p型基极区域设置在n型衬底中,以从垂直于主表面的方向从衬底的主表面延伸。 n +型源极区域在垂直方向上从主表面延伸到p型基极区域中,并且n +型漏极区域在p型基极区域中与P型基极区域分开延伸,并且其间插入漂移区域。 形成沟槽,以在平行于主表面的方向上从n +型源极区域穿透p型基极区域。 栅电极通过栅极绝缘膜形成在沟槽中。 因此,当向栅电极施加电压时,可以在沟槽的深度方向上形成沟道区域。
摘要:
The present invention relates to a respiratory gas consumption monitoring method and monitoring device that is portable and has high measurement accuracy, for enabling the analysis and prediction of the respiratory behavior of subjects employing a variety of different types of breathing apparatuses in water, etc. Respiratory gas consumption monitoring device (20), for monitoring the respiratory gas consumption of the user of a breathing apparatus (1) in which a respiratory gas (G) inside a high pressure gas container (2) is reduced in pressure at pressure regulator (4) and supplied to a breathing mask (10), is provided with: a primary pressure sensor (21) for detecting the pressure prior to pressure reduction at pressure regulator (4); a temperature sensor (22) for correction; an environmental pressure sensor (23) for detecting the environmental pressure; an amplifier (24) for amplifying the signals from the aforementioned sensors; an A/D converter (25) for performing analog/digital conversion of the amplified signal; a data logger (26) for recording and storing the analog/digital converted signals; and a display (27) for display. In addition, as needed, a computer (X) for calculating, analyzing, and predicting data may be housed in housing (28), and connected to breathing apparatus (1) by connecting primary pressure sensor (21) to a high pressure opening (8) of pressure regulator (4) using a high pressure hose (29).
摘要:
A high breakdown voltage semiconductor device formed in an SOI structure is disclosed. An MOS transistor composed of a drift layer, p well, a source, a gate, and a drain is formed in an island region surrounded by insulators on a semiconductor substrate. Furthermore, an electricfield-alleviating layer is formed in a bottom portion of the Si island region. The electric-field-alleviating layer is a semiconductor layer of exceeding low concentration, e.g., intrinsic, and therefore a virtual PIN structure is structured among the p well and the drift layer. Because the electric-field-alleviating layer corresponds to an I layer of the PIN structure, a depletion layer is created within the electric-field-alleviating layer when high voltage is applied to the MOS transistor, the high voltage is distributed throughout this depletion layer, and high breakdown voltage can be obtained.
摘要:
A tamping shoe for a vibration rammer has a plurality of through holes communicating between an under surface and an upper surface. The through holes permit the escape of air trapped between the under surface and a surface being tamped, and thereby reduce the amount and pressure of air compressed under the tamping shoe. This reduces noise pollution produced during tamping. In a preferred embodiment, the through holes are tapered outward in the direction of air flow. Air passing through a through hole in a mount is released through a further through hole bored through a wall of the mount.