公开(公告)号：US08587110B2

公开(公告)日：2013-11-19

申请号：US13332414

申请日：2011-12-21

申请人： Markus Brunnbauer ,  Markus Fink ,  Hans-Gerd Jetten

发明人： Markus Brunnbauer ,  Markus Fink ,  Hans-Gerd Jetten

IPC分类号： H01L21/02

CPC分类号： H01L25/0657 ,  H01L23/3675 ,  H01L23/373 ,  H01L23/3733 ,  H01L24/48 ,  H01L2224/05554 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73253 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06586 ,  H01L2225/06589 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01068 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor module having a semiconductor chip stack and a method for producing the same is disclosed. In one embodiment, a thermally conductive layer with anisotropically thermally conductive particles is arranged between the semiconductor chips. The anisotropically thermally conductive particles have a lower thermal conductivity in a direction vertically with respect to the layer or the film than in a direction of the layer or the film.

摘要翻译： 公开了一种具有半导体芯片堆叠的半导体模块及其制造方法。 在一个实施例中，具有各向异性导热颗粒的导热层布置在半导体芯片之间。 各向异性导热颗粒在相对于层或膜垂直的方向上比在层或膜的方向上具有较低的热导率。

公开(公告)号：US20120286434A1

公开(公告)日：2012-11-15

申请号：US13556837

申请日：2012-07-24

申请人： Markus Brunnbauer ,  Edward Fuergut

发明人： Markus Brunnbauer ,  Edward Fuergut

IPC分类号： H01L23/28 ,  B28B23/00 ,  H01L21/56

CPC分类号： H01L23/5389 ,  H01L21/561 ,  H01L21/566 ,  H01L21/568 ,  H01L23/3107 ,  H01L23/544 ,  H01L24/96 ,  H01L2223/54426 ,  H01L2223/54473 ,  H01L2223/54493 ,  H01L2224/92 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/3511 ,  H01L2224/96 ,  H01L2224/82 ,  H01L2924/00

摘要： A blank and a semiconductor device include a composite panel with semiconductor chips embedded in a plastic package molding compound. The blank includes a composite panel with semiconductor chips arranged in rows and columns in a plastic package molding compound with active upper sides of the semiconductor chips forming a coplanar surface area with the upper side of the composite panel. The blank further includes an orientation indicator impressed into the plastic package molding compound when the semiconductor chips are embedded within the molding compound.

摘要翻译： 空白和半导体器件包括具有嵌入在塑料封装模塑料中的半导体芯片的复合面板。 坯料包括具有半导体芯片的复合面板，该复合面板具有以塑料封装模制化合物排成行和列的半导体芯片，半导体芯片的有源上侧与复合面板的上侧形成共面表面积。 当半导体芯片嵌入模塑料中时，该坯料还包括印模在塑料封装模塑料中的取向指示器。

公开(公告)号：US08247897B2

公开(公告)日：2012-08-21

申请号：US11686368

申请日：2007-03-15

申请人： Markus Brunnbauer ,  Edward Fuergut

发明人： Markus Brunnbauer ,  Edward Fuergut

IPC分类号： H01L23/22

CPC分类号： H01L23/5389 ,  H01L21/561 ,  H01L21/566 ,  H01L21/568 ,  H01L23/3107 ,  H01L23/544 ,  H01L24/96 ,  H01L2223/54426 ,  H01L2223/54473 ,  H01L2223/54493 ,  H01L2224/92 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/3511 ,  H01L2224/96 ,  H01L2224/82 ,  H01L2924/00

摘要： A blank and a semiconductor device are include a composite panel with semiconductor chips embedded in a plastic package molding compound. The blank includes a composite panel with semiconductor chips arranged in rows and columns in a plastic package molding compound with active upper sides of the semiconductor chips forming a coplanar surface area with the upper side of the composite panel. The blank further includes an orientation indicator impressed into the plastic package molding compound when the semiconductor chips are embedded within the molding compound.

摘要翻译： 空白和半导体器件包括具有嵌入塑料封装模塑料中的半导体芯片的复合面板。 坯料包括具有半导体芯片的复合面板，该复合面板具有以塑料封装模制化合物排成行和列的半导体芯片，半导体芯片的有源上侧与复合面板的上侧形成共面表面积。 当半导体芯片嵌入模塑料中时，该坯料还包括印模在塑料封装模塑料中的取向指示器。

公开(公告)号：US20120202319A1

公开(公告)日：2012-08-09

申请号：US13448941

申请日：2012-04-17

申请人： Markus Brunnbauer ,  Edward Fuergut ,  Daniel Porwol

发明人： Markus Brunnbauer ,  Edward Fuergut ,  Daniel Porwol

IPC分类号： H01L21/50 ,  B29C47/76

CPC分类号： B29C45/14639 ,  B29C33/10 ,  B29C43/18 ,  B29C43/36 ,  B29C45/02 ,  B29C2043/3644 ,  H01L21/565 ,  H01L2924/0002 ,  H01L2924/00

摘要： An apparatus and method for producing an article by molding is disclosed. In one embodiment, the method includes a mold with an upper part, a lower part and at least one mold cavity, and has a vacuum clamping ring with a least one closable vent, which is arranged between the upper part and the lower part. The mold cavity is at least partially filled with a mold material. The vent is closed, and the mold cavity is filled with a thermoplastic or thermoset material.

摘要翻译： 公开了一种通过模制制造制品的装置和方法。 在一个实施例中，该方法包括具有上部，下部和至少一个模腔的模具，并且具有设置在上部和下部之间的具有至少一个可关闭通气口的真空夹紧环。 模腔至少部分地填充有模具材料。 通风口关闭，模腔填充有热塑性或热固性材料。

公开(公告)号：US20120104592A1

公开(公告)日：2012-05-03

申请号：US13332414

申请日：2011-12-21

申请人： Markus Brunnbauer ,  Markus Fink ,  Hans-Gerd Jetten

发明人： Markus Brunnbauer ,  Markus Fink ,  Hans-Gerd Jetten

IPC分类号： H01L23/367 ,  H01L21/52 ,  H01L25/00 ,  B82Y99/00

CPC分类号： H01L25/0657 ,  H01L23/3675 ,  H01L23/373 ,  H01L23/3733 ,  H01L24/48 ,  H01L2224/05554 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73253 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06586 ,  H01L2225/06589 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01068 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor module having a semiconductor chip stack and a method for producing the same is disclosed. In one embodiment, a thermally conductive layer with anisotropically thermally conductive particles is arranged between the semiconductor chips. The anisotropically thermally conductive particles have a lower thermal conductivity in a direction vertically with respect to the layer or the film than in a direction of the layer or the film.

摘要翻译： 公开了一种具有半导体芯片堆叠的半导体模块及其制造方法。 在一个实施例中，具有各向异性导热颗粒的导热层布置在半导体芯片之间。 各向异性导热颗粒在相对于层或膜垂直的方向上比在层或膜的方向上具有较低的热导率。

公开(公告)号：US07915089B2

公开(公告)日：2011-03-29

申请号：US11733289

申请日：2007-04-10

申请人： Edward Fuergut ,  Irmgard Escher-Poeppel ,  Markus Brunnbauer

发明人： Edward Fuergut ,  Irmgard Escher-Poeppel ,  Markus Brunnbauer

IPC分类号： H01L21/00

CPC分类号： H01L21/568 ,  H01L21/561 ,  H01L24/19 ,  H01L24/96 ,  H01L2224/12105 ,  H01L2924/01006 ,  H01L2924/0103 ,  H01L2924/01068 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00

摘要： A method and apparatus for encapsulating items such as electronic devices. A mold material is dispensed onto the electronic device and the device is situated between first and second molds. One mold is moved towards the other so as to vary the size of a cavity defined by the first and second molds. A vacuum is applied to the cavity and the vacuum is varied in response to the size of the cavity. The vacuum can be varied in response to a predetermined vacuum profile. For example, in certain embodiments the vacuum is varied in response to the position of the first mold relative to the second mold, wherein the vacuum is increased as the cavity height is reduced.

摘要翻译： 一种用于封装诸如电子设备之类的物品的方法和装置。 将模具材料分配到电子设备上，并且该设备位于第一和第二模具之间。 一个模具向另一个移动，以便改变由第一和第二模具限定的空腔的尺寸。 对空腔施加真空，并且响应于空腔的尺寸改变真空。 真空可以响应于预定的真空轮廓而变化。 例如，在某些实施例中，真空响应于第一模具相对于第二模具的位置而变化，其中当空腔高度减小时，真空度增加。

公开(公告)号：US20110024915A1

公开(公告)日：2011-02-03

申请号：US12904628

申请日：2010-10-14

申请人： Markus Brunnbauer ,  Jens Pohl ,  Rainer Steiner

发明人： Markus Brunnbauer ,  Jens Pohl ,  Rainer Steiner

IPC分类号： H01L23/498

CPC分类号： H01L21/561 ,  H01L21/568 ,  H01L23/3128 ,  H01L24/19 ,  H01L24/24 ,  H01L24/82 ,  H01L24/96 ,  H01L24/97 ,  H01L25/105 ,  H01L2224/04105 ,  H01L2224/05001 ,  H01L2224/05026 ,  H01L2224/05548 ,  H01L2224/056 ,  H01L2224/12105 ,  H01L2224/16 ,  H01L2224/97 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15174 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/05099

摘要： A semiconductor device and method is disclosed. In one embodiment, the method includes placing a first semiconductor over an electrically conductive carrier. The first semiconductor is covered with a molding compound. A through hole is formed in the molding compound. A first material is deposited in the through hole.

摘要翻译： 公开了半导体器件和方法。 在一个实施例中，该方法包括将第一半导体放置在导电载体上。 第一半导体被模塑料覆盖。 在模塑料中形成通孔。 第一种材料沉积在通孔中。

公开(公告)号：US07674654B2

公开(公告)日：2010-03-09

申请号：US11756731

申请日：2007-06-01

申请人： Markus Brunnbauer ,  Edward Fuergut ,  Werner Kroeninger

发明人： Markus Brunnbauer ,  Edward Fuergut ,  Werner Kroeninger

IPC分类号： H01L21/461

CPC分类号： H01L21/561 ,  H01L21/56 ,  H01L21/568 ,  H01L23/3107 ,  H01L24/96 ,  H01L2224/73267 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/181 ,  H01L2924/00

摘要： Thin integrated semiconductor devices are produced by being embedded in a molding compound matrix in such a way that a composite is formed. The semiconductor devices are first embedded in the matrix and then thinned after being embedded. The thin integrated semiconductor devices are singulated by forming separating cuts into the molding compound matrix between adjacent devices.

摘要翻译： 通过以形成复合材料的方式嵌入模塑料基质中制造薄的集成半导体器件。 半导体器件首先嵌入矩阵中，然后在嵌入之后变薄。 薄的集成半导体器件通过在相邻器件之间形成分离切割成模塑料基质来分割。

公开(公告)号：US20080254575A1

公开(公告)日：2008-10-16

申请号：US11733289

申请日：2007-04-10

申请人： Edward Fuergut ,  Irmgard Escher-Poeppel ,  Markus Brunnbauer

发明人： Edward Fuergut ,  Irmgard Escher-Poeppel ,  Markus Brunnbauer

IPC分类号： H01L21/00

CPC分类号： H01L21/568 ,  H01L21/561 ,  H01L24/19 ,  H01L24/96 ,  H01L2224/12105 ,  H01L2924/01006 ,  H01L2924/0103 ,  H01L2924/01068 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00

摘要： A method and apparatus for encapsulating items such as electronic devices. A mold material is dispensed onto the electronic device and the device is situated between first and second molds. One mold is moved towards the other so as to vary the size of a cavity defined by the first and second molds. A vacuum is applied to the cavity and the vacuum is varied in response to the size of the cavity. The vacuum can be varied in response to a predetermined vacuum profile. For example, in certain embodiments the vacuum is varied in response to the position of the first mold relative to the second mold, wherein the vacuum is increased as the cavity height is reduced.

摘要翻译： 一种用于封装诸如电子设备之类的物品的方法和装置。 将模具材料分配到电子设备上，并且该设备位于第一和第二模具之间。 一个模具向另一个移动，以便改变由第一和第二模具限定的空腔的尺寸。 对空腔施加真空，并且响应于空腔的尺寸改变真空。 真空可以响应于预定的真空轮廓而变化。 例如，在某些实施例中，真空响应于第一模具相对于第二模具的位置而变化，其中当空腔高度减小时，真空度增加。

公开(公告)号：US07429782B2

公开(公告)日：2008-09-30

申请号：US11476204

申请日：2006-06-28

申请人： Markus Brunnbauer ,  Edward Fuergut

发明人： Markus Brunnbauer ,  Edward Fuergut

IPC分类号： H01L23/02

CPC分类号： H01L25/0657 ,  H01L21/568 ,  H01L25/105 ,  H01L25/50 ,  H01L2225/0652 ,  H01L2225/06524 ,  H01L2225/06527 ,  H01L2225/06551 ,  H01L2225/1035 ,  H01L2225/107 ,  H01L2924/0002 ,  H01L2924/00

摘要： A semiconductor stack block contains either stacked semiconductor chip size semiconductor devices or semiconductor devices with semiconductor chips in a plastic housing composition, the semiconductor chips and the plastic housing composition having a coplanar area. Arranged on the active top side of the semiconductor chips and the plastic housing composition is an areal wiring structure, by which device interconnects are led to an individual edge of the semiconductor devices. The edges with the ends of the device interconnects form the underside of the semiconductor stack block, external contact areas being arranged on the ends of the device interconnects, the external contact areas carrying external contacts.

摘要翻译： 半导体堆叠块包含堆叠的半导体芯片尺寸半导体器件或具有塑料外壳组合物中的半导体芯片的半导体器件，半导体芯片和塑料外壳组合物具有共面区域。 布置在半导体芯片的有源顶侧上，并且塑料外壳组合件是面接线结构，通过该区域布线结构将器件互连引导到半导体器件的单个边缘。 器件端部的边缘互连形成半导体堆叠块的下侧，外部接触区域布置在器件互连的端部，外部接触区域承载外部触点。