摘要:
A method of measuring on-resistance in a backside drain wafer includes providing a wafer having a first MOS transistor and a second MOS transistor each having a source and also sharing a drain provided at a backside of the wafer, and then forming a current flow path passing through the first and second MOS transistors, and then measuring a resistance between the sources of the first and second MOS transistors. Accordingly, an on-resistance in a backside drain wafer can be measured without using a chuck.
摘要:
A semiconductor device is provided including a transistor element on a substrate, a silicide on a gate and a source/drain of the transistor element; and an amorphous capping layer on the silicide.
摘要:
A semiconductor device having an EDMOS transistor and a method for forming the same are provided. The semiconductor device includes source and drain regions formed separately in a semiconductor substrate, a first gate insulating layer filling a trench formed in the substrate between the source and drain regions, the first gate insulating layer being adjacent to the drain region and separated from the source region, a second gate insulating layer formed over the substrate between the first gate insulating layer and the source region, the second gate insulating layer being thinner than the first gate insulating layer, a gate electrode formed over the first and second gate insulating layers, and a doped drift region formed in the substrate under the first gate insulating layer, the doped drift region being in contact with the drain region. This reduces the planar area of the EDMOS transistor, thereby achieving highly integrated semiconductor devices.
摘要:
A test element group for monitoring leakage current in a semiconductor device and a method of manufacturing the same are disclosed. The test element group for monitoring leakage current in a semiconductor device includes device isolation layers formed over a first conductivity type semiconductor substrate. A second conductivity type well may be formed over the first conductivity type semiconductor substrate. First conductivity type impurity regions may be formed in first active areas between the device isolation layers in the second conductivity type well. Monitoring contacts may be formed within the first active areas to monitor leakage current, using layout data such that a distance from each of the monitoring contacts to a border of each of the first active areas is set to have an allowable minimum value under a predetermined design rule. Accordingly, the test element group can monitor leakage current caused by PN junction diodes formed by junction of the impurity regions and the well in the active areas in a semiconductor device or misalignment of contacts, and can accurately monitor micro-leakage current in a semiconductor device during manufacturing.
摘要:
A method of forming a dummy pattern on a mask for fabricating a semiconductor device is disclosed. The method may include a step of calculating a distance in a device isolation area between a first chip area and a second chip area having different pattern densities. In addition, the method may include comparing the distance and a first reference distance. The method may further include forming the dummy pattern in the device isolation area based on the comparison result. The dummy pattern may have a plurality of partitions. Each of the plurality of partitions may have a pattern density according to a position of the partition. A quantity of the partitions may be based on the comparison result. And at least one partition may have a pattern density which is substantially equal to an average of the pattern densities of the first and the second chip areas.
摘要:
A miniaturized system on a chip that incorporates a positive high voltage charge pump and a negative high voltage charge pump into one pump circuit and shares components. A voltage control apparatus in a semiconductor device may include at least one of the following: First and second input/output units capable of inputting or outputting voltage. A voltage booster that receives and boosts a voltage from one of the first and second input/output unit and outputs the boosted voltage from the other input/output unit. An output selector that receives the boosted voltage from the voltage booster and selects one of the positive or the negative voltage to output. An output controller that receives the boosted voltage from the voltage booster and controls and/or regulates the output voltage. An output unit that outputs the generated output voltage.
摘要:
A flash memory device may include a first insulating layer on a base insulating layer on a substrate, a lower wire layer that fills a trench in the first insulating layer, a first insulating interlayer and a second insulating layer stacked in sequence on the first insulating layer and the lower wire layer, a middle wire layer that fills a trench in the second insulating layer, and a second insulating interlayer and an upper wire layer stacked in sequence on the middle wire layer, wherein the lower wire layer. The middle wire layer and the upper wire layer may be electrically connected to each other and the first insulating layer may include a low-k layer in contact with the base insulating layer. In addition, each of the first insulating interlayer, the second insulating layer, and the second insulating interlayer may include an FSG layer.
摘要:
Disclosed is a CMOS image sensor including a gate electrode of a finger type transfer transistor for controlling the saturation state of a floating diffusion region according to the luminance level (i.e. low luminance or high luminance). The CMOS image sensor includes first and second photodiode regions for generating electrons in response to incident light, and a transfer transistor positioned between the first and second photodiodes for receiving the generated electrons transferred from the first and/or second photodiode.
摘要:
A semiconductor device and a method for manufacturing the semiconductor device are provided. The method includes forming a collector region of a second conductivity type in a semiconductor substrate of a first conductivity type; forming a base region of the first conductivity type in the collector region, and forming an emitter region of the second conductivity type into the base region; forming an emitter in the emitter region, and forming a collector in the collector region; and forming a base in the semiconductor substrate through implanting high concentration impurity ions of the first conductive type into the semiconductor substrate.
摘要:
An image sensor formed using a method for manufacturing a planar layer in a process for forming microlenses may be used in a complementary metal oxide semiconductor (CMOS) image sensor. Embodiments provide a planar layer that can improve the operation performance of an image sensor, a manufacturing method thereof, and the image sensor including the planar layer. Embodiments relate to a planar layer located under microlenses, the planar layer including valleys of patterns having a predetermined size, which may eliminate optical cross talk between adjacent pixels.