公开(公告)号：US20080128953A1

公开(公告)日：2008-06-05

申请号：US11984529

申请日：2007-11-19

Applicant: Yusuke Nagai ,  Satoshi Kobayashi ,  Hitoshi Hoshino

Inventor： Yusuke Nagai ,  Satoshi Kobayashi ,  Hitoshi Hoshino

IPC: B29C35/08

CPC classification number: C03B33/074 ,  B23K26/364 ,  B23K26/40 ,  B23K26/53 ,  B23K26/57 ,  B23K2101/40 ,  B23K2103/50 ,  B23K2103/52 ,  C03B33/023 ,  C03B33/102

Abstract: A workpiece dividing method comprising applying a laser beam from one surface side of a workpiece permeable to the laser beam. The laser beam applied from the one surface side of the workpiece is focused onto the other surface of the workpiece or its vicinity to deteriorate a region ranging from the other surface of the workpiece to a predetermined depth. The deterioration of the workpiece is substantially melting and resolidification.

Abstract translation: 一种工件分割方法，包括从可透过激光束的工件的一个表面侧施加激光束。 从工件的一个表面侧施加的激光束聚焦在工件的其他表面或其附近，从而使从工件的另一个表面到预定深度的区域劣化。 工件的劣化基本上是熔化和再凝固。

公开(公告)号：US20060283020A1

公开(公告)日：2006-12-21

申请号：US10571675

申请日：2004-02-26

Applicant: Peter Lisec

Inventor： Peter Lisec

IPC: B26B27/00

CPC classification number: C03B33/074 ,  B24B7/242 ,  C03B33/027 ,  C03B33/10 ,  Y10T83/0385

Abstract: On a carriage of a device for dividing glass sheets into patterns, there are a cutting tool to which a pivoting drive is assigned, and a stripping tool for removing a coating from a glass sheet with a stripping disk. The stripping tool is mounted on the carriage and pivots around an axis perpendicular to the glass sheet. When the tool is being used to strip a glass sheet along the division outline, therefore in the area on either side of scoring lines which have been or are to be produced in a glass sheet, the stripping disk is placed on the surface of the glass sheet and the tool is pivoted around the axis which is normal to the glass sheet using the pivoting drive for the cutting tool in order to correctly align the stripping disk.

Abstract translation: 在用于将玻璃板分割为图案的装置的托架上，存在分配有枢转驱动器的切割工具和用剥离盘从玻璃板上去除涂层的剥离工具。 剥离工具安装在托架上并围绕垂直于玻璃板的轴线枢转。 当工具被用于沿着分割轮廓剥离玻璃板时，因此在已经或将要在玻璃板中生产的刻痕线的任一侧的区域中，剥离盘被放置在玻璃的表面上 使用切割工具的枢转驱动器，工具围绕与玻璃板垂直的轴线枢转，以便正确对准剥离盘。

公开(公告)号：US07080766B2

公开(公告)日：2006-07-25

申请号：US10186448

申请日：2002-07-01

Applicant: John F. McEntee ,  Alexander S. Williamson

Inventor： John F. McEntee ,  Alexander S. Williamson

IPC: B26F3/00 ,  C03B33/02

CPC classification number: C03B33/074 ,  B01J19/0046 ,  B01J2219/00328 ,  B01J2219/00378 ,  B01J2219/00432 ,  B01J2219/00497 ,  B01J2219/00527 ,  B01J2219/00605 ,  B01J2219/00612 ,  B01J2219/00637 ,  B01J2219/00657 ,  B01J2219/00659 ,  B01J2219/00664 ,  B01J2219/00675 ,  B01J2219/00677 ,  B01J2219/00689 ,  B01J2219/00722 ,  B01J2219/00725 ,  B01J2219/00731 ,  B65G49/065 ,  B82Y30/00 ,  C03B33/033 ,  Y10T29/4979 ,  Y10T29/49885 ,  Y10T29/53539 ,  Y10T225/325 ,  Y10T225/379

Abstract: Apparatus and methods are disclosed for cutting a sheet of material into single supports where each of the single supports has an array area to which is bound an array of chemical compounds. The sheet comprises a plurality of score lines. The apparatus comprises an input conveyor, an output conveyor, a driver for moving the sheet from the input conveyor to the output conveyor and a breaking mechanism for breaking the sheet into single supports. The input conveyor, the output conveyor and the driver are each adapted to move the sheet without contacting the array area and an area on a surface of the support opposite the array area. Likewise, the breaking mechanism breaks the sheet into the single supports along the score lines without contacting the array area and an area on a surface of the support opposite the array area.

Abstract translation: 公开了用于将一片材料切割成单个载体的装置和方法，其中每个单一载体具有结合化学化合物阵列的阵列区域。 片材包括多个刻痕线。 该设备包括输入输送机，输出输送机，用于将纸张从输入输送机移动到输出输送机的驱动器，以及用于将纸张分解成单个支撑件的断开机构。 输入输送机，输出输送机和驱动器各自适于移动薄片而不接触阵列区域和与阵列区域相对的支撑体表面上的区域。 类似地，断裂机构将片材沿着划线将片材破坏成单个支撑件，而不接触阵列区域和与阵列区域相对的支撑体表面上的区域。

公开(公告)号：US20050245051A1

公开(公告)日：2005-11-03

申请号：US10509895

申请日：2003-04-01

Applicant: Kazuya Maekawa ,  Hiroshi Soyama

Inventor： Kazuya Maekawa ,  Hiroshi Soyama

IPC: B28D5/00 ,  C03B33/033 ,  C03B33/07 ,  C03B33/10 ,  H01L21/46

CPC classification number: C03B33/10 ,  B28D5/0011 ,  B65G2249/04 ,  C03B33/033 ,  C03B33/074 ,  C03B33/107 ,  Y02P40/57 ,  Y10T83/0333 ,  Y10T83/0385

Abstract: There are provided a scribing step of performing scribing in a state in which a protective material is applied on at least one surface of a brittle material substrate, and a first scribing device that performs this scribing step. Accordingly, it is possible to form a vertical crack that reaches deep inside of the substrate, while effectively removing cullets produced at the time of severing the substrate, thus performing precise severing along a scribe line.

Abstract translation: 提供了在将脆性材料基板的至少一个表面上施加保护材料的状态下进行划线的划线工序，以及进行该划线工序的第一划线装置。 因此，可以形成到底板深处的垂直裂纹，同时有效地去除在切割基板时产生的碎片，从而沿划线执行精确切断。

公开(公告)号：US20040000045A1

公开(公告)日：2004-01-01

申请号：US10186448

申请日：2002-07-01

Inventor： John F. McEntee ,  Alexander S. Williamson

IPC: B05D003/12 ,  A61L002/00 ,  B05D003/00

CPC classification number: C03B33/074 ,  B01J19/0046 ,  B01J2219/00328 ,  B01J2219/00378 ,  B01J2219/00432 ,  B01J2219/00497 ,  B01J2219/00527 ,  B01J2219/00605 ,  B01J2219/00612 ,  B01J2219/00637 ,  B01J2219/00657 ,  B01J2219/00659 ,  B01J2219/00664 ,  B01J2219/00675 ,  B01J2219/00677 ,  B01J2219/00689 ,  B01J2219/00722 ,  B01J2219/00725 ,  B01J2219/00731 ,  B65G49/065 ,  B82Y30/00 ,  C03B33/033 ,  Y10T29/4979 ,  Y10T29/49885 ,  Y10T29/53539 ,  Y10T225/325 ,  Y10T225/379

Abstract: Apparatus and methods are disclosed for cutting a sheet of material into single supports where each of the single supports has an array area to which is bound an array of chemical compounds. The sheet comprises a plurality of score lines. The apparatus comprises an input conveyor, an output conveyor, a driver for moving the sheet from the input conveyor to the output conveyor and a breaking mechanism for breaking the sheet into single supports. The input conveyor, the output conveyor and the driver are each adapted to move the sheet without contacting the array area and an area on a surface of the support opposite the array area. Likewise, the breaking mechanism breaks the sheet into the single supports along the score lines without contacting the array area and an area on a surface of the support opposite the array area.

Abstract translation: 公开了用于将一片材料切割成单个载体的装置和方法，其中每个单一载体具有结合化学化合物阵列的阵列区域。 片材包括多个刻痕线。 该设备包括输入输送机，输出输送机，用于将纸张从输入输送机移动到输出输送机的驱动器，以及用于将纸张分解成单个支撑件的断开机构。 输入输送机，输出输送机和驱动器各自适于移动薄片而不接触阵列区域和与阵列区域相对的支撑体表面上的区域。 类似地，断裂机构将片材沿着划线将片材破坏成单个支撑件，而不接触阵列区域和与阵列区域相对的支撑体表面上的区域。

公开(公告)号：US20020004355A1

公开(公告)日：2002-01-10

申请号：US09885446

申请日：2001-06-21

Inventor： Kazuaki Bando

IPC: B24B049/00

CPC classification number: B24B9/102 ,  C03B33/074 ,  C03C17/002 ,  C03C19/00 ,  C03C23/0075 ,  C03C2218/328 ,  Y02P40/57

Abstract: An apparatus for removing a film layer on a glass plate includes: a supporting base for supporting a glass plate; a pair of removing devices for removing a film layer on the glass plate; a transporting device for transporting the glass plate; and a control unit for defining in a divided manner a region of a film layer to be removed by the pair of removing devices and for causing the pair of removing devices to concurrently effect removal of the film layer on the glass plate in an apportioned manner with respect to divided regions defined in the divided manner.

Abstract translation: 一种用于去除玻璃板上的膜层的设备包括：用于支撑玻璃板的支撑基座; 一对去除玻璃板上的薄膜层的去除装置; 用于运送玻璃板的运送装置; 以及控制单元，用于以划分的方式限定通过所述一对移除装置去除的膜层的区域，并且使得所述一对移除装置同时以分摊方式同时实现玻璃板上的膜层的去除， 尊重以划分方式界定的划分区域。

公开(公告)号：US06191840B1

公开(公告)日：2001-02-20

申请号：US09271317

申请日：1999-03-18

Applicant: Patrick Bon

Inventor： Patrick Bon

IPC: G02F113

CPC classification number: C03B33/076 ,  C03B33/033 ,  C03B33/074 ,  G02F1/133351

Abstract: The invention concerns a manufacturing method for electro-optical or electrochemical photovoltaic cells (10), each cell (10) including front (1) and back (2) substrates bonded to each other by a sealing frame in which an active medium is confined, each frame (12) having, for this purpose, a filling aperture (14), the cell (10) further including contact pads (8) for establishing the electric connection between the electrodes (4, 6) of said cell (10) and an electric supply or control circuit, a method wherein the cells (10) are separated individually by means of a water jet and the rectilinear edges (24) scribed on one of the substrates (1, 2) in order to allow the contact pads (8) of the cells (10) to appear are situated in a location not opposite the filling aperture (14) thereof.

Abstract translation: 本发明涉及一种用于电光或电化学光伏电池（10）的制造方法，每个电池（10）包括通过其中活性介质被限制的密封框架彼此接合的前部（1）和后部（2） 为了这个目的，每个框架（12）具有填充孔（14），所述单元（10）还包括用于建立所述电池（10）的电极（4,6）之间的电连接的接触焊盘（8）和 电源或控制电路，其中通过水射流分开地分离电池（10）的方法和在其中一个基板（1,2）上刻划的直线边缘（24），以便允许接触焊盘（ （10）的位置（8）位于不与其填充孔（14）相对的位置。

公开(公告)号：US20240270623A1

公开(公告)日：2024-08-15

申请号：US18568385

申请日：2022-03-29

Applicant: NITTO DENKO CORPORATION

Inventor： Satoshi Hirata ,  Toshihiro Kanno ,  Takanobu Yano

IPC: C03B33/07 ,  B23K26/38 ,  B23K26/402 ,  C03B33/02 ,  C03B33/033

CPC classification number: C03B33/074 ,  B23K26/38 ,  B23K26/402 ,  C03B33/0222 ,  C03B33/033

Abstract: A method for dividing a composite material 10 in which a brittle material layer 1 and a resin layer 2 are laminated, the method including: a brittle material removing step in which irradiation is performed from a brittle material layer side with a laser beam L1, which is oscillated from an ultrashort pulse laser light source 20, along a scheduled dividing line DL of the composite material to form a scribe groove 11; and a resin removing step in which the resin layer is irradiated with a laser beam L2, which is oscillated from a laser light source 30, along the scheduled dividing line to remove a resin forming the resin layer.

公开(公告)号：US12017943B2

公开(公告)日：2024-06-25

申请号：US17375364

申请日：2021-07-14

Applicant: Schott AG

Inventor： Andreas Ortner ,  Andreas Roters ,  Frank-Thomas Lentes ,  Lutz Parthier ,  Markus Heiss-Chouquet ,  Ulrich Peuchert ,  Fabian Wagner ,  Florian Resch ,  Laura Brückbauer ,  Matthias Jotz ,  Vanessa Gläßer

IPC: C03B33/04 ,  C03B33/02 ,  C03B33/06 ,  C03B33/07 ,  C03B33/08 ,  C03C15/00 ,  C03C23/00 ,  B23K26/0622 ,  B23K103/00 ,  C03B33/023

CPC classification number: C03B33/0222 ,  C03B33/04 ,  C03B33/06 ,  C03B33/074 ,  C03B33/082 ,  C03C15/00 ,  C03C23/0025 ,  B23K26/0622 ,  B23K26/0624 ,  B23K2103/54 ,  C03B33/023

Abstract: A plate-like glass element includes a pair of opposite side faces and an opening having a transverse dimension of at least 200 μm. The opening is delimited by an edge. The edge has a plurality of rounded, substantially hemispherical depressions that adjoin one another. The plurality of rounded, substantially hemispherical depressions having abutting concave roundings which form ridges.

公开(公告)号：US20240076226A1

公开(公告)日：2024-03-07

申请号：US18039532

申请日：2021-12-17

Applicant: Corning Incorporated

Inventor： Dipakbin Qasem Chowdhury ,  EuiHo Kim ,  Euisoo Kim ,  Seong-ryong Ryoo

IPC: C03B33/09 ,  C03B33/07 ,  B23K26/38

CPC classification number: C03B33/091 ,  C03B33/074 ,  B23K26/38

Abstract: Provided is a glass substrate heat chamfering method. An edge of a glass substrate (100) is chamfered by applying thermal shock to the edge of the glass substrate (100), thereby peeling a strip (100a) off from the edge of the glass substrate (100). The strip is cut at a predetermined point thereon before being broken due to the weight thereof. The strip (100a) is cut by applying at least one of heat and a laser beam to the predetermined point or by applying a flame (300a) of a torch (300) to the predetermined point. The application of the thermal shock includes brining a heating element (210) into contact with the edge of the glass substrate (100). In the chamfering, the heating element (210) is relatively moved along the edge of the glass substrate (100) while being brought into contact with the edge of the glass substrate (100).