公开(公告)号：US20050200980A1

公开(公告)日：2005-09-15

申请号：US11071484

申请日：2005-03-03

Applicant: Takayuki Suga

Inventor： Takayuki Suga

IPC: G03B27/50 ,  G02B7/02 ,  G02B27/10 ,  H04N1/028 ,  H04N1/19

CPC classification number: G02B7/023 ,  G02B7/021 ,  H04N1/0249 ,  H04N1/1017 ,  H04N2201/02458 ,  H04N2201/02472 ,  H04N2201/02483 ,  H04N2201/02485

Abstract: An image scanning apparatus that forms an optical image of a document with an image-forming lens onto an image sensor. In order to prevent deterioration in image-forming performance, the image scanning apparatus includes a restricting member for restricting displacement of the image-forming lens in the direction of the optical axis. The restricting member is provided on a supporting member for supporting the image-forming lens and the image sensor.

Abstract translation: 一种图像扫描装置，其将具有图像形成透镜的原稿的光学图像形成到图像传感器上。 为了防止图像形成性能的劣化，图像扫描装置包括用于限制图像形成透镜在光轴方向上的位移的限制构件。 限制构件设置在用于支撑图像形成透镜和图像传感器的支撑构件上。

公开(公告)号：US06870275B2

公开(公告)日：2005-03-22

申请号：US10393973

申请日：2003-03-24

Applicant: Mitsuru Nakajima

Inventor： Mitsuru Nakajima

IPC: H01L21/56 ,  H01L21/58 ,  H01L21/60 ,  H01L23/31 ,  H01L23/367 ,  H04N1/00 ,  H04N1/028 ,  H04N1/03 ,  H04N5/335 ,  H04N5/369 ,  H01L23/52 ,  H01L23/48 ,  H01L29/40

CPC classification number: H01L24/83 ,  H01L21/563 ,  H01L23/315 ,  H01L23/367 ,  H01L24/32 ,  H01L24/81 ,  H01L2224/2919 ,  H01L2224/32014 ,  H01L2224/73253 ,  H01L2224/81801 ,  H01L2224/83194 ,  H01L2224/8385 ,  H01L2224/83951 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/30105 ,  H01L2924/3025 ,  H01L2924/351 ,  H04N1/00885 ,  H04N1/00907 ,  H04N1/00989 ,  H04N1/03 ,  H04N2201/02456 ,  H04N2201/0247 ,  H04N2201/02485 ,  H04N2201/02487 ,  H01L2924/00 ,  H01L2924/3512

Abstract: A semiconductor device includes a semiconductor chip with a functional surface, a substrate opposing the functional surface of the semiconductor chip at a space formed between the substrate and the functional surface, a power supplying device electrically connected to a part of the functional surface of the semiconductor chip and separated by a slight gap from the substrate, a fixing member that fixes the semiconductor chip to the substrate, and a sealing member that seals the space formed between the substrate and the functional surface of the semiconductor chip other than a space formed between the substrate and the functional surface of the semiconductor chip that are fixed to each other through the fixing member and other than the gap formed between the power supplying device and the substrate. The sealing member has greater elasticity than the fixing member.

Abstract translation: 半导体器件包括具有功能表面的半导体芯片，在形成于基板和功能表面之间的空间处与半导体芯片的功能表面相对的基板，与半导体的功能表面的一部分电连接的供电装置 并且与半导体芯片之间形成的空间之外形成的密封部件，该密封部件密封形成在半导体芯片的基板和功能面之间的空间， 基板和通过固定构件彼此固定的除了形成在供电装置和基板之间的间隙之外的半导体芯片的功能表面。 密封构件比固定构件具有更大的弹性。

公开(公告)号：US20040016982A1

公开(公告)日：2004-01-29

申请号：US10393973

申请日：2003-03-24

Inventor： Mitsuru Nakajima

IPC: H01L031/0203 ,  H01L023/495

CPC classification number: H01L24/83 ,  H01L21/563 ,  H01L23/315 ,  H01L23/367 ,  H01L24/32 ,  H01L24/81 ,  H01L2224/2919 ,  H01L2224/32014 ,  H01L2224/73253 ,  H01L2224/81801 ,  H01L2224/83194 ,  H01L2224/8385 ,  H01L2224/83951 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/30105 ,  H01L2924/3025 ,  H01L2924/351 ,  H04N1/00885 ,  H04N1/00907 ,  H04N1/00989 ,  H04N1/03 ,  H04N2201/02456 ,  H04N2201/0247 ,  H04N2201/02485 ,  H04N2201/02487 ,  H01L2924/00 ,  H01L2924/3512

Abstract: A semiconductor device includes a semiconductor chip with a functional surface, a substrate opposing the functional surface of the semiconductor chip at a space formed between the substrate and the functional surface, a power supplying device electrically connected to a part of the functional surface of the semiconductor chip and separated by a slight gap from the substrate, a fixing member that fixes the semiconductor chip to the substrate, and a sealing member that seals the space formed between the substrate and the functional surface of the semiconductor chip other than a space formed between the substrate and the functional surface of the semiconductor chip that are fixed to each other through the fixing member and other than the gap formed between the power supplying device and the substrate. The sealing member has greater elasticity than the fixing member.

Abstract translation: 半导体器件包括具有功能表面的半导体芯片，在形成于基板和功能表面之间的空间处与半导体芯片的功能表面相对的基板，与半导体的功能表面的一部分电连接的供电装置 并且与半导体芯片之间形成的空间之外形成的密封部件，该密封部件密封形成在半导体芯片的基板和功能面之间的空间， 基板和通过固定构件彼此固定的除了形成在供电装置和基板之间的间隙之外的半导体芯片的功能表面。 密封构件比固定构件具有更大的弹性。

公开(公告)号：US20030189827A1

公开(公告)日：2003-10-09

申请号：US10118015

申请日：2002-04-09

Inventor： Jyi-Fang Cheng

IPC: F21S004/00

CPC classification number: H04N1/0287 ,  F21V19/008 ,  H04N1/02815 ,  H04N2201/02462 ,  H04N2201/02474 ,  H04N2201/02485

Abstract: The present invention provides a lamp tube support structure, which comprises a support piece for fixing a lamp tube. The lamp tube support structure comprises a first half and a second half. The first half has a gap. A clamping portion is formed at two extension ends of the gap. A guard ear is annularly disposed at the inner edge of the gap. Grooves are disposed at left and right ends of the second half. A wing portion is formed below the grooves. The wing portion can be jammed into a hole of a rack for supporting the lamp tube after being bent. The wing portion will elastically spring back to be erectly fixed on the rack. When the lamp tube is placed at the gap of the support piece, it will be fixedly supported on the rack.

Abstract translation: 本发明提供了一种灯管支撑结构，其包括用于固定灯管的支撑件。 灯管支撑结构包括前半部和后半部。 上半年有差距。 夹紧部分形成在间隙的两个延伸端。 保护耳环形地设置在间隙的内边缘处。 沟槽位于后半部分的左右两端。 在槽的下方形成翼部。 机翼部分可能被卡在机架的孔中，用于在弯曲之后支撑灯管。 机翼部分将弹性回弹以直立地固定在机架上。 当灯管放置在支撑件的间隙处时，它将被固定地支撑在支架上。

公开(公告)号：US20030012036A1

公开(公告)日：2003-01-16

申请号：US10193026

申请日：2002-07-09

Applicant: Nippon Sheet Glass Co., Ltd.

Inventor： Yoshiyuki Uemura ,  Tomihisa Saito

IPC: F21V007/04

CPC classification number: H04N1/02835 ,  H04N1/02815 ,  H04N1/0282 ,  H04N1/02885 ,  H04N1/0318 ,  H04N1/40056 ,  H04N2201/02462 ,  H04N2201/02485 ,  H04N2201/02495 ,  H04N2201/03112 ,  H04N2201/03158 ,  H04N2201/04767 ,  Y10S362/80

Abstract: A light-emitting unit 20 has a light-emitting unit board 21 made of resin provided with a lead frame 22. The light-emitting unit board 21 is also provided with an open window 21a for mounting a light-emitting device. The lead frame 22 comprises a lead terminal section 22a, an inner lead section 22c, and a light-emitting device mounting and connecting section 22b which is exposed within the open window 21a. The light-emitting devices 23a, 23b, and 23c are bonded with the light-emitting device mounting and connecting section 22b, and electrodes of the light-emitting devices and the lead frame are connected by a metal wire 24, wherein the open window 21a is sealed by transparent resin. The lead frame 22 is made of iron-containing copper to improve heat radiation performance of the light-emitting unit board. By increasing maximum current to be supplied to the light-emitting diodes, it is possible to increase illumination brightness and to attain speedup of image reading.

Abstract translation: 发光单元20具有由设置有引线框架22的树脂制成的发光单元板21.发光单元板21还设置有用于安装发光装置的打开窗口21a。 引线框架22包括引线端子部分22a，内部引线部分22c以及暴露在开放窗口21a内的发光器件安装和连接部分22b。 发光装置23a，23b和23c与发光装置安装和连接部分22b接合，发光装置和引线框架的电极通过金属线24连接，其中打开的窗口21a 被透明树脂密封。 引线框架22由含铁铜制成，以改善发光单元板的散热性能。 通过增加要提供给发光二极管的最大电流，可以增加照明亮度并获得图像读取的加速。

公开(公告)号：US06424434B1

公开(公告)日：2002-07-23

申请号：US09232812

申请日：1999-01-19

Applicant: Toru Uchida

Inventor： Toru Uchida

IPC: H04N104

CPC classification number: H04N1/03 ,  H04N2201/02456 ,  H04N2201/02458 ,  H04N2201/02468 ,  H04N2201/02477 ,  H04N2201/02485

Abstract: Disclosed is an image scanning unit which has: a CCD substrate which is mounted on a block; three groups of adjustment fastening members to position the CCD substrate in three dimensional directions orthogonal to one another; and a springy member to press each of the adjustment fastening members against receiving part of each of the adjustment fastening members; wherein the three groups of adjustment fastening members are of a first group of fastening members to conduct the focus adjustment by independently positioning the CCD substrate in a direction perpendicular to the plane of the CCD substrate at both ends of CCD in the longitudinal direction, a second group of fastening members to conduct the sub-scanning adjustment by independently positioning the CCD substrate in a direction orthogonal to the longitudinal direction of the CCD substrate within the plane of the CCD substrate at both ends of CCD in the longitudinal direction, and a third group of fastening member tot conduct the main-scanning adjustment by independently positioning the CCD substrate in a direction along the longitudinal direction of the CCD substrate within the plane of the CCD substrate.

Abstract translation: 公开了一种图像扫描单元，其具有：安装在块上的CCD基板; 三组调节紧固构件，用于将CCD基板在彼此正交的三维方向上定位; 以及弹性构件，用于将每个所述调节紧固构件按压到每个所述调节紧固构件的部分; 其中所述三组调节紧固件是第一组紧固件，用于通过在CCD纵向方向的两端垂直于CCD基板的平面方向独立地定位CCD基板来进行聚焦调节，第二组 一组紧固构件，通过在CCD基板的纵向方向的两端的CCD基板的平面内在与CCD基板的纵向正交的方向上独立地定位CCD基板，进行副扫描调整，第三组 通过在CCD基板的平面内沿着CCD基板的长度方向独立地定位CCD基板来进行主扫描调整。

公开(公告)号：US06350980B1

公开(公告)日：2002-02-26

申请号：US09385123

申请日：1999-08-27

Applicant: David D. Bohn

Inventor： David D. Bohn

IPC: G01N2186

CPC classification number: H04N1/0312 ,  H04N1/0311 ,  H04N1/0314 ,  H04N1/107 ,  H04N2201/02456 ,  H04N2201/02458 ,  H04N2201/0247 ,  H04N2201/02485 ,  H04N2201/0471 ,  H04N2201/04713 ,  H04N2201/04734

Abstract: An optical imaging assembly comprises a mounting surface and at least one semiconductor die having a face and an edge portion. The edge portion of the at least one semiconductor die is mounted to the mounting surface. A light sensitive optical detector is located on the face of the at least one semiconductor die. An optical system is mounted to the mounting surface adjacent the at least one semiconductor die.

Abstract translation: 光学成像组件包括安装表面和至少一个具有面和边缘部分的半导体管芯。 至少一个半导体管芯的边缘部分安装到安装表面。 光敏光学检测器位于至少一个半导体管芯的表面上。 光学系统安装到邻近至少一个半导体管芯的安装表面。

公开(公告)号：US20180014906A1

公开(公告)日：2018-01-18

申请号：US15541077

申请日：2016-02-01

Applicant: SONY CORPORATION

Inventor： Tetsuharu FUKUSHIMA ,  Wataru KOKUBO ,  Toshimitsu TSUBOI ,  Yohei KURODA ,  Yasuhisa KAMIKAWA

IPC: H04N5/63 ,  G02B21/00 ,  B25J19/00 ,  G02B23/24 ,  G02B21/36 ,  A61B1/00

CPC classification number: A61B90/50 ,  A61B1/00149 ,  A61B1/0016 ,  A61B90/361 ,  A61B2090/508 ,  B25J19/0004 ,  G02B7/001 ,  G02B21/0012 ,  G02B21/36 ,  G02B23/2484 ,  H04N5/63 ,  H04N2201/02485

Abstract: There is provided a medical support arm device including a brake provided in at least one joint of a plurality of joints that define a deployment configuration of a multi-joint arm, and configured to release a rotation shaft of the at least one joint when electricity is supplied to the multi-joint arm and lock the rotation shaft when electricity is not supplied to the multi-joint arm. When electricity is not supplied the brake is configured to exert a brake force that supports a weight of the multi-joint arm to maintain the deployment configuration of the multi-joint arm, but also permits rotation of the rotation shaft by an external manually applied force equal to or larger than a predetermined value

公开(公告)号：US09584691B2

公开(公告)日：2017-02-28

申请号：US15001118

申请日：2016-01-19

Applicant: CANON KABUSHIKI KAISHA

Inventor： Ayumu Murakami

IPC: H04N1/04 ,  H04N1/028 ,  H04N1/00 ,  H04N1/024 ,  F21V8/00

CPC classification number: H04N1/02855 ,  G02B6/0045 ,  G02B6/0073 ,  H04N1/00559 ,  H04N1/0249 ,  H04N1/0281 ,  H04N1/02885 ,  H04N2201/0081 ,  H04N2201/02462 ,  H04N2201/02472 ,  H04N2201/02485

Abstract: A light guide includes a plurality of boss portions. A round hole portion is provided near the center of a base member for fixing the light guide, and slit portions are provided on both ends thereof. The round hole portion supports one boss portion in both the longitudinal direction and the lateral direction of the light guide. The slit portions support boss portions in the lateral direction of the light guide, but are free in the longitudinal direction of the light guide. That is, the center of the light guide is fixed from both directions, and thus both ends of the light guides can expand away in the longitudinal direction. This cuts the influence of expansion by half.

Abstract translation: 导光体包括多个凸起部分。 在用于固定导光体的基底构件的中心附近设置有圆孔部，并且在其两端设置狭缝部。 圆孔部在光导的长度方向和横向方向上支撑一个凸台部。 狭缝部分在导光体的横向方向上支撑凸起部分，但是在光导的纵向上是自由的。 也就是说，导光体的中心从两个方向固定，因此导光体的两端在长度方向上可以膨胀。 这将扩大影响减半。

公开(公告)号：US09253359B2

公开(公告)日：2016-02-02

申请号：US13519353

申请日：2010-11-02

Applicant: Hidehisa Takahashi

Inventor： Hidehisa Takahashi

IPC: H04N1/031 ,  H04N1/028

CPC classification number: H04N1/0318 ,  H04N1/02835 ,  H04N2201/02435 ,  H04N2201/02445 ,  H04N2201/02456 ,  H04N2201/02458 ,  H04N2201/02462 ,  H04N2201/02464 ,  H04N2201/02472 ,  H04N2201/02474 ,  H04N2201/02483 ,  H04N2201/02485 ,  H04N2201/03112 ,  H04N2201/03125 ,  H04N2201/03129 ,  H04N2201/03141 ,  H04N2201/03145

Abstract: A contact image sensor unit includes: a light source (10) illuminating an original; a rod-like light guide (11) guiding light from the light source to the original; an imaging element (12) forming reflected light from the original on a plurality of photoelectric conversion elements; a sensor substrate (14) on which the plurality of photoelectric conversion elements are mounted; a frame (15) to which they are attached and which has a positioning part (200) for attaching the light guide (11) thereto; and a supporting member (16) which attachably/detachably supports the light guide (11) and is attachably/detachably attached to the positioning part (200). Since the light guide (11) can be attached to the frame (15) without using an adhesive, the deformation of the light guide (11), the warpage of the contact image sensor unit and so on can be prevented.

Abstract translation: 接触图像传感器单元包括：照亮原稿的光源（10）; 将来自光源的光引导到原稿的棒状导光体（11） 成像元件（12），其在多个光电转换元件上形成来自原稿的反射光; 传感器基板（14），其上安装有多个光电转换元件; 一个框架（15），它们被安装在该框架（15）上，并具有用于将光导件（11）附接到其上的定位部件（200） 以及可附接/可拆卸地支撑导光体（11）并且可附接/可拆卸地附接到定位部件（200）的支撑构件（16）。 由于可以不使用粘合剂将导光体（11）附接到框架（15），所以可以防止导光体（11）的变形，接触图像传感器单元的翘曲等。