Flat cable and method of manufacturing flat cable

    公开(公告)号:US11244772B2

    公开(公告)日:2022-02-08

    申请号:US16972197

    申请日:2019-06-25

    Abstract: A flat cable includes: a plurality of conductors arranged in parallel; an insulating layer formed, on first surfaces of the plurality of conductors and on second surfaces that are opposite surfaces of the first surfaces, along the plurality of conductors; an exposed portion where the first surfaces at end portions of the conductors are exposed to outside; and a reinforcement plate formed on the second surfaces opposite to the exposed portion. On the second surfaces opposite to the exposed portion, the reinforcement plate is directly formed on the conductors, and on the second surfaces opposite to the first surfaces that are in continuous with the exposed portion, the reinforcement plate is formed between the conductors and the insulating layer on the second surfaces.

    PATTERNED NANOPARTICLE STRUCTURES
    96.
    发明申请

    公开(公告)号:US20220013247A1

    公开(公告)日:2022-01-13

    申请号:US17485281

    申请日:2021-09-24

    Abstract: Aspects relate to patterned nanostructures having a feature size not including film thickness of below 5 microns. The patterned nanostructures are made up of nanoparticles having an average particle size of less than 100 nm. A nanoparticle composition, which, in some cases, includes a binder, is applied to a substrate. A patterned mold used in concert with electromagnetic radiation function to manipulate the nanoparticle composition in forming the patterned nanostructure. In some embodiments, the patterned mold nanoimprints a pattern onto the nanoparticle composition and the composition is cured through UV or thermal energy, Three-dimensional patterned nanostructures may be formed. A number of patterned nanostructure layers may be prepared and joined together. In some cases, a patterned nanostructure may be formed as a layer that is releasable from the substrate upon which it is initially formed. Such releasable layers may be arranged to form a three-dimensional patterned nanostructure for suitable applications.

    TRANSFER FILM FOR SILVER CONDUCTIVE MATERIAL PROTECTIVE FILM, MANUFACTURING METHOD OF PATTERNED SILVER CONDUCTIVE MATERIAL, LAMINATE, AND TOUCH PANEL

    公开(公告)号:US20220004102A1

    公开(公告)日:2022-01-06

    申请号:US17480157

    申请日:2021-09-21

    Abstract: Provided are a transfer film for a silver conductive material protective film, including a temporary support, and a photosensitive layer which is provided on the temporary support, and includes at least one selected from the group consisting of a binder polymer and a polymerizable compound, and a photopolymerization initiator, in which an amount of free chloride ions included in the photosensitive layer is 20 ppm or less, and a mass content average value of C log P values in all the binder polymer and polymerizable compound included in the photosensitive layer is 2.75 or more; a manufacturing method of a patterned silver conductive material using the transfer film for a silver conductive material protective film; a laminate including, in the following order, a substrate, a silver conductive material, and a cured resin layer, in which an amount of free chloride ions included in the cured resin layer is 20 ppm or less, and a C log P value of a cured resin component included in the cured resin layer is 2.75 or more; and a touch panel.

    Superconducting Cable Joint and Related Techniques

    公开(公告)号:US20210375507A1

    公开(公告)日:2021-12-02

    申请号:US17333311

    申请日:2021-05-28

    Abstract: An electrical joint includes a conductive member having a first mounting region configured to connect to a first conductor and a second mounting region configured to connect to a second conductor, wherein the first conductor comprises a cable and a superconducting material within the conductive member and configured to conduct a current between the first and second mounting regions. Also described is a method of forming an electrical joint, comprising forming a conductive member having a first mounting region configured to connect to a first conductor and a second mounting region configured to connect to a second conductor, wherein the first conductor comprises a cable and a superconducting material within the conductive member and configured to conduct a current between the first and second mounting regions.

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