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公开(公告)号：US11429022B2
公开(公告)日：2022-08-30
申请号：US16661461
申请日：2019-10-23
摘要： Systems and methods for shaping a film. Formable material in an imprint field on the substrate may be contacted with a shaping surface of a template. Outer boundaries of the imprint field correspond to outer boundaries of the shaping surface. Shaping the film includes forming a cured layer within the imprint field while the shaping surface is in contact with the formable material. Shaping the film may include separating the shaping surface from the cured layer. Shaping the film may include moving the template away from the imprint field to a first offset location wherein the outer boundaries of the shaping surface are offset relative to the outer boundaries of the imprint field. Shaping the film may include curing a second portion of the formable material while the template is at the first offset location so as to form the shaped film.
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公开(公告)号：US11426906B2
公开(公告)日：2022-08-30
申请号：US16413488
申请日：2019-05-15
发明人： Naoki Murasato , Ken Minoda
IPC分类号： B29C43/56 , G03F7/00 , G03F9/00 , B29C59/02 , H01L21/027
摘要： An imprint apparatus cures an imprint material by irradiating the imprint material with light while the imprint material on a substrate is in contact with a pattern region of a mold. The imprint apparatus includes a first supply unit configured to supply a first gas to a gap between the substrate and the mold, the first gas accelerating filling of recessed portions of the pattern region with the imprint material, and a second supply unit configured to supply a second gas to the gap, the second gas inhibiting curing of the imprint material.
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公开(公告)号：US20220269187A1
公开(公告)日：2022-08-25
申请号：US17587137
申请日：2022-01-28
发明人： Atsushi Shigenobu
IPC分类号： G03F9/00
摘要： The preset invention provides a method of obtaining an array of a plurality of regions on a substrate, including obtaining, using a prior distribution representing a probability distribution of parameters of a regression model used to estimate the array, a first posterior distribution representing the probability distribution of the parameters, obtaining, using the first posterior distribution as the prior distribution representing the probability distribution of the parameters, a second posterior distribution representing the probability distribution of the parameters, and updating the regression model by deciding the parameters based on the second posterior distribution and obtaining, using the updated regression model, the array of the plurality of regions on a substrate from the second position measurement data.
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94.发明授权公开(公告)号：US11413651B2
公开(公告)日：2022-08-16
申请号：US15459023
申请日：2017-03-15
发明人： Yoshihiro Shiode
摘要： An imprint apparatus performs an imprint process of forming a pattern on a substrate by bringing a mold into contact with an imprint material on the substrate and curing the imprint material. The apparatus includes a substrate stage mechanism having a substrate chuck configured to hold the substrate, a mold driver configured to drive the mold, and a controller configured to control, based on tilt information indicating a tilt of the substrate chuck which is caused by a force received from the mold driver, the mold driver so as to adjust a relative tilt of the mold with respect to the substrate in the imprint process.
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公开(公告)号：US20220221803A1
公开(公告)日：2022-07-14
申请号：US17472790
申请日：2021-09-13
发明人： Young Sang HA
IPC分类号： G03F9/00 , H01L23/544 , H01L27/12 , H01L33/58
摘要： A display device includes: an optical member including a plurality of lenses and a first alignment mark disposed to overlap at least one lens of the plurality of lenses; and a display panel including a plurality of subpixels and a second alignment mark disposed between the plurality of subpixels and overlapping the first alignment mark, wherein each of the first alignment mark and the second alignment mark includes a magnetic substance.
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公开(公告)号：US11374118B2
公开(公告)日：2022-06-28
申请号：US16936352
申请日：2020-07-22
申请人： Monolithic 3D Inc.
发明人： Zvi Or-Bach , Deepak C. Sekar , Brian Cronquist , Zeev Wurman
IPC分类号： H01L27/06 , G03F9/00 , H01L21/762 , H01L21/84 , H01L23/48 , H01L23/544 , H01L27/02 , H01L27/105 , H01L27/108 , H01L27/11 , H01L27/112 , H01L27/11551 , H01L27/11578 , H01L27/118 , H01L27/12 , H01L29/66 , H01L29/45 , H01L29/786 , H01L27/092 , H01L21/8238 , H01L29/732 , H01L29/808 , H01L21/768 , H01L21/822 , H01L23/367 , H01L23/522 , H01L23/528 , H01L23/532 , H01L23/00 , H01L21/268 , H01L27/088
摘要： A method to form a 3D integrated circuit, the method including: providing a first wafer including a first crystalline substrate, a plurality of first transistors, and first copper interconnecting layers, where the first copper interconnecting layers at least interconnect the plurality of first transistors; providing a second wafer including a second crystalline substrate, a plurality of second transistors, and second copper interconnecting layers, where the second copper interconnecting layers at least interconnect the plurality of second transistors; and then performing a face-to-face bonding of the second wafer on top of the first wafer, where the face-to-face bonding includes copper to copper bonding; and thinning the second crystalline substrate to a thickness of less than 5 micro-meters.
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公开(公告)号：US11372343B2
公开(公告)日：2022-06-28
申请号：US17435115
申请日：2020-02-14
发明人： Henricus Martinus Johannes Van De Groes , Johannes Hubertus Antonius Van De Rijdt , Marcel Pieter Jacobus Peeters , Chien-Hung Tseng , Henricus Petrus Maria Pellemans
IPC分类号： G03F9/00
摘要： A method of aligning a substrate within an apparatus. The method includes determining a substrate grid based on measurements of a plurality of targets, each at different locations on a substrate. The determining includes repetitions of updating the substrate grid after each measurement of a target, and using the updated grid to align a measurement of a subsequent target.
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公开(公告)号：US11372338B2
公开(公告)日：2022-06-28
申请号：US16979056
申请日：2019-02-13
发明人： Ivo Matteo Leonardus Weijden , Jeroen Van Dongen , Cornelis Johannes Henricus Lambregts , Theo Wilhelmus Maria Thijssen , Ruud Rudolphus Johannes Catharinus De Wit , Hans Marinus Struijs , Erik Mathijs Maria Crombag , Roy Werkman , Maria Helena Schut , Erwin Riemens , Menno Meeldijk
摘要： A method for determining a preferred control strategy relating to control of a manufacturing process for manufacturing an integrated circuit. The method includes: obtaining process data associated with a design of said integrated circuit; and obtaining a plurality of candidate control strategies configured to control the manufacturing process based on the process data, each candidate control strategy including an associated cost metric based on an associated requirement to implement the candidate control strategy. A quality metric related to an expected performance of the manufacturing process is determined for each candidate control strategies, and a preferred control strategy is selected based on the determined quality metrics and associated cost metrics for each candidate control strategy.
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公开(公告)号：US20220137523A1
公开(公告)日：2022-05-05
申请号：US17432019
申请日：2020-02-06
申请人： ASML Holding N.V.
发明人： Joshua ADAMS , Yuxiang LIN , Krishanu SHOME , Gerrit Johannes NIJMEIJER , Igor Matheus Petronella AARTS
IPC分类号： G03F9/00
摘要： An alignment method includes directing an illumination beam with a first polarization state to form a diffracted beam with a second polarization state from an alignment target, and passing the diffracted beam through a polarization analyzer. The alignment method further includes measuring a polarization state of the diffracted beam and determining a location of the alignment target from the measured polarization state relative to its initial polarization state. The alignment target includes a plurality of diffraction gratings with a single pitch and two or more duty cycles, wherein the pitch is smaller than a wavelength of the illumination beam, and the location of the alignment target corresponds to the duty cycle of the diffraction grating.
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公开(公告)号：US11320745B2
公开(公告)日：2022-05-03
申请号：US17012705
申请日：2020-09-04
发明人： Maurits Van Der Schaar , Arie Jeffrey Den Boef , Omer Abubaker Omer Adam , Te-Chih Huang , Youping Zhang
摘要： There is disclosed a method of measuring a process parameter for a manufacturing process involving lithography. In a disclosed arrangement the method comprises performing first and second measurements of overlay error in a region on a substrate, and obtaining a measure of the process parameter based on the first and second measurements of overlay error. The first measurement of overlay error is designed to be more sensitive to a perturbation in the process parameter than the second measurement of overlay error by a known amount.
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