Device manufacturing method
    2.
    发明授权

    公开(公告)号:US11709434B2

    公开(公告)日:2023-07-25

    申请号:US17633781

    申请日:2020-07-14

    IPC分类号: G03F7/20 G03F7/00

    CPC分类号: G03F7/70633 G03F7/70641

    摘要: A device manufacturing method including: performing a first exposure on a substrate using a first lithographic apparatus to form a first patterned layer including first features; processing the substrate to transfer the first features into the substrate; and performing a second exposure on the substrate using a second lithographic apparatus to form a second patterned layer including second features, wherein: the first lithographic apparatus has first and second control inputs effective to control first and second parameters of the first features at least partly independently; the second lithographic apparatus has a third control input effective to control the first and second parameters of the second features together; and the first exposure is performed with the first and/or second control input set to pre-bias the first and/or second parameter.