公开(公告)号：US20230340298A1

公开(公告)日：2023-10-26

申请号：US18344635

申请日：2023-06-29

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chen-Ming Kuo ,  Jing Ruei Lu ,  Pei-Haw Tsao

IPC: C09J5/00 ,  H01L21/683 ,  C09J7/38 ,  C09J7/20 ,  H01L21/673

CPC classification number: C09J5/00 ,  H01L21/6836 ,  C09J7/381 ,  C09J7/20 ,  H01L21/67333 ,  C09J2427/00 ,  C09J2203/326 ,  C09J2301/416 ,  C09J2301/502 ,  H05K13/0084

Abstract: The current disclosure describes carrier tape systems, which include a carrier tape including a plurality of pockets. Each pocket contains a semiconductor device adhered to a bottom surface of the pocket by an adhesive. In some embodiments, the adhesive is a reversible adhesive. Use of the adhesive reduces the likelihood the semiconductor device will be damaged due to movement of the semiconductor device in the pocket during shipment of the carrier tape. Methods of forming a semiconductor device carrier systems and methods of supplying semiconductor devices are also described.

公开(公告)号：US11798829B2

公开(公告)日：2023-10-24

申请号：US17207182

申请日：2021-03-19

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yoon Su Kim

IPC: H01L21/673 ,  B65G1/14

CPC classification number: H01L21/67309 ,  B65G1/14 ,  H01L21/6732 ,  H01L21/67303

Abstract: A cassette which receives a substrate, and a substrate receiving system including a chamber which receives a cassette in which a substrate is loaded are provided. The cassette which receives a substrate includes: a plurality of slot supports stacked in a first direction; and a frame connected to the plurality of slot supports and extending in the first direction, wherein the plurality of slot supports and the frame are opened in an outward direction to receive the substrate, and are closed in an inward direction after the substrate is received.

公开(公告)号：US11787621B2

公开(公告)日：2023-10-17

申请号：US16903337

申请日：2020-06-16

Applicant: GUDENG PRECISION INDUSTRIAL CO., LTD.

Inventor： Ming-Chien Chiu ,  Jain-Ping Sheng

IPC: H01L21/67 ,  B65D85/48 ,  H01L21/673 ,  G03F1/66 ,  G03F7/00

CPC classification number: B65D85/48 ,  G03F1/66 ,  G03F7/70741 ,  H01L21/67359

Abstract: The invention provides a reticle pod, in particular the reticle pod with wear parts. The reticle pod is a large-size reticle pod and includes a vertical accommodation space for accommodating reticles. The reticle pod mainly includes a cover and a box. The box is used to combine with the cover to form an internal space in order to accommodate reticles. Guiding members are disposed outside the box, and the guiding members can help guide the relative position of the box and the cover. The contact surfaces of the box contacting the upright reticles are disposed with at least two slots, and each of the slot is configured with at least one wear part. The wear part module further includes a first wear part disposed on the upper portion of the slot and a second wear part disposed on the lower portion of the slot.

公开(公告)号：US11784072B2

公开(公告)日：2023-10-10

申请号：US16958073

申请日：2019-10-04

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Michael Wayne Cumbie ,  Paul David Schweitzer ,  Anthony Donald Studer ,  Gary Gerard Lutnesky ,  John Edward Davis

IPC: H01L21/673 ,  B41J2/16

CPC classification number: H01L21/67356 ,  B41J2/1637

Abstract: Examples of molded substrates are described herein. In some examples, a molded substrate may support integrated circuitry. In some examples, the molded substrate and the integrated circuitry are included in a circuitry package for a replaceable print component. In some examples, the molded substrate is relatively flat. In some examples, molding remnants may be on the molded substrate.

公开(公告)号：US11784070B2

公开(公告)日：2023-10-10

申请号：US16852475

申请日：2020-04-18

Applicant: Tokyo Electron Limited

Inventor： Yasuaki Kikuchi ,  Tatsuya Yamaguchi ,  Kazuteru Obara ,  Ryuji Kusajima

IPC: H01L21/67 ,  C23C16/46 ,  C23C16/34 ,  C23C16/52 ,  H01L21/02 ,  H01L21/673

CPC classification number: H01L21/67248 ,  C23C16/345 ,  C23C16/46 ,  C23C16/52 ,  H01L21/0217 ,  H01L21/0228 ,  H01L21/02269 ,  H01L21/67109 ,  H01L21/67303

Abstract: A heat treatment apparatus includes: an inner tube having a cylindrical shape and configured to accommodate a substrate; an outer tube configured to cover an outside of the inner tube; a heater provided around the outer tube; a gas supply pipe that extends along a longitudinal direction in the inner tube; an opening formed in a side wall of the inner tube facing the gas supply pipe; a temperature sensor provided at a position shifted by a predetermined angle from the opening in a circumferential direction of the inner tube; and a controller that controls the heater based on a detected value of the temperature sensor.

公开(公告)号：US20230307275A1

公开(公告)日：2023-09-28

申请号：US18125604

申请日：2023-03-23

Applicant: ENTEGRIS, INC.

Inventor： Matthew A. Fuller ,  Wei Sheng Hsu ,  Kobold Yang ,  Colton J. Harr

IPC: H01L21/673

CPC classification number: H01L21/67393 ,  H01L21/67376

Abstract: A purge port assembly for a wafer container includes a purge module configured to allow inlet flow of purge gas and a transition portion disposed over an intermediate outlet of the purge module. The transition portion includes a receiver configured to receive the purge gas discharged from the purge module, an outlet connector configured to attach with a diffuser, and an intermediate conduit. The intermediate conduit connects the receiver to the outlet connector and extends from the receiver at an acute angle relative to an axis of the inlet opening of the receiver. The intermediate conduit has a length that spaces apart the outlet connector from the receiver. A wafer container includes a shell and a purge port assembly. The shell includes an interior space. The purge port assembly extends through an opening in the shell into the interior space.

公开(公告)号：US20230302589A1

公开(公告)日：2023-09-28

申请号：US18199633

申请日：2023-05-19

Applicant: Taiwan Semiconductor Manufacturing Company

Inventor： Yu-Chen Chen ,  Chih-Hung Huang ,  Cheng-Lung Wu ,  Yang-Ann Chu ,  Jiun-Rong Pai

IPC: B23P19/06 ,  B25J15/00 ,  B25B23/10 ,  H01L21/673

CPC classification number: B23P19/06 ,  B25B23/10 ,  B25J15/0019 ,  H01L21/6732 ,  Y10T29/49819

Abstract: The present disclosure relates to systems and methods for affixing and/or removing a fastener from a wafer-carrying pod. The system includes a robotic arm with a screw tool assembly disposed at the far end of the robotic arm. The screw tool assembly includes a lower sleeve configured to receive a fastener. A screwdriver is disposed within an upper sleeve of the screw tool assembly, and a motor is provided to rotate the screwdriver. In use, the screw tool assembly is positioned over the fastener so the lower sleeve surrounds the fastener and the screwdriver engages the fastener. The screwdriver unscrews the fastener from the pod, and the fastener head is received within the lower sleeve.

公开(公告)号：US11764090B2

公开(公告)日：2023-09-19

申请号：US17690121

申请日：2022-03-09

Applicant: CHIPBOND TECHNOLOGY CORPORATION

Inventor： Hsu-Chi Lee ,  Pi-Yu Peng ,  Chun-Te Lee

IPC: H01L21/673

CPC classification number: H01L21/67333

Abstract: A tray includes a body for placement of a component (e.g. electronic component) and a taker disposed on a bottom surface of the body. The taker is used to take a spacer and includes a first taking element and a second taking element. The first taking element includes a first connection portion and a first confinement portion, and the second taking element includes a second connection portion and a second confinement portion. An accommodation space is provided between the first and second connection portions and a passageway is provided between the first and second confinement portions. While the spacer is moved through the passageway and into the accommodation space, it is confined in the accommodation space by the first and second confinement portions such that the taker can take away the spacer to show another tray located under the spacer as the tray is removed.

公开(公告)号：US20230290661A1

公开(公告)日：2023-09-14

申请号：US17692247

申请日：2022-03-11

Applicant: Intel Corporation

Inventor： Kyle ARRINGTON ,  Kirk WHEELER ,  Emily SCHUBERT ,  Dingying XU ,  Bassam ZIADEH

IPC: H01L21/673

CPC classification number: H01L21/67336 ,  H01L21/67356 ,  H01L21/67366 ,  H01L21/67369 ,  H01L21/67386 ,  H01L21/67396

Abstract: The present disclosure relates to a tray assembly. The tray assembly may include a die transport tray. The die transport tray may include an inner bottom surface for accommodating a plurality of dies. The tray assembly may further include a lid. The lid may include an inner top surface, wherein the inner top surface of the lid may face the inner bottom surface of the die transport tray when the lid is assembled over the die transport tray. The lid may further include a shock absorbing material on the inner top surface for contacting the plurality of dies, if present.

公开(公告)号：US11756813B2

公开(公告)日：2023-09-12

申请号：US17476890

申请日：2021-09-16

Applicant: SEMES CO., LTD.

Inventor： Yong Seok Jang ,  In Kyu Park

IPC: H01L21/677 ,  H01L21/67 ,  H01L21/68 ,  H01L21/673

CPC classification number: H01L21/67201 ,  H01L21/67115 ,  H01L21/67265 ,  H01L21/67389 ,  H01L21/67745 ,  H01L21/68

Abstract: Disclosed is a substrate treating apparatus. The substrate treating apparatus includes an index unit including a load pot, in which a container is seated, and an index chamber connected to the load pot, and a process executing unit having a load lock chamber connected to the index chamber and a process chamber that treats a substrate transferred to the load lock chamber, the index unit further includes an alignment unit provided in the index chamber and that aligns a substrate type sensor transferred to the process chamber.