摘要:
A method of determining geometric parameters of a wafer (16) is disclosed. For this purpose, the wafer (16) is inserted in a wafer holder (30). The wafer holder (30) is equipped with at least three mechanical contacting elements (22). The wafer is in mechanical contact with the contacting elements (22). The contacting elements (22) are distributed on the wafer holder (30) in such a way that they define a geometric figure which is configured such that the center point (40) of the wafer (16) comes to lie within the geometric figure. The position of each contacting element (22) is determined. Each desired geometric parameter of the wafer (16) is then calculated from the position of the contacting elements (22).
摘要:
A method for acquiring high-resolution images of defects on the upper surface of the wafer edge is disclosed. For this purpose, first the position of at least one defect on the upper surface of the wafer edge is determined. The thus determined position of the defect is stored. Then the wafer is transferred into device for micro-inspection, in which the defect is examined more closely and imaged. The images acquired in the device for micro-inspection are deposited in a directory.
摘要:
A method is disclosed for eliminating sources of error in the system correction of a coordinate measuring machine. Herein, a number j of reference structures 33 on a rigid reference object 30 are measured in a starting orientation k=0, and the starting coordinates and the reference coordinates of the reference structures 33 on the reference object 30 are determined in a number k>3 of mutually different orientations.
摘要:
Device for measuring the position of a structure on an object 30 with at least one laser interferometer system 29 to determine a positional displacement of the object 30 in at least one spatial direction, whereby the object is placed on a stage which is translatable in the X and Y coordinate direction An illumination device is provided, which illuminates the structures to be measured. The structure is imaged on a detector 34 via a high-resolution microscope optics in incident light and/or transmitted light in the near UV spectral range. The illumination device is an excimer laser, a frequency multiplied solid-state or gas laser, or an excimer lamp.
摘要:
A method and an apparatus for inspecting a surface of a wafer disclosed. At least one incident-light illuminator is provided to illuminate an area of the surface of the wafer in a first and a second illumination mode, in particular a bright-field and a dark-field illumination. At least one image detector is provided to detect an image of the illuminated area. A storage device is used for storing values on the intensity and the color of an optimized illumination of each incident-light illumination mode.
摘要:
A method is disclosed for selecting a minimum of one wavelength 320 or a minimum of one wavelength range 206 of electromagnetic radiation to be used for object testing, whereby a first spectrum is captured or calculated on a first point of a first object 509, a second spectrum is captured or calculated on a second point of the first 509 or a second object, a difference spectrum is formed from the first and the second spectrum, and the minimum of one wavelength 320 or minimum of one wavelength range 26 is selected in the difference spectrum according to predetermined criteria; as well as a microscope 500 with means of the illumination 502, capture 503, and analysis 504, whereby the illumination means illuminate an object 509, and the capture means capture a first spectrum on a first point on a first object, the capture means capture a second spectrum on a second point of the first or on a second object, and the analysis means form a difference spectrum as a difference between the first and the second spectrum. The disclosed invention enables selection of an optimally suited wavelength for object testing.
摘要:
A wafer handling device (10) comprises at least one tool component (12), a base rack (22) and a robot (20) for moving the wafers (14). In order to improve the accessibility of a wafer handling device (10), the robot (20) is mounted on a coupling rack (26) and with this coupling rack (26) is mounted on the base rack (22) independently of the tool component (12).
摘要:
The invention concerns an apparatus and a method for inspection of a wafer.The apparatus encompasses at least one stroboscopic incident-light illumination device for emitting a pulsed illuminating light beam onto a surface of the wafer and for illuminating a region on the surface of the wafer; and having [sic] at least one image acquisition device for acquiring an image of the respectively illuminated region on the surface of the wafer. The apparatus is characterized, according to the present invention, in that by at least one photodetection device for sensing light of the respective illuminating light beam, and a control device for controlling an image acquisition operation on the basis of the light sensed by the photodetection device, are provided.Intensity fluctuations of the light flashes of the incident-light illumination device are compensated for either by normalizing image data of the illuminated region or by controlling the duration of the light flashes.
摘要:
A method for automatically providing data for the focus monitoring of a lithographic exposure process is disclosed. Firstly, the file for a wafer is generated, which holds at least the information of the size of the wafer, the position of a plurality of measurement pattern, the order in which the measurement patterns are captured and registered, and the alignment of the measurement pattern. Secondly, this information is stored in a master grid. Thirdly, images are acquired of the pattern of each position stored in the master grid of the generated file, wherein the image acquisition is carried out according to the order as stored. Finally, names are assigned to the acquired images.
摘要:
A device (1) is disclosed for inspecting, measuring defined structures, simulating structures and structural defects, repair of and to structures, and post-inspecting defined object sites on a microscopic component (2) with an immersion objective (8a). The device (1) comprises a stage that is movable in the x-coordinate direction and in the y-coordinate direction and a holder (42) for the microscopic component (2), whereby the holder (42) is placed on the stage (4) with the microscopic component (2) in it. The holder (42) has a reservoir (51a) with immersion or cleaning fluid, respectively. The stage (4) is movable such that the immersion objective (8a) is located directly above the reservoir (51a) and may dip into the fluid with its front-most lens.