Method of determining geometric parameters of a wafer
    101.
    发明申请
    Method of determining geometric parameters of a wafer 审中-公开
    确定晶片几何参数的方法

    公开(公告)号:US20080208523A1

    公开(公告)日:2008-08-28

    申请号:US12072196

    申请日:2008-02-25

    IPC分类号: G01B5/00

    CPC分类号: G01B5/02 G01B5/201

    摘要: A method of determining geometric parameters of a wafer (16) is disclosed. For this purpose, the wafer (16) is inserted in a wafer holder (30). The wafer holder (30) is equipped with at least three mechanical contacting elements (22). The wafer is in mechanical contact with the contacting elements (22). The contacting elements (22) are distributed on the wafer holder (30) in such a way that they define a geometric figure which is configured such that the center point (40) of the wafer (16) comes to lie within the geometric figure. The position of each contacting element (22) is determined. Each desired geometric parameter of the wafer (16) is then calculated from the position of the contacting elements (22).

    摘要翻译: 公开了一种确定晶片(16)的几何参数的方法。 为此,将晶片(16)插入晶片保持器(30)中。 晶片保持器(30)配备有至少三个机械接触元件(22)。 晶片与接触元件(22)机械接触。 接触元件(22)以这样的方式分布在晶片保持器(30)上,使得它们限定几何图形,其被配置为使得晶片(16)的中心点(40)位于几何图形内。 确定每个接触元件(22)的位置。 然后从接触元件(22)的位置计算晶片(16)的每个期望的几何参数。

    Method for acquiring high-resolution images of defects on the upper surface of the wafer edge
    102.
    发明申请
    Method for acquiring high-resolution images of defects on the upper surface of the wafer edge 有权
    用于在晶片边缘的上表面上获取缺陷的高分辨率图像的方法

    公开(公告)号:US20080204738A1

    公开(公告)日:2008-08-28

    申请号:US12072156

    申请日:2008-02-25

    IPC分类号: G01N21/95

    CPC分类号: G01N21/9503 H01L21/67288

    摘要: A method for acquiring high-resolution images of defects on the upper surface of the wafer edge is disclosed. For this purpose, first the position of at least one defect on the upper surface of the wafer edge is determined. The thus determined position of the defect is stored. Then the wafer is transferred into device for micro-inspection, in which the defect is examined more closely and imaged. The images acquired in the device for micro-inspection are deposited in a directory.

    摘要翻译: 公开了一种用于在晶片边缘的上表面上获取缺陷的高分辨率图像的方法。 为此,首先确定晶片边缘的上表面上的至少一个缺陷的位置。 存储这样确定的缺陷位置。 然后将晶片转移到用于微观检查的装置中,其中更仔细地检查缺陷并成像。 在微检查装置中获取的图像存放在目录中。

    METHOD FOR ELIMINATING SOURCES OF ERROR IN THE SYSTEM CORRECTION OF A COORDINATE MEASURING MACHINE
    103.
    发明申请
    METHOD FOR ELIMINATING SOURCES OF ERROR IN THE SYSTEM CORRECTION OF A COORDINATE MEASURING MACHINE 有权
    在坐标测量机系统校正中消除误差源的方法

    公开(公告)号:US20080201971A1

    公开(公告)日:2008-08-28

    申请号:US12023230

    申请日:2008-01-31

    IPC分类号: G01B5/004

    CPC分类号: G01B11/03 G01B21/045

    摘要: A method is disclosed for eliminating sources of error in the system correction of a coordinate measuring machine. Herein, a number j of reference structures 33 on a rigid reference object 30 are measured in a starting orientation k=0, and the starting coordinates and the reference coordinates of the reference structures 33 on the reference object 30 are determined in a number k>3 of mutually different orientations.

    摘要翻译: 公开了一种用于消除坐标测量机的系统校正中的误差源的方法。 这里,以起始方位k = 0测量刚性参考对象30上的参考结构33的数量j,并且以参考对象30的参考对象30的参考对象30的参考结构33的起始坐标和参考坐标确定参考结构33的数量k> 3相互不同的方向。

    Device for Determining the Position of at Least One Structure on an Object, Use of an Illumination Apparatus with the Device and Use of Protective Gas with the Device
    104.
    发明申请
    Device for Determining the Position of at Least One Structure on an Object, Use of an Illumination Apparatus with the Device and Use of Protective Gas with the Device 有权
    用于确定物体上的至少一个结构的位置的装置,使用装置的照明装置和使用装置的保护气体

    公开(公告)号:US20080192264A1

    公开(公告)日:2008-08-14

    申请号:US12015437

    申请日:2008-01-16

    申请人: Michael Heiden

    发明人: Michael Heiden

    IPC分类号: G01B11/14

    摘要: Device for measuring the position of a structure on an object 30 with at least one laser interferometer system 29 to determine a positional displacement of the object 30 in at least one spatial direction, whereby the object is placed on a stage which is translatable in the X and Y coordinate direction An illumination device is provided, which illuminates the structures to be measured. The structure is imaged on a detector 34 via a high-resolution microscope optics in incident light and/or transmitted light in the near UV spectral range. The illumination device is an excimer laser, a frequency multiplied solid-state or gas laser, or an excimer lamp.

    摘要翻译: 用于利用至少一个激光干涉仪系统29测量物体30上的结构的位置的装置,以确定物体30在至少一个空间方向上的位置偏移,由此物体被放置在可在X 和Y坐标方向设置照明装置,其照亮待测量的结构。 该结构通过在近紫外光谱范围内的入射光和/或透射光中的高分辨率显微镜光学器件在检测器34上成像。 照明装置是准分子激光器,倍频固态或气体激光器或准分子灯。

    Method and apparatus for inspecting a surface
    105.
    发明申请
    Method and apparatus for inspecting a surface 有权
    检查表面的方法和装置

    公开(公告)号:US20080174780A1

    公开(公告)日:2008-07-24

    申请号:US12002718

    申请日:2007-12-18

    申请人: Albert Kreh

    发明人: Albert Kreh

    IPC分类号: G01J3/46 G01N21/25

    摘要: A method and an apparatus for inspecting a surface of a wafer disclosed. At least one incident-light illuminator is provided to illuminate an area of the surface of the wafer in a first and a second illumination mode, in particular a bright-field and a dark-field illumination. At least one image detector is provided to detect an image of the illuminated area. A storage device is used for storing values on the intensity and the color of an optimized illumination of each incident-light illumination mode.

    摘要翻译: 一种用于检查公开的晶片的表面的方法和装置。 提供至少一个入射光照明器以在第一和第二照明模式,特别是亮场和暗场照明中照亮晶片表面的区域。 提供至少一个图像检测器以检测照明区域的图像。 存储装置用于存储每个入射光照射模式的优化照明的强度和颜色的值。

    Method for Selecting a Wavelength, and a Microscope
    106.
    发明申请
    Method for Selecting a Wavelength, and a Microscope 审中-公开
    选择波长的方法和显微镜

    公开(公告)号:US20080062510A1

    公开(公告)日:2008-03-13

    申请号:US11759188

    申请日:2007-06-06

    IPC分类号: G02B21/00 G01J3/28

    CPC分类号: G02B21/06 G02B21/16

    摘要: A method is disclosed for selecting a minimum of one wavelength 320 or a minimum of one wavelength range 206 of electromagnetic radiation to be used for object testing, whereby a first spectrum is captured or calculated on a first point of a first object 509, a second spectrum is captured or calculated on a second point of the first 509 or a second object, a difference spectrum is formed from the first and the second spectrum, and the minimum of one wavelength 320 or minimum of one wavelength range 26 is selected in the difference spectrum according to predetermined criteria; as well as a microscope 500 with means of the illumination 502, capture 503, and analysis 504, whereby the illumination means illuminate an object 509, and the capture means capture a first spectrum on a first point on a first object, the capture means capture a second spectrum on a second point of the first or on a second object, and the analysis means form a difference spectrum as a difference between the first and the second spectrum. The disclosed invention enables selection of an optimally suited wavelength for object testing.

    摘要翻译: 公开了一种用于选择要用于对象测试的电磁辐射的一个波长320或最小一个波长范围206的最小值的方法,由此在第一对象509的第一点上捕获或计算第一光谱,第二光谱 在第一个509或第二个物体的第二个点上捕获或计算光谱,从第一和第二光谱形成差分光谱,并且在差异中选择一个波长320或最小值一个波长范围26的最小值 频谱根据预定标准; 以及具有照明502,捕获503和分析504的装置的显微镜500,由此照明装置照射物体509,并且捕获装置在第一物体上的第一点捕获第一光谱,捕获装置捕获 在第一或第二物体的第二点上的第二光谱,并且分析装置形成差光谱作为第一和第二光谱之间的差。 所公开的发明使得能够选择用于对象测试的最适合的波长。

    Wafer handling device
    107.
    发明申请
    Wafer handling device 审中-公开
    晶圆处理装置

    公开(公告)号:US20070298951A1

    公开(公告)日:2007-12-27

    申请号:US11818704

    申请日:2007-06-15

    申请人: Michael Hofmann

    发明人: Michael Hofmann

    IPC分类号: B23Q3/155

    CPC分类号: H01L21/67766 Y10T483/17

    摘要: A wafer handling device (10) comprises at least one tool component (12), a base rack (22) and a robot (20) for moving the wafers (14). In order to improve the accessibility of a wafer handling device (10), the robot (20) is mounted on a coupling rack (26) and with this coupling rack (26) is mounted on the base rack (22) independently of the tool component (12).

    摘要翻译: 晶片处理装置(10)包括用于移动晶片(14)的至少一个工具部件(12),基座架(22)和机器人(20)。 为了提高晶片处理装置(10)的可接近性,机器人(20)安装在联接架(26)上,并且该联接齿条(26)独立于工具安装在基架(22)上 组件(12)。

    Apparatus and method for inspection of a wafer
    108.
    发明授权
    Apparatus and method for inspection of a wafer 有权
    用于检查晶片的装置和方法

    公开(公告)号:US07307713B2

    公开(公告)日:2007-12-11

    申请号:US11011095

    申请日:2004-12-15

    IPC分类号: G01N21/00

    摘要: The invention concerns an apparatus and a method for inspection of a wafer.The apparatus encompasses at least one stroboscopic incident-light illumination device for emitting a pulsed illuminating light beam onto a surface of the wafer and for illuminating a region on the surface of the wafer; and having [sic] at least one image acquisition device for acquiring an image of the respectively illuminated region on the surface of the wafer. The apparatus is characterized, according to the present invention, in that by at least one photodetection device for sensing light of the respective illuminating light beam, and a control device for controlling an image acquisition operation on the basis of the light sensed by the photodetection device, are provided.Intensity fluctuations of the light flashes of the incident-light illumination device are compensated for either by normalizing image data of the illuminated region or by controlling the duration of the light flashes.

    摘要翻译: 本发明涉及一种用于检查晶片的装置和方法。 该装置包括至少一个频闪入射光照明装置,用于将脉冲照明光束发射到晶片的表面上并用于照射晶片表面上的区域; 并且具有用于获取晶片表面上的分别照明区域的图像的至少一个图像获取装置。 该装置的特征在于,根据本发明,通过至少一个用于感测各个照明光束的光的光检测装置和用于基于由光检测装置感测的光来控制图像获取操作的控制装置 ,提供。 通过归一化照明区域的图像数据或通过控制闪光的持续时间来补偿入射光照明装置的闪光的强度波动。

    Method for automatically providing data for the focus monitoring of a lithographic process
    109.
    发明授权
    Method for automatically providing data for the focus monitoring of a lithographic process 有权
    用于自动提供用于光刻工艺的焦点监控的数据的方法

    公开(公告)号:US07277160B2

    公开(公告)日:2007-10-02

    申请号:US11057331

    申请日:2005-02-11

    申请人: Markus Kirsch

    发明人: Markus Kirsch

    IPC分类号: G03B27/32 G03B27/52 G03B27/42

    CPC分类号: G03F7/70641

    摘要: A method for automatically providing data for the focus monitoring of a lithographic exposure process is disclosed. Firstly, the file for a wafer is generated, which holds at least the information of the size of the wafer, the position of a plurality of measurement pattern, the order in which the measurement patterns are captured and registered, and the alignment of the measurement pattern. Secondly, this information is stored in a master grid. Thirdly, images are acquired of the pattern of each position stored in the master grid of the generated file, wherein the image acquisition is carried out according to the order as stored. Finally, names are assigned to the acquired images.

    摘要翻译: 公开了一种用于自动提供用于光刻曝光过程的焦点监视的数据的方法。 首先,生成用于晶片的文件,其至少保持晶片尺寸的信息,多个测量图案的位置,捕获和记录测量图案的顺序以及测量的对准 模式。 其次,该信息存储在主网格中。 第三,获取存储在生成文件的主网格中的每个位置的图案的图像,其中根据存储的顺序执行图像采集。 最后,将名称分配给所获取的图像。

    DEVICE FOR INSPECTING A MICROSCOPIC COMPONENT BY MEANS OF AN IMMERSION OBJECTIVE
    110.
    发明申请
    DEVICE FOR INSPECTING A MICROSCOPIC COMPONENT BY MEANS OF AN IMMERSION OBJECTIVE 审中-公开
    用于通过注入目标检查微观组件的装置

    公开(公告)号:US20070206279A1

    公开(公告)日:2007-09-06

    申请号:US11569180

    申请日:2005-07-05

    IPC分类号: G02B21/26

    CPC分类号: G02B21/0016

    摘要: A device (1) is disclosed for inspecting, measuring defined structures, simulating structures and structural defects, repair of and to structures, and post-inspecting defined object sites on a microscopic component (2) with an immersion objective (8a). The device (1) comprises a stage that is movable in the x-coordinate direction and in the y-coordinate direction and a holder (42) for the microscopic component (2), whereby the holder (42) is placed on the stage (4) with the microscopic component (2) in it. The holder (42) has a reservoir (51a) with immersion or cleaning fluid, respectively. The stage (4) is movable such that the immersion objective (8a) is located directly above the reservoir (51a) and may dip into the fluid with its front-most lens.

    摘要翻译: 公开了一种用于检测,测量定义的结构,模拟结构和结构缺陷,对结构进行修复和对具有浸没物镜(8a))的微观部件(2)上的定义的物体位置进行后检查的设备(1)。 装置(1)包括能够在x坐标方向和y坐标方向上移动的台架和用于微型部件(2)的支架(42),由此将支架(42)放置在台架 4)与其中的微观组分(2)。 保持器(42)具有分别具有浸没或清洁流体的储存器(51a)。 工作台(4)是可移动的,使得浸没物镜(8a)位于储存器(51a)的正上方,并且可以用其最前面的透镜浸入流体中。