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公开(公告)号：US08638565B2
公开(公告)日：2014-01-28
申请号：US12442414
申请日：2007-09-21
申请人： Rainer Sewald , Markus Kirsch
发明人： Rainer Sewald , Markus Kirsch
CPC分类号： H05K1/141 , H05K1/0306 , H05K3/305 , H05K3/3436 , H05K2201/10121 , H05K2201/10977 , Y10T29/4913
摘要： A method for producing an arrangement of optoelectronic components (10) is specified, comprising the following steps: producing at least two fixing regions (2) on a first connection carrier (1); introducing solder material (3) into the fixing regions (2); applying a second connection carrier (4) to the fixing regions (2); and soldering the second connection carrier (4) onto the first connection carrier (1) with the solder material (3) in the fixing regions (2).
摘要翻译： 规定了用于制造光电子部件（10）的布置的方法，包括以下步骤：在第一连接载体（1）上产生至少两个固定区域（2）; 将焊料材料（3）引入固定区域（2）中; 将第二连接载体（4）施加到所述固定区域（2）上; 以及在所述固定区域（2）中用所述焊料材料（3）将所述第二连接载体（4）焊接到所述第一连接载体（1）上。
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公开(公告)号：US20110266571A1
公开(公告)日：2011-11-03
申请号：US12995181
申请日：2009-04-20
申请人： Thomas Zeiler , Reiner Windisch , Stefan Gruber , Markus Kirsch , Julius Muschaweck , Torsten Baade , Herbert Brunner , Steffen Köhler
发明人： Thomas Zeiler , Reiner Windisch , Stefan Gruber , Markus Kirsch , Julius Muschaweck , Torsten Baade , Herbert Brunner , Steffen Köhler
IPC分类号： H01L33/58 , H01L31/0232
CPC分类号： H01L33/54 , H01L25/042 , H01L25/0753 , H01L33/38 , H01L33/58 , H01L33/60 , H01L33/62 , H01L2224/48091 , H01L2924/00
摘要： According to at least one embodiment of the semiconductor arrangement, the latter comprises a mounting side, at least one optoelectronic semiconductor chip with mutually opposing chip top and bottom, and at least one at least partially radiation-transmissive body with a body bottom, on which the semiconductor chip is mounted such that the chip top faces the body bottom. Moreover, the semiconductor arrangement comprises at least two electrical connection points for electrical contacting of the optoelectronic semiconductor chip, wherein the connection points do not project laterally beyond the body and with their side remote from the semiconductor chip delimit the semiconductor arrangement on the mounting side thereof.
摘要翻译： 根据半导体布置的至少一个实施例，后者包括安装侧，至少一个具有相对的芯片顶部和底部的光电子半导体芯片以及至少一个具有主体底部的至少部分辐射透射主体， 安装半导体芯片使得芯片顶部面向主体底部。 此外，半导体装置包括用于光电子半导体芯片的电接触的至少两个电连接点，其中连接点不侧向突出超过本体并且其远离半导体芯片的一侧限定其安装侧上的半导体布置 。
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公开(公告)号：US08723211B2
公开(公告)日：2014-05-13
申请号：US12529151
申请日：2008-02-26
IPC分类号： H01L33/00
CPC分类号： H01L33/483 , H01L33/54 , H01L33/58 , H01L2224/48091 , H01L2224/48247 , H01L2924/1815 , H01L2924/00014
摘要： A housing body for an optoelectronic component comprises a main surface having a first area region and a second area region. The first area region and the second area region form a step in the main surface. The first area region and the second area region adjoin one another by means of an outer edge. The second area region and the outer edge enclose the first area region.
摘要翻译： 用于光电子部件的壳体包括具有第一区域区域和第二区域区域的主表面。 第一区域区域和第二区域区域在主表面形成台阶。 第一区域区域和第二区域区域通过外边缘彼此相邻。 第二区域区域和外边缘包围第一区域区域。
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4.发明授权Optoelectronic component disposed in a recess of a housing and electrical componenet disposed in the housing 有权设置在壳体的凹部中并设置在壳体中的电气部件的光电部件公开(公告)号：US09054279B2
公开(公告)日：2015-06-09
申请号：US12521352
申请日：2008-01-09
申请人： Georg Bogner , Stefan Gruber , Thomas Zeiler , Markus Kirsch
发明人： Georg Bogner , Stefan Gruber , Thomas Zeiler , Markus Kirsch
CPC分类号： H01L33/483 , H01L25/0753 , H01L25/167 , H01L33/60 , H01L2224/48091 , H01L2224/48247 , H01L2224/48464 , H01L2224/73265 , H01L2924/00014
摘要： A plastic housing is arranged on a carrier element and is provided with a recess in which an optoelectronic component is arranged. On the side facing away from the carrier element, the recess has an opening to the outside which can be provided with a transparent cover. One or more structures can be provided on the plastic housing in order to orient the cover and/or optical components relative to the optoelectronic component.
摘要翻译： 塑料外壳设置在载体元件上，并设置有凹部，光电元件布置在该凹部中。 在背离载体元件的一侧上，该凹部具有可以设置有透明盖的外部开口。 可以在塑料壳体上提供一个或多个结构，以便相对于光电子部件定向盖和/或光学部件。
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5.发明申请公开(公告)号：US20100079964A1
公开(公告)日：2010-04-01
申请号：US12442414
申请日：2007-09-21
申请人： Rainer Sewald , Markus Kirsch
发明人： Rainer Sewald , Markus Kirsch
CPC分类号： H05K1/141 , H05K1/0306 , H05K3/305 , H05K3/3436 , H05K2201/10121 , H05K2201/10977 , Y10T29/4913
摘要： A method for producing an arrangement of optoelectronic components (10) is specified, comprising the following steps: producing at least two fixing regions (2) on a first connection carrier (1); introducing solder material (3) into the fixing regions (2); applying a second connection carrier (4) to the fixing regions (2); and soldering the second connection carrier (4) onto the first connection carrier (1) with the solder material (3) in the fixing regions (2).
摘要翻译： 规定了用于制造光电子部件（10）的布置的方法，包括以下步骤：在第一连接载体（1）上产生至少两个固定区域（2）; 将焊料材料（3）引入固定区域（2）中; 将第二连接载体（4）施加到所述固定区域（2）上; 以及在所述固定区域（2）中用所述焊料材料（3）将所述第二连接载体（4）焊接到所述第一连接载体（1）上。
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公开(公告)号：US08461616B2
公开(公告)日：2013-06-11
申请号：US12995181
申请日：2009-04-20
申请人： Thomas Zeiler , Reiner Windisch , Stefan Gruber , Markus Kirsch , Julius Muschaweck , Torsten Baade , Herbert Brunner , Steffen Köhler
发明人： Thomas Zeiler , Reiner Windisch , Stefan Gruber , Markus Kirsch , Julius Muschaweck , Torsten Baade , Herbert Brunner , Steffen Köhler
IPC分类号： H01L31/048
CPC分类号： H01L33/54 , H01L25/042 , H01L25/0753 , H01L33/38 , H01L33/58 , H01L33/60 , H01L33/62 , H01L2224/48091 , H01L2924/00
摘要： According to at least one embodiment of the semiconductor arrangement, the latter comprises a mounting side, at least one optoelectronic semiconductor chip with mutually opposing chip top and bottom, and at least one at least partially radiation-transmissive body with a body bottom, on which the semiconductor chip is mounted such that the chip top faces the body bottom. Moreover, the semiconductor arrangement comprises at least two electrical connection points for electrical contacting of the optoelectronic semiconductor chip, wherein the connection points do not project laterally beyond the body and with their side remote from the semiconductor chip delimit the semiconductor arrangement on the mounting side thereof.
摘要翻译： 根据半导体布置的至少一个实施例，后者包括安装侧，至少一个具有相对的芯片顶部和底部的光电子半导体芯片以及至少一个具有主体底部的至少部分辐射透射主体， 安装半导体芯片使得芯片顶部面向主体底部。 此外，半导体装置包括用于光电子半导体芯片的电接触的至少两个电连接点，其中连接点不侧向突出超过本体并且其远离半导体芯片的一侧限定其安装侧上的半导体布置 。
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7.发明申请公开(公告)号：US20110002587A1
公开(公告)日：2011-01-06
申请号：US12521352
申请日：2008-01-09
申请人： Georg Bogner , Stefan Gruber , Thomas Zeiler , Markus Kirsch
发明人： Georg Bogner , Stefan Gruber , Thomas Zeiler , Markus Kirsch
IPC分类号： G02B6/36
CPC分类号： H01L33/483 , H01L25/0753 , H01L25/167 , H01L33/60 , H01L2224/48091 , H01L2224/48247 , H01L2224/48464 , H01L2224/73265 , H01L2924/00014
摘要： A plastic housing is arranged on a carrier element and is provided with a recess in which an optoelectronic component is arranged. On the side facing away from the carrier element, the recess has an opening to the outside which can be provided with a transparent cover. One or more structures can be provided on the plastic housing in order to orient the cover and/or optical components relative to the optoelectronic component.
摘要翻译： 塑料外壳设置在载体元件上，并设置有凹部，光电元件布置在该凹部中。 在背离载体元件的一侧上，该凹部具有可以设置有透明盖的外部开口。 可以在塑料壳体上提供一个或多个结构，以便相对于光电子部件定向盖和/或光学部件。
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8.发明授权Method for automatically providing data for the focus monitoring of a lithographic process 有权用于自动提供用于光刻工艺的焦点监控的数据的方法公开(公告)号：US07277160B2
公开(公告)日：2007-10-02
申请号：US11057331
申请日：2005-02-11
申请人： Markus Kirsch
发明人： Markus Kirsch
CPC分类号： G03F7/70641
摘要： A method for automatically providing data for the focus monitoring of a lithographic exposure process is disclosed. Firstly, the file for a wafer is generated, which holds at least the information of the size of the wafer, the position of a plurality of measurement pattern, the order in which the measurement patterns are captured and registered, and the alignment of the measurement pattern. Secondly, this information is stored in a master grid. Thirdly, images are acquired of the pattern of each position stored in the master grid of the generated file, wherein the image acquisition is carried out according to the order as stored. Finally, names are assigned to the acquired images.
摘要翻译： 公开了一种用于自动提供用于光刻曝光过程的焦点监视的数据的方法。 首先，生成用于晶片的文件，其至少保持晶片尺寸的信息，多个测量图案的位置，捕获和记录测量图案的顺序以及测量的对准 模式。 其次，该信息存储在主网格中。 第三，获取存储在生成文件的主网格中的每个位置的图案的图像，其中根据存储的顺序执行图像采集。 最后，将名称分配给所获取的图像。
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9.发明申请Method for automatically providing data for the focus monitoring of a lithographic process 有权用于自动提供用于光刻工艺的焦点监控的数据的方法公开(公告)号：US20060181693A1
公开(公告)日：2006-08-17
申请号：US11057331
申请日：2005-02-11
申请人： Markus Kirsch
发明人： Markus Kirsch
IPC分类号： G03B27/32
CPC分类号： G03F7/70641
摘要： A method for automatically providing data for the focus monitoring of a lithographic exposure process is disclosed. Firstly, the file for a wafer is generated, which holds at least the information of the size of the wafer, the position of a plurality of measurement pattern, the order in which the measurement patterns are captured and registered, and the alignment of the measurement pattern. Secondly, this information is stored in a master grid. Thirdly, images are acquired of the pattern of each position stored in the master grid of the generated file, wherein the image acquisition is carried out according to the order as stored. Finally, names are assigned to the acquired images.
摘要翻译： 公开了一种用于自动提供用于光刻曝光过程的焦点监视的数据的方法。 首先，生成用于晶片的文件，其至少保持晶片尺寸的信息，多个测量图案的位置，捕获和记录测量图案的顺序以及测量的对准 模式。 其次，该信息存储在主网格中。 第三，获取存储在生成文件的主网格中的每个位置的图案的图像，其中根据存储的顺序执行图像采集。 最后，将名称分配给所获取的图像。
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公开(公告)号：US20100065879A1
公开(公告)日：2010-03-18
申请号：US12529151
申请日：2008-02-26
IPC分类号： H01L33/00 , H01L23/495 , H01L31/02 , H01L31/18
CPC分类号： H01L33/483 , H01L33/54 , H01L33/58 , H01L2224/48091 , H01L2224/48247 , H01L2924/1815 , H01L2924/00014
摘要： A housing body for an optoelectronic component comprises a main surface having a first area region and a second area region. The first area region and the second area region form a step in the main surface. The first area region and the second area region adjoin one another by means of an outer edge. The second area region and the outer edge enclose the first area region.
摘要翻译： 用于光电子部件的壳体包括具有第一区域区域和第二区域区域的主表面。 第一区域区域和第二区域区域在主表面形成台阶。 第一区域区域和第二区域区域通过外边缘彼此相邻。 第二区域区域和外边缘包围第一区域区域。
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