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公开(公告)号：US20240305310A1
公开(公告)日：2024-09-12
申请号：US18127262
申请日：2023-03-28
Applicant: UNITED MICROELECTRONICS CORP.
Inventor： Po-Hua CHEN , Yu-Yee LIOW , Chih-Wei WU , Wen-Hong HSU , Hsuan-Chih YEH , Pei-Wen SUN
IPC: H03M1/46
CPC classification number: H03M1/46
Abstract: A SAR ADC includes: a sample-hold (S/H) circuit sampling an input voltage to generate a S/H output signal; a DAC generating a DAC output signal; a comparator comparing the DAC output signal with the S/H output signal to generate a comparison output signal; a SAR combinational digital circuit group; a multiplexer circuit; and a plurality of registers for registering the comparison output signal as register output signals and outputting as an output signal of the SAR ADC. The SAR combinational digital circuit group generates a plurality of first and second SAR output signals based on the register output signals. The multiplexer circuit is controlled by on the register output signals to select among the first and the second SAR output signals as a plurality of multiplexer output signals for sending to the DAC. A capacitor coupling relationship of the DAC is controlled by the multiplexer output signals.
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公开(公告)号：US12089507B2
公开(公告)日：2024-09-10
申请号：US18118669
申请日：2023-03-07
Applicant: UNITED MICROELECTRONICS CORP.
Inventor： Hui-Lin Wang , Chun-Hsien Lin
Abstract: A semiconductor device for internet of things (IoT) device includes a substrate having an array region defined thereon and a ring of dummy pattern surrounding the array region. Preferably, the ring of dummy pattern includes a plurality of magnetic tunneling junctions (MTJs) and a ring of metal interconnect pattern overlapping the MTJs and surrounding the array region. The semiconductor device further includes a gap between the array region and the ring of dummy pattern.
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公开(公告)号：US12075613B2
公开(公告)日：2024-08-27
申请号：US17570345
申请日：2022-01-06
Inventor： Pin-Hong Chen , Yi-Wei Chen , Tzu-Chieh Chen , Chih-Chieh Tsai , Chia-Chen Wu , Kai-Jiun Chang , Yi-An Huang , Tsun-Min Cheng
IPC: H10B12/00
CPC classification number: H10B12/488 , H10B12/34
Abstract: A method for fabricating buried word line of a dynamic random access memory (DRAM) includes the steps of: forming a trench in a substrate; forming a first conductive layer in the trench; forming a second conductive layer on the first conductive layer, in which the second conductive layer above the substrate and the second conductive layer below the substrate comprise different thickness; and forming a third conductive layer on the second conductive layer to fill the trench.
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公开(公告)号：US20240282371A1
公开(公告)日：2024-08-22
申请号：US18180864
申请日：2023-03-09
Applicant: United Microelectronics Corp.
Inventor： Yi Ting Hung , Ko-Chi Chen , Tzu-Yun Chang
IPC: G11C13/00
CPC classification number: G11C13/0026 , G11C13/0028 , G11C13/0038 , G11C13/004 , G11C2013/0045
Abstract: A forming operation method of a resistive random access memory is provided. The method includes the following steps. A positive pulse and a negative pulse are sequentially applied, by a bit line/source line driver, to multiple resistive random access memory cells in a direction form a farthest location to a nearest location based on the bit line/source line driver through a bit line and a source line to break down a dielectric film of each of the resistive random access memory cells and generate a conductive filament of each of the resistive random access memory cells.
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公开(公告)号：US12069955B2
公开(公告)日：2024-08-20
申请号：US17363023
申请日：2021-06-30
Applicant: UNITED MICROELECTRONICS CORP.
Inventor： Hui-Lin Wang , Si-Han Tsai , Ching-Hua Hsu , Chen-Yi Weng , Po-Kai Hsu , Jing-Yin Jhang
Abstract: A method for fabricating a magnetic random access memory (MRAM) device includes the steps of first forming a first magnetic tunneling junction (MTJ) on a substrate, forming a first top electrode on the first MTJ, and then forming a passivation layer around the first MTJ. Preferably, the passivation layer includes a V-shape and a valley point of the V-shape is higher than a top surface of the first top electrode.
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Patent Agency Ranking
公开(公告)号：US20240268124A1
公开(公告)日：2024-08-08
申请号：US18636306
申请日：2024-04-16
Applicant: UNITED MICROELECTRONICS CORP.
Inventor： Hui-Lin Wang , Yu-Ping Wang , Chen-Yi Weng , Chin-Yang Hsieh , Yi-Hui Lee , Ying-Cheng Liu , Yi-An Shih , I-Ming Tseng , Jing-Yin Jhang , Chien-Ting Lin
CPC classification number: H10B61/00 , G11C11/161 , H10B61/10 , H10N50/01 , H10N50/80
Abstract: A semiconductor structure includes a substrate, a first dielectric layer on the substrate, a plurality of memory stack structures on the first dielectric layer, an insulating layer conformally covering the memory stack structures and the first dielectric layer, a second dielectric layer on the insulating layer and filling the spaces between the memory stack structures, a first interconnecting structure through the second dielectric layer, wherein a top surface of the first interconnecting structure is flush with a top surface of the second dielectric layer and higher than top surfaces of the memory stack structures, a third dielectric layer on the second dielectric layer, and a plurality of second interconnecting structures through the third dielectric layer, the second dielectric layer and the insulating layer on the top surfaces of the memory stack structures to contact the top surfaces of the memory stack structures.
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公开(公告)号：US20240266286A1
公开(公告)日：2024-08-08
申请号：US18118093
申请日：2023-03-06
Applicant: UNITED MICROELECTRONICS CORP.
Inventor： Bo-Wei Huang , Po-Hung Chen , Chun-Cheng Yu , I-Hsien Liu , Ho-Yu Lai , Kuan-Wen Fang , Chih-Sheng Chang
IPC: H01L23/528 , H01L21/768
CPC classification number: H01L23/5283 , H01L21/76892
Abstract: A semiconductor pattern is provided in the present invention, including a first line extending to one end in a first direction and a second line extending in a second direction perpendicular to the first direction and adjacent to the end of the first line in the first direction, wherein the end of the first line is provided with a rounding feature, the first line has a width in the second direction, and the width is gradually increased to a maximum width toward the end and gradually converged to form the rounding feature.
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公开(公告)号：US12058851B2
公开(公告)日：2024-08-06
申请号：US18199346
申请日：2023-05-18
Inventor： Yi-Wei Chen , Hsu-Yang Wang , Chun-Chieh Chiu , Shih-Fang Tzou
IPC: H01L21/48 , H01L21/768 , H10B12/00
CPC classification number: H10B12/485 , H01L21/76804 , H01L21/76805 , H01L21/76814 , H01L21/76819 , H01L21/76895 , H10B12/053 , H10B12/482
Abstract: A method of forming a semiconductor memory device includes the following steps. First of all, a substrate is provided, and a plurality of gates is formed in the substrate, along a first direction. Next, a semiconductor layer is formed on the substrate, covering the gates, and a plug is then in the semiconductor layer, between two of the gates. Then, a deposition process is performed to from a stacked structure on the semiconductor layer. Finally, the stacked structure is patterned to form a plurality of bit lines, with one of the bit lines directly in contact with the plug.
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公开(公告)号：US12057313B2
公开(公告)日：2024-08-06
申请号：US17556972
申请日：2021-12-20
Applicant: UNITED MICROELECTRONICS CORP.
Inventor： Shin-Hung Li
IPC: H01L21/00 , H01L21/02 , H01L21/8258 , H01L29/66 , H01L29/786
CPC classification number: H01L21/02565 , H01L21/8258 , H01L29/66969 , H01L29/7869
Abstract: The present invention provides a semiconductor structure, including a substrate, a thin-film transistor (TFT) on the substrate, wherein the thin-film transistor including a TFT channel layer, a first source and a first drain in the TFT channel layer and a first capping layer on the TFT channel layer. A MOSFET is on the substrate, with a second gate, a second source and a second drain on two sides of the second gate and a second capping layer on the second gate, wherein top surfaces of the second capping layer and the first capping layer are leveled, and a first ILD layer is on the first capping layer and the second capping layer, wherein the first ILD layer and the first capping layer function collectively as a gate dielectric layer for the TFT.
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公开(公告)号：US20240260489A1
公开(公告)日：2024-08-01
申请号：US18635027
申请日：2024-04-15
Applicant: UNITED MICROELECTRONICS CORP.
Inventor： Chia-Ching Hsu
CPC classification number: H10N70/8265 , H10N70/021 , H10N70/245 , H10N70/841 , H10N70/8833
Abstract: A semiconductor memory device includes a substrate, a first dielectric layer on the substrate, a bottom electrode on the first dielectric layer, a second dielectric layer on the first dielectric layer, and a top electrode in the second dielectric layer. The top electrode has a lower portion around the bottom electrode and a tapered upper portion. A third dielectric layer is disposed above the bottom electrode and around the tapered upper portion of the top electrode. A resistive-switching layer is disposed between a sidewall of the bottom electrode and a sidewall of the lower portion of the top electrode and between the third dielectric layer and a sidewall of the tapered upper portion of the top electrode. An air gap is disposed in the third dielectric layer.
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