公开(公告)号：US06262481B1

公开(公告)日：2001-07-17

申请号：US09514846

申请日：2000-02-28

申请人： Bily Wang

发明人： Bily Wang

IPC分类号： H01L2329

CPC分类号： H01L23/3736 ,  H01L23/3677 ,  H01L2924/0002 ,  H01L2924/3011 ,  H01L2924/00

摘要： A heat conducting metal is placed under a semiconductor chip and wraps around a substrate of the semiconductor device package to serve as the heat sink for the chip. The metal can wrap around a through-hole in the middle of the substrate, or wrap around the edge of the substrate. A metal plate can be placed between the chip and the heat conducting metal to hold the semiconductor chip.

摘要翻译： 将导热金属放置在半导体芯片的下方并且包裹在半导体器件封装的衬底周围，以用作芯片的散热器。 金属可以围绕衬底中间的通孔包裹，或绕在衬底的边缘上。 金属板可以放置在芯片和导热金属之间以保持半导体芯片。

公开(公告)号：US08519458B2

公开(公告)日：2013-08-27

申请号：US13182425

申请日：2011-07-13

申请人： Bily Wang ,  Kuei-Pao Chen ,  Hsin-Cheng Chen

发明人： Bily Wang ,  Kuei-Pao Chen ,  Hsin-Cheng Chen

IPC分类号： H01L31/113 ,  G01N21/01

CPC分类号： G01R31/01 ,  G01R31/2635

摘要： A light-emitting element detection and classification device includes a rotation unit for transporting a plurality of light-emitting elements, a chip detection unit, and a chip classification unit. The rotation unit includes at least one rotary turntable, a plurality of receiving portions formed on the rotary turntable, and a plurality of suction-exhaust dual-purpose openings respectively disposed in the receiving portions, each receiving portion selectively receives at least one of the light-emitting elements. Each light-emitting element is an LED package chip having a positive electrode pad and a negative electrode pad disposed on the bottom side thereof. The chip detection unit includes at least one chip detection module adjacent to the rotation unit for detecting each light-emitting element. The chip classification unit includes at least one chip classification module adjacent to the rotation unit for classifying the LED package chips that have been detected by the at least one chip detection module.

摘要翻译： 发光元件检测和分类装置包括用于传送多个发光元件的旋转单元，芯片检测单元和芯片分类单元。 旋转单元包括至少一个旋转转盘，形成在旋转转台上的多个接收部分和分别设置在接收部分中的多个吸排二重用开口，每个接收部分选择性地接收至少一个光 - 发行元素。 每个发光元件是具有设置在其底侧上的正极焊盘和负极焊盘的LED封装芯片。 芯片检测单元包括与用于检测每个发光元件的旋转单元相邻的至少一个芯片检测模块。 芯片分类单元包括与旋转单元相邻的至少一个芯片分类模块，用于对由至少一个芯片检测模块检测到的LED封装芯片进行分类。

公开(公告)号：US08398275B2

公开(公告)日：2013-03-19

申请号：US12987291

申请日：2011-01-10

申请人： Bily Wang ,  Chi-Tseng Chang ,  Chi-Kang Lo ,  Zhen-Hao Fan

发明人： Bily Wang ,  Chi-Tseng Chang ,  Chi-Kang Lo ,  Zhen-Hao Fan

IPC分类号： F21V19/02

CPC分类号： F21V21/30 ,  F21K9/272 ,  F21Y2103/10 ,  F21Y2115/10

摘要： A lamp head assembly includes an outer head unit, an inner head unit, and an elastic pressing unit. The outer head unit includes at least two conductive pins. The inner head unit is disposed rotatably in the outer head unit. The elastic pressing unit is disposed movably in the outer head unit for selectively positioning the position of the inner head unit relative to the outer head unit or the position of the outer head unit relative to the inner head unit, wherein the elastic pressing unit includes a pressing element selectively exposed from the outer head unit.

摘要翻译： 灯头组件包括外头单元，内头单元和弹性按压单元。 外头单元包括至少两个导电销。 内头单元可旋转地设置在外头单元中。 弹性按压单元可移动地设置在外头单元中，用于相对于外头单元选择性地定位内头单元的位置或外头单元相对于内头单元的位置，其中弹性按压单元包括 从外部头部单元选择性地暴露的按压元件。

公开(公告)号：US08137999B2

公开(公告)日：2012-03-20

申请号：US13214337

申请日：2011-08-22

申请人： Bily Wang ,  Jonnie Chuang ,  Hui-Yen Huang

发明人： Bily Wang ,  Jonnie Chuang ,  Hui-Yen Huang

IPC分类号： H01L21/56

CPC分类号： H01L33/486 ,  H01L33/56 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014

摘要： A method for fabricating a LED includes: providing a metal substrate; etching the metal substrate to form a first terminal, a second terminal, and a gap between the first terminal and the second terminal, wherein the first terminal has at least one first etching concave and the second terminal has at least one second etching concave; placing at least one LED chip in the at least one first etching concave, wherein the at least one LED chip has a first electrode and a second electrode; electrically connecting the first electrode with the first terminal, and electrically connecting the second electrode with the second terminal; and then covering the at least one LED chip with synthetic polymer, wherein the synthetic polymer is filled into the at least one first etching concave, the at least one second etching concave and the gap to connect the first terminal with the second terminal.

摘要翻译： 一种制造LED的方法包括：提供金属基板; 蚀刻金属基板以形成第一端子，第二端子和第一端子和第二端子之间的间隙，其中第一端子具有至少一个第一蚀刻凹部，并且第二端子具有至少一个第二蚀刻凹部; 将至少一个LED芯片放置在所述至少一个第一蚀刻凹部中，其中所述至少一个LED芯片具有第一电极和第二电极; 将第一电极与第一端子电连接，并将第二电极与第二端子电连接; 然后用合成聚合物覆盖所述至少一个LED芯片，其中所述合成聚合物填充到所述至少一个第一蚀刻凹部中，所述至少一个第二蚀刻凹部和所述间隙将所述第一端子与所述第二端子连接。

公开(公告)号：US08053961B2

公开(公告)日：2011-11-08

申请号：US11476165

申请日：2006-06-28

申请人： Bily Wang ,  Hui-Chung Lin

发明人： Bily Wang ,  Hui-Chung Lin

IPC分类号： H01J1/62 ,  H01J61/40

CPC分类号： G09F13/22

摘要： The present invention is related to a color-mixture display unit and an image display apparatus using the same, wherein the image display apparatus includes at least one color-mixture pixel which is pre-disposed at plates of a light box so that a pattern is formed. Each of the color-mixture pixels is equipped with a red filter, a green filter and a blue filter, or equipped with a black filter or equipped with a transparent filter. At least one color-mixture LED is disposed within the light box and provides a backlight for the color-mixture pixel. In this regard, the color-mixture LEDs are controlled by an image controller and provide various color light beams with the color-mixture pixels. In addition, arrangement of each color filter within the color-mixture pixel is utilized so that color-mixture effect of dynamic image is shown.

摘要翻译： 本发明涉及一种彩色混合显示单元和使用该彩色混合显示单元的图像显示装置，其中该图像显示装置包括至少一个颜色混合像素，其被预先安置在灯箱的板上，使得图案是 形成。 每个混色像素配备有红色滤光器，绿色滤光片和蓝色滤光片，或配备有黑色滤光片或配有透明滤光片。 至少一个颜色混合LED设置在灯箱内，并提供用于混色像素的背光。 在这方面，混色LED由图像控制器控制并且提供具有颜色混合像素的各种彩色光束。 此外，利用颜色混合像素内的每个滤色器的布置，以显示动态图像的混色效果。

公开(公告)号：USD645421S1

公开(公告)日：2011-09-20

申请号：US29383417

申请日：2011-01-18

申请人： Bily Wang ,  Sung-Yi Hsiao ,  Jack Chen

设计人： Bily Wang ,  Sung-Yi Hsiao ,  Jack Chen

公开(公告)号：US07923745B2

公开(公告)日：2011-04-12

申请号：US11779556

申请日：2007-07-18

申请人： Bily Wang ,  Jonnie Chuang ,  Wen-Kuei Wu

发明人： Bily Wang ,  Jonnie Chuang ,  Wen-Kuei Wu

IPC分类号： H01L33/00

CPC分类号： B29C45/14655 ,  B29C33/0022 ,  F21K9/00 ,  F21K9/20 ,  F21Y2103/10 ,  F21Y2115/10 ,  G09F9/33 ,  G09F13/22 ,  H01L24/97 ,  H01L33/52 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/12041 ,  H01L2924/15747 ,  H01L2924/15787 ,  H01L2224/81 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2924/00

摘要： An LED chip package structure with high-efficiency light-emitting effect includes a substrate unit, a light-emitting unit, and a package colloid unit. The substrate unit has a substrate body, and a positive electrode trace and a negative electrode trace respectively formed on the substrate body. The light-emitting unit has a plurality of LED chips arranged on the substrate body, and each LED chip has a positive electrode side and a negative electrode side respectively and electrically connected with the positive electrode trace and the negative electrode trace of the substrate unit. The package colloid unit has a plurality of package colloids respectively covered on the LED chips.

摘要翻译： 具有高效率发光效果的LED芯片封装结构包括基板单元，发光单元和封装胶体单元。 基板单元具有分别形成在基板主体上的基板主体和正极迹线和负极迹线。 发光单元具有布置在基板主体上的多个LED芯片，并且每个LED芯片分别具有正极侧和负极侧，并与基板单元的正极迹线和负极迹线电连接。 封装胶体单元具有分别覆盖在LED芯片上的多个封装胶体。

公开(公告)号：US07876593B2

公开(公告)日：2011-01-25

申请号：US12243016

申请日：2008-10-01

申请人： Bily Wang ,  Ping-Chou Yang ,  Jia-Wen Chen

发明人： Bily Wang ,  Ping-Chou Yang ,  Jia-Wen Chen

IPC分类号： H01L33/00 ,  H01L21/00 ,  H02H9/00

CPC分类号： H01L25/167 ,  H01L2224/48091 ,  H01L2224/48247 ,  Y10T29/41 ,  H01L2924/00014

摘要： An LED chip package structure includes a conductive unit, a first package unit, an ESD unit, a second package unit, a light-emitting unit and a second package unit. The conductive unit has two conductive pins adjacent to each other which form a concave space between each other. The first package unit encloses one part of each conductive pin in order to form a receiving space communicating with the concave space and to expose an end side of each conductive pin. The ESD unit is received in the concave space and electrically connected between the two conductive pins. The second package unit is received in the concave space in order to cover the ESD unit. The light-emitting unit is received in the receiving space and electrically connected between the two conductive pins. The third package unit is received in the receiving space in order to cover the light-emitting unit.

摘要翻译： LED芯片封装结构包括导电单元，第一封装单元，ESD单元，第二封装单元，发光单元和第二封装单元。 导电单元具有彼此相邻的两个导电销，它们彼此之间形成凹形空间。 第一封装单元包围每个导电引脚的一部分，以便形成与凹入空间连通并且暴露每个导电引脚的端侧的接收空间。 ESD单元被容纳在凹形空间中并电连接在两个导电销之间。 第二包装单元被容纳在凹形空间中以覆盖ESD单元。 发光单元被容纳在接收空间中并且电连接在两个导电引脚之间。 第三包装单元被容纳在接收空间中以覆盖发光单元。

公开(公告)号：US20100290664A1

公开(公告)日：2010-11-18

申请号：US12453636

申请日：2009-05-18

申请人： Bily Wang ,  Kuei-Pao Chen ,  Hsin-Cheng Chen ,  Ming-Hao Chou ,  Ren-Chun Ni

发明人： Bily Wang ,  Kuei-Pao Chen ,  Hsin-Cheng Chen ,  Ming-Hao Chou ,  Ren-Chun Ni

IPC分类号： G06K9/00

CPC分类号： G06T7/0006 ,  G06T2207/30164

摘要： A detection system for detecting appearances of many electronic elements includes a rotary module, a feeding module and a detection module. The rotary module has a base structure and a hollow transparent rotary structure disposed on the base structure. The feeding module is disposed beside one side of the hollow transparent rotary structure in order to sequentially guide the electronic elements to the top surface of the hollow transparent rotary structure. The detection module has a plurality of detection units sequentially disposed around the hollow transparent rotary structure. Each detection unit is composed of an image-sensing element for sensing the electronic elements, an image-capturing element for capturing surface images of the electronic elements and a classifying element for classifying the electronic elements.

摘要翻译： 用于检测许多电子元件的外观的检测系统包括旋转模块，馈送模块和检测模块。 旋转模块具有底座结构和设置在基座结构上的中空透明旋转结构。 馈送模块设置在中空透明旋转结构的一侧旁边，以便顺序地将电子元件引导到中空透明旋转结构的顶表面。 检测模块具有多个依次设置在中空透明旋转结构周围的检测单元。 每个检测单元由用于感测电子元件的图像感测元件，用于捕获电子元件的表面图像的图像捕获元件和用于分类电子元件的分类元件组成。

公开(公告)号：US07829901B2

公开(公告)日：2010-11-09

申请号：US12285034

申请日：2008-09-29

申请人： Bily Wang ,  Shih-Yu Wu ,  Wen-Kuei Wu

发明人： Bily Wang ,  Shih-Yu Wu ,  Wen-Kuei Wu

IPC分类号： H01L33/00 ,  H01L21/00

CPC分类号： G02B6/0031 ,  F21K9/00 ,  F21K9/20 ,  F21Y2103/10 ,  F21Y2115/10

摘要： An LED chip package structure with high-efficiency light-emitting effect includes a substrate unit, a light-emitting unit, a package colloid unit, and a frame unit. The light-emitting unit has a plurality of LED chips electrically arranged on the substrate unit. The package colloid unit has a longitudinal package colloid covering the LED chips, and the longitudinal package colloid has a cambered colloid surface and a light-emitting colloid surface respectively formed on its top surface and a lateral surface thereof. The frame unit that is a frame layer covering the substrate unit and disposed around a lateral side of the longitudinal package colloid for exposing the light-emitting colloid surface of the longitudinal package colloid.

摘要翻译： 具有高效率发光效果的LED芯片封装结构包括基板单元，发光单元，封装胶体单元和框架单元。 发光单元具有电子地布置在基板单元上的多个LED芯片。 封装胶体单元具有覆盖LED芯片的纵向封装胶体，并且纵向封装胶体具有分别形成在其顶表面及其侧表面上的弧形胶体表面和发光胶体表面。 所述框架单元是覆盖所述基板单元并且设置在所述纵向封装胶体的侧面周围的框架层，用于暴露所述纵向封装胶体的发光胶体表面。