公开(公告)号：US20140180093A1

公开(公告)日：2014-06-26

申请号：US14191553

申请日：2014-02-27

Applicant: Butterfly Network, Inc.

Inventor： Jonathan M. Rothberg ,  Nevada J. Sanchez ,  Gregory L. Charvat ,  Tyler S. Ralston

IPC: A61B8/08

CPC classification number: G01S7/52017 ,  A61B5/015 ,  A61B8/08 ,  A61B8/13 ,  A61B8/4209 ,  A61B8/4245 ,  A61B8/4254 ,  A61B8/4263 ,  A61B8/4477 ,  A61B8/4488 ,  A61B8/4494 ,  A61B8/483 ,  A61B8/5207 ,  A61B8/56 ,  A61B8/565 ,  A61B17/320068 ,  A61B2090/378 ,  A61B2562/164 ,  A61N7/00 ,  A61N7/02 ,  A61N2007/0078 ,  G01S7/52019 ,  G01S7/52023

Abstract: Apparatus and methods are described that include ultrasound imaging devices, which may operate in a transmissive ultrasound imaging modality, and which may be used to detect properties of interest of a subject such as index of refraction, density and/or speed of sound. Devices suitable for performing high intensity focused ultrasound (HIFU), as well as HIFU and ultrasound imaging, are also described.

公开(公告)号：US11137486B2

公开(公告)日：2021-10-05

申请号：US15517211

申请日：2015-10-07

Applicant: Butterfly Network, Inc.

Inventor： Tyler S. Ralston ,  Andrew J. Casper ,  Nevada J. Sanchez

IPC: G01S7/52 ,  A61B8/00 ,  H04B11/00 ,  H04L5/00 ,  H04L12/24 ,  H04L29/08

Abstract: Programmable ultrasound probes and methods of operation are described. The ultrasound probe may include memory storing parameter data and may also include a parameter loader which loads the parameter data into programmable circuitry of the ultrasound probe. In some instances, the ultrasound probe may include circuitry grouped into modules which may be repeatable and which may be coupled together to allow data to be exchanged between the modules.

公开(公告)号：US11061125B2

公开(公告)日：2021-07-13

申请号：US16035552

申请日：2018-07-13

Applicant: Butterfly Network, Inc.

Inventor： Kailiang Chen ,  Tyler S. Ralston ,  Keith G. Fife

IPC: H03K17/68 ,  G01S7/521 ,  H03K17/687 ,  G01S7/52 ,  G01S15/89

Abstract: Circuitry for ultrasound devices is described. A multilevel pulser is described, which can provide bipolar pulses of multiple levels. The multilevel pulser includes a pulsing circuit and pulser and feedback circuit. Symmetric switches are also described. The symmetric switches can be positioned as inputs to ultrasound receiving circuitry to block signals from the receiving circuitry.

公开(公告)号：US10857567B2

公开(公告)日：2020-12-08

申请号：US16011776

申请日：2018-06-19

Applicant: Butterfly Network, Inc.

Inventor： Amandeep Singh ,  Kailiang Chen ,  Tyler S. Ralston

IPC: G01S7/53 ,  G01S7/524 ,  G01S15/89 ,  B06B1/02 ,  H03M3/00 ,  B06B1/06 ,  H03M1/74

Abstract: An ultrasound device is describe in which analog ultrasonic transducer output signal are directly converted to digital signals. The ultrasound device includes microfabricated ultrasonic transducers directly coupled to a sigma delta analog-to-digital converter in some instances. The direct digital conversion may allow for omission of undesirable analog processing stages in the ultrasound circuitry chain. In some situations, the ADC may be integrated on the same substrate as the ultrasound transducer.

公开(公告)号：US10782269B2

公开(公告)日：2020-09-22

申请号：US16109703

申请日：2018-08-22

Applicant: Butterfly Network, Inc.

Inventor： Jonathan M. Rothberg ,  Susan A. Alie ,  Keith G. Fife ,  Nevada J. Sanchez ,  Tyler S. Ralston

IPC: G01N29/24 ,  B81C1/00 ,  B06B1/02 ,  A61B8/00 ,  B81B7/00

Abstract: Micromachined ultrasonic transducers integrated with complementary metal oxide semiconductor (CMOS) substrates are described, as well as methods of fabricating such devices. Fabrication may involve two separate wafer bonding steps. Wafer bonding may be used to fabricate sealed cavities in a substrate. Wafer bonding may also be used to bond the substrate to another substrate, such as a CMOS wafer. At least the second wafer bonding may be performed at a low temperature.

公开(公告)号：US10672974B2

公开(公告)日：2020-06-02

申请号：US16158999

申请日：2018-10-12

Applicant: Butterfly Network, Inc.

Inventor： Jonathan M. Rothberg ,  Susan A. Alie ,  Keith G. Fife ,  Nevada J. Sanchez ,  Tyler S. Ralston ,  Jaime Scott Zahorian

IPC: H01L41/22 ,  B81C1/00 ,  B81B7/00 ,  B06B1/06 ,  B06B1/02

Abstract: Micromachined ultrasonic transducers integrated with complementary metal oxide semiconductor (CMOS) substrates are described, as well as methods of fabricating such devices. Fabrication may involve two separate wafer bonding steps. Wafer bonding may be used to fabricate sealed cavities in a substrate. Wafer bonding may also be used to bond the substrate to another substrate, such as a CMOS wafer. At least the second wafer bonding may be performed at a low temperature.

公开(公告)号：US10371804B2

公开(公告)日：2019-08-06

申请号：US16252382

申请日：2019-01-18

Applicant: Butterfly Network, Inc.

Inventor： Tyler S. Ralston ,  Nevada J. Sanchez

IPC: G01S15/00 ,  G01S7/52 ,  A61B5/00 ,  A61B8/00 ,  A61B8/08 ,  G01S15/89

Abstract: Ultrasound signal processing circuitry and related apparatus and methods are described. Signal samples received from an ultrasound transducer array in an ultrasound transducer based imaging system may be processed, or conditioned, by application of one or more weighting functions. In some embodiments, one or more weighting functions may be applied to the signal samples in the time domain. In other embodiments, the signal samples may be converted to the frequency domain and one or more weighting functions may be applied in the frequency domain. In further embodiments, one or more weighting functions may be applied in the time domain and one or more weighting functions may be applied in the frequency domain. The weighting functions may be channel dependent and/or channel independent. The processed data can be provided to an image formation processor.

公开(公告)号：US10247708B2

公开(公告)日：2019-04-02

申请号：US15178025

申请日：2016-06-09

Applicant: Butterfly Network, Inc.

Inventor： Jonathan M. Rothberg ,  Susan A. Alie ,  Keith G. Fife ,  Nevada J. Sanchez ,  Tyler S. Ralston

IPC: G01N29/24 ,  B81C1/00 ,  B06B1/02 ,  A61B8/00 ,  B81B7/00

Abstract: Micromachined ultrasonic transducers integrated with complementary metal oxide semiconductor (CMOS) substrates are described, as well as methods of fabricating such devices. Fabrication may involve two separate wafer bonding steps. Wafer bonding may be used to fabricate sealed cavities in a substrate. Wafer bonding may also be used to bond the substrate to another substrate, such as a CMOS wafer. At least the second wafer bonding may be performed at a low temperature.

公开(公告)号：US10175347B2

公开(公告)日：2019-01-08

申请号：US14957051

申请日：2015-12-02

Applicant: Butterfly Network, Inc.

Inventor： Kailiang Chen ,  Keith G. Fife ,  Tyler S. Ralston ,  Nevada J. Sanchez ,  Andrew J. Casper

IPC: G01S7/52 ,  G01S7/527 ,  B06B1/02 ,  G01S15/89

Abstract: Methods and apparatus are described for implementing a coding scheme on ultrasound signals received by a plurality of ultrasonic transducers. The coding, and subsequent decoding, may allow for multiple ultrasonic transducers to be operated in a receive mode simultaneously while still differentiating the contribution of the individual ultrasonic transducers. Improved signal characteristics may result, including improved signal-to-noise ratio (SNR).

公开(公告)号：US20180364200A1

公开(公告)日：2018-12-20

申请号：US16109437

申请日：2018-08-22

Applicant: Butterfly Network, Inc.

Inventor： Kailiang Chen ,  Tyler S. Ralston

IPC: G01N29/11 ,  G01N29/44 ,  G01N29/06

Abstract: An ultrasound device, including a profile generator, an encoder configured to receive a profile signal from the profile generator, and an attenuator configured to receive a signal representing an output of an ultrasound sensor and coupled to the encoder to receive a control signal from the encoder, the attenuator including a plurality of attenuator stages, the attenuator configured to produce an output signal that is an attenuated version of the input signal.