公开(公告)号：US06865288B1

公开(公告)日：2005-03-08

申请号：US09612501

申请日：2000-07-07

申请人： Chie Shishido ,  Masahiro Watanabe ,  Yuji Takagi ,  Hiroshi Miyai

发明人： Chie Shishido ,  Masahiro Watanabe ,  Yuji Takagi ,  Hiroshi Miyai

IPC分类号： H01L21/66 ,  G01N21/88 ,  G01N21/956 ,  G06K9/00 ,  G06T1/00 ,  G06T7/00

CPC分类号： G06T7/001 ,  G06T2207/30148

摘要： A pattern inspection method and apparatus are disclosed, the method has the steps of generating a reference digital image signal to be compared with a detection digital image signal detected continuously from the desired band-shaped inspection area on an object to be inspected, determining zero or one or more candidate , matching positions between the detection digital image signal and the reference digital image signal for each block unit area sequentially cut out and calculating a mass of candidate matching positions over the entire band-shaped inspection area, determining an accurate matching position between the detection digital image signal and the reference digital image signal for each block unit area based on the continuity of the block unit areas from the calculated mass of candidate matching positions over the entire band-shaped inspection area, and determining a defect by matching the positions based on the determined accurate matching position for each block unit area and comparing the images.

摘要翻译： 公开了一种图案检查方法和装置，该方法具有以下步骤：产生参考数字图像信号，以与要检查的对象上的期望的带状检查区域连续检测的检测数字图像信号进行比较，确定零或 检测数字图像信号与每个块单位区域的基准数字图像信号之间的一个或多个候选匹配位置顺序地切出并计算整个带状检查区域上的候选匹配位置的质量，确定精确的匹配位置 所述检测数字图像信号和所述参考数字图像信号，根据所计算出的整个带状检查区域中的候选匹配位置的质量，根据所述块单位面积的连续性，以及通过匹配所述位置 基于确定的每个块单位区域的精确匹配位置 比较图像。

公开(公告)号：US20050037271A1

公开(公告)日：2005-02-17

申请号：US10894044

申请日：2004-07-20

申请人： Chie Shishido ,  Hidetoshi Morokuma ,  Yuki Ojima ,  Maki Tanaka ,  Wataru Nagatomo

发明人： Chie Shishido ,  Hidetoshi Morokuma ,  Yuki Ojima ,  Maki Tanaka ,  Wataru Nagatomo

IPC分类号： H01L21/66 ,  G03C5/00 ,  G03F7/20 ,  G03F9/00 ,  H01L21/027

CPC分类号： G03F7/70641 ,  G03F7/705 ,  G03F7/70625 ,  Y10S430/143

摘要： In monitoring of an exposure process, a highly isolative pattern greatly changed in a shape of cross section by fluctuations in the exposure dose and the focal position is an observation target. Especially, to detect a change in a resist shape of cross section from a tapered profile to an inverse tapered profile, one of the following observation methods is employed to obtain observation data: (1) a tilt image of a resist pattern is imaged by using tilt imaging electron microscopy, (2) an electron beam image of a resist pattern is imaged under imaging conditions for generating asymmetry on an electron beam signal waveform, and (3) scattering characteristic data of a resist pattern is obtained by an optical measurement system. The observation data is applied to model data created beforehand in accordance with the exposure conditions to estimate fluctuations in the exposure dose and the focal position.

公开(公告)号：US06831998B1

公开(公告)日：2004-12-14

申请号：US09598652

申请日：2000-06-22

申请人： Hiroya Koshishiba ,  Hideaki Doi ,  Mitsunobu Isobe ,  Kazushi Yoshimura ,  Haruomi Kobayashi ,  Chie Shishido

发明人： Hiroya Koshishiba ,  Hideaki Doi ,  Mitsunobu Isobe ,  Kazushi Yoshimura ,  Haruomi Kobayashi ,  Chie Shishido

IPC分类号： G06K900

CPC分类号： G06T7/0004 ,  G06K9/00973 ,  G06T2207/30141

摘要： In order to provide a high-speed, inexpensive inspection system that has a short development period, that is flexible, and that allow algorithms to be easily changed, a PC equipped with an image input feature is used to capture an image detected by a line image sensor, this detected image is transferred to a plurality of PCs connected by a LAN, and defects are detected using software processing on the plurality of PCs.

摘要翻译： 为了提供具有较短开发周期，灵活性并且允许算法容易改变的高速，廉价的检查系统，配备有图像输入特征的PC用于捕获由线检测到的图像 图像传感器将该检测图像传送到由LAN连接的多个PC，并且使用多个PC上的软件处理来检测缺陷。

公开(公告)号：US06791096B2

公开(公告)日：2004-09-14

申请号：US10079855

申请日：2002-02-22

申请人： Osamu Komuro ,  Hidetoshi Morokuma ,  Chie Shishido

发明人： Osamu Komuro ,  Hidetoshi Morokuma ,  Chie Shishido

IPC分类号： G01N23225

CPC分类号： G03F7/70641 ,  B82Y10/00 ,  B82Y40/00 ,  G03F7/70625 ,  H01J37/304 ,  H01J37/3174

摘要： In order to accurately monitor changes in exposure conditions (changes in exposure level and focus) at a product wafer level during lithography, changes in exposure conditions can be calculated by acquiring electron beam images of a first pattern portion and a second pattern portion different from one another in terms of the tendency of the changes in dimensional characteristic quantities against the changes in exposure conditions, then calculating the respective dimensional characteristic quantities of the first pattern portion and the second pattern portion, and applying these dimensional characteristic quantities to the models which logically link the exposure conditions and the dimensional characteristic quantities. Hereby, it is possible to supply the process conditions change monitoring systems and methods that enable output of accurate changes in exposure level and focus.

公开(公告)号：US06587581B1

公开(公告)日：2003-07-01

申请号：US09006371

申请日：1998-01-12

申请人： Yukio Matsuyama ,  Yuji Takagi ,  Takashi Hiroi ,  Maki Tanaka ,  Asahiro Kuni ,  Junzou Azuma ,  Shunji Maeda ,  Chie Shishido

发明人： Yukio Matsuyama ,  Yuji Takagi ,  Takashi Hiroi ,  Maki Tanaka ,  Asahiro Kuni ,  Junzou Azuma ,  Shunji Maeda ,  Chie Shishido

IPC分类号： G06K900

CPC分类号： G06T7/001 ,  G01N21/8851 ,  G01N21/95607 ,  G06T5/008 ,  G06T5/40 ,  G06T5/50 ,  G06T7/30 ,  G06T2207/10061 ,  G06T2207/30148 ,  H01J37/222 ,  H01J37/28 ,  H01J2237/2817

摘要： The present invention provides a scanning electron microscope (SEM) or optical inspection method and apparatus which correct differences in brightness between comparison images and thus which is capable of detecting a fine defect with a high degree of reliability without causing any false defect detection. According to the present invention, the brightness values of a pattern, which should be essentially the same, contained in two detected images to be compared are corrected in such a manner that, even if there may be a brightness difference in a portion free from defects, the brightness difference is reduced to such a degree so that it can be recognized as a normal portion. Also, a limit for the amount of correction is furnished in advance, and correction exceeding such limit value is not performed. Such correction prevents the difference in brightness that should be permitted as non-defective from being falsely recognized as a defect without overlooking great differences in brightness due to a defect.

摘要翻译： 本发明提供了一种扫描电子显微镜（SEM）或光学检查方法和装置，其校正比较图像之间的亮度差异，从而能够以高可靠性检测精细缺陷而不引起任何假缺陷检测。 根据本发明，将要被比较的两个检测图像中包含的基本上相同的图案的亮度值以这样的方式进行校正：即使在没有缺陷的部分中可能存在亮度差 ，亮度差降低到这样的程度，从而可以将其识别为正常部分。 此外，预先提供校正量的限制，并且不执行超过该限制值的校正。 这样的校正可以防止由于缺陷而将不允许的亮度差错误地识别为缺陷，而不会因为缺陷而忽略亮度的很大差异。

公开(公告)号：US06347150B1

公开(公告)日：2002-02-12

申请号：US08932193

申请日：1997-09-17

申请人： Takashi Hiroi ,  Maki Tanaka ,  Masahiro Watanabe ,  Asahiro Kuni ,  Hiroyuki Shinada ,  Mari Nozoe ,  Aritoshi Sugimoto ,  Chie Shishido

发明人： Takashi Hiroi ,  Maki Tanaka ,  Masahiro Watanabe ,  Asahiro Kuni ,  Hiroyuki Shinada ,  Mari Nozoe ,  Aritoshi Sugimoto ,  Chie Shishido

IPC分类号： G06K964

CPC分类号： G06T7/001 ,  G06T2207/10056 ,  G06T2207/30148

摘要： The present invention relates to detection of defects with simple specification of the coordinates, in the inspection of an object having a plurality of patterns in which a portion having the two-dimensional repetition and portions having the repetition only in the X direction and in the Y direction are mixedly present. The cross comparison between a notice point and comparison points, for example, which are repetitive pitches away from the notice point, is carried out, and only the portion having the difference which can be found out with any of the comparison points is extracted as a defect candidate, which results in that the portion having the two-dimensional repetition as well as the portion having the repetition only in the X direction or in the Y direction can be inspected. As a result, while the portion, such as an isolated point, having no repetition both in the X direction and in the Y direction is extracted as the defect candidate, the defect candidate is not treated as the defect in the case where the defect candidate of interest occurs regularly in a plurality of objects to be inspected, so that such a defect candidate is excluded to extract only a true defect.

摘要翻译： 本发明涉及通过简单的坐标指定来检测缺陷，在检查具有多个图案的物体时，其中具有二维重复的部分和仅在X方向上重复的部分和Y 方向混合存在。 执行通知点与比较点之间的交叉比较，比较点例如是远离通知点的重复间距，并且只有具有任何一个比较点可以发现的具有差异的部分被提取为 缺陷候补，这导致可以检查具有二维重复的部分以及仅在X方向或Y方向上具有重复的部分。 结果，虽然提取了在X方向和Y方向上都没有重复的诸如孤立点的部分作为缺陷候选，但是在缺陷候选者的情况下，缺陷候选不被视为缺陷 感兴趣的事件定期发生在要检查的多个对象中，因此排除这样的缺陷候选者仅提取真实的缺陷。

公开(公告)号：US20130262027A1

公开(公告)日：2013-10-03

申请号：US13880429

申请日：2011-10-21

申请人： Chie Shishido ,  Maki Tanaka ,  Atsushi Miyamoto ,  Akira Hamamatsu ,  Manabu Yano

发明人： Chie Shishido ,  Maki Tanaka ,  Atsushi Miyamoto ,  Akira Hamamatsu ,  Manabu Yano

IPC分类号： G01B21/04

CPC分类号： G01B21/04 ,  G01B15/04 ,  H01L22/12

摘要： A model based measurement method is capable of estimating a cross-sectional shape by matching various pre-created cross-sectional shapes with a library of SEM signal waveforms. The present invention provides a function for determining whether or not it is appropriate to create a model of a cross-sectional shape or a function for verifying the accuracy of estimation results to a conventional model based measurement method, wherein a solution space (expected solution space) is obtained by matching library waveforms and is displayed before measuring the real pattern by means of model based measurement. Moreover, after the real pattern is measured by means of model based measurement, the solution space (real solution space) is obtained by matching the real waveforms with the library waveforms and is displayed.

摘要翻译： 基于模型的测量方法能够通过将各种预先创建的横截面形状与SEM信号波形的库进行匹配来估计横截面形状。 本发明提供一种功能，用于确定是否适于创建横截面形状的模型或用于验证估计结果的准确性的功能，以用于基于常规的基于模型的测量方法，其中，解空间（预期解空间 ）通过匹配库波形获得，并且在通过基于模型的测量测量实际图案之前显示。 此外，在通过基于模型的测量来测量实际模式之后，通过将实际波形与库波形相匹配来获得解空间（实解空间），并显示。

公开(公告)号：US08331651B2

公开(公告)日：2012-12-11

申请号：US13231394

申请日：2011-09-13

申请人： Tomofumi Nishiura ,  Atsushi Miyamoto ,  Chie Shishido ,  Takumichi Sutani

发明人： Tomofumi Nishiura ,  Atsushi Miyamoto ,  Chie Shishido ,  Takumichi Sutani

IPC分类号： G06K9/00

CPC分类号： G06T7/001 ,  G06K9/6255 ,  G06T2207/10056 ,  G06T2207/30148 ,  H01L22/12 ,  H01L2924/0002 ,  H01L2924/00

摘要： An apparatus and method for inspecting a defect of a circuit pattern formed on a semiconductor wafer includes a defect classifier have a comparison shape forming section for forming a plurality of comparison shapes corresponding to an SEM image of an inspection region by deforming the shape of the circuit pattern in accordance with a plurality of shape deformation rules using design data corresponding to the circuit pattern within the inspection region and a shape similar to the SEM image of the inspection region out of the plurality of comparison shapes formed and selected as the comparison shape, and a shape comparing and classifying section for classifying the SEM image using information of the comparison shape selected in the comparison shape forming section and the inspection shape of the circuit pattern of the SEM image of the inspection region.

摘要翻译： 用于检查形成在半导体晶片上的电路图案的缺陷的装置和方法包括：缺陷分类器，具有比较形状形成部，用于通过使电路的形状变形来形成与检查区域的SEM图像对应的多个比较形状 使用与检查区域内的电路图案相对应的设计数据的多个形状变形规则的形状以及形成和选择为比较形状的多个比较形状中的检查区域的SEM图像的形状，以及 形状比较和分类部分，用于使用在比较形状形成部分中选择的比较形状的信息和检查区域的SEM图像的电路图案的检查形状来对SEM图像进行分类。

公开(公告)号：US08110800B2

公开(公告)日：2012-02-07

申请号：US12370870

申请日：2009-02-13

申请人： Chie Shishido ,  Maki Tanaka ,  Atsushi Miyamoto

发明人： Chie Shishido ,  Maki Tanaka ,  Atsushi Miyamoto

IPC分类号： H01J37/26

CPC分类号： G03F1/84 ,  G03F1/86 ,  G03F7/70625

摘要： The present invention is for providing a scanning electron microscope system adapted to output contour information fitting in with the real pattern edge end of a sample, and is arranged to generate a local projection waveform by projecting the scanning electron microscope image in the tangential direction with respect to the pattern edge at each point of the pattern edge of the scanning electron microscope image, estimate the cross-sectional shape of the pattern transferred on the sample by applying the local projection waveform generated at each point to a library, which has previously been created, correlating the cross-sectional shape with the electron beam signal waveform, obtain position coordinate of the edge end fitting in with the cross-sectional shape, and output the contour of the pattern as a range of position coordinates.

摘要翻译： 本发明提供一种扫描电子显微镜系统，其适于输出与样品的实际图案边缘端相匹配的轮廓信息，并且被布置成通过相对于扫描电子显微镜图像沿切线方向投影而产生局部投影波形 到扫描电子显微镜图像的图案边缘的每个点处的图案边缘，通过将在每个点处生成的局部投影波形应用到先前已经创建的库来估计在样本上传送的图案的横截面形状 将横截面形状与电子束信号波形相关联，以横截面形状获得边缘端配件的位置坐标，并将图案的轮廓作为位置坐标的范围输出。

公开(公告)号：US20110268363A1

公开(公告)日：2011-11-03

申请号：US13143346

申请日：2009-12-10

申请人： Mayuka Osaki ,  Chie Shishido

发明人： Mayuka Osaki ,  Chie Shishido

IPC分类号： H01J37/26 ,  G06K9/62

CPC分类号： G03F7/70633 ,  G06T7/001 ,  G06T2200/24 ,  G06T2207/10061 ,  G06T2207/30148 ,  H01L22/12 ,  H01L2924/0002 ,  H01L2924/00

摘要： Provided is a method for evaluating superimposition of a pattern, wherein an alignment shift quantity and a shift direction can be evaluated at a discretionary position within an exposure shot. The method uses a superimposition evaluation pattern, and the image of the superimposition evaluation pattern is acquired (S1) using electron microscopes (10, 109), the shift quantity and direction in each exposure step are calculated (S2) by comparing the acquired image with layout information, which has been registered in a storage section (111) and is on the layout with which the superimposition evaluation pattern is to be arranged, and the evaluation results are displayed (S3).

摘要翻译： 提供了一种用于评估图案的叠加的方法，其中可以在曝光拍摄中的任意位置评估对准偏移量和偏移方向。 该方法使用叠加评估模式，并且使用电子显微镜（10,109）获取叠加评估图案的图像（S1），通过将获取的图像与所获取的图像进行比较来计算每个曝光步骤中的移动量和方向（S2） 布局信息已被登记在存储部分（111）中并且处于要布置叠加评估模式的布局上，并且显示评估结果（S3）。