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公开(公告)号:US07402047B2
公开(公告)日:2008-07-22
申请号:US11449815
申请日:2006-06-09
IPC分类号: H01R12/00
CPC分类号: G06K19/07732 , G06K19/07 , G06K19/0719 , G06K19/072 , G06K19/07733 , G06K19/07743 , H01L2224/05553 , H01L2224/48137 , H01L2924/01055 , H01L2924/01078 , H01L2924/01079 , H01L2924/14
摘要: A multifunction IC card (MFC) has compatibility with a multimedia card, an SD card, etc. in that connector terminals (#1 through #13) are disposed on a card substrate (1) in two rows in a zigzag fashion, and realizes multifunction facilities in that a memory card unit (3) and an SIM (Subscriber Identity Module) card unit (4) are respectively exclusively connected and mounted to predetermined terminals of the connector terminals (#1 through #13). The memory card unit (3) and the SIM card unit (4) are respectively separately provided with areas for storing secrete codes for security. Thus, one IC card is capable of implementing multifunction facilities different in security level. Owing to the adoption of a plural-column layout corresponding to a form typified by the zigzag fashion in an array of the connector terminals, a relatively simple structure can be adopted in a card slot, wherein the amounts of protrusion of slot terminals in a card slot are alternately changed in association with a zigzag section, and the slot terminals are disposed in a row in parallel as a whole.
摘要翻译: 多功能IC卡(MFC)与多媒体卡,SD卡等的兼容性在该连接器端子(#1〜#13)中以锯齿形的方式配置在卡片基板(1)上两行, 存储卡单元(3)和SIM(用户识别模块)卡单元(4)分别专门连接并安装到连接器端子(#1至#13)的预定端子上的多功能设施。 存储卡单元(3)和SIM卡单元(4)分别设置有用于存储安全密码的区域。 因此,一个IC卡能够实现安全级别不同的多功能设备。 由于在连接器端子的阵列中采用对应于由之字形形式表示的形式的多列布局,所以在卡槽中可以采用相对简单的结构,其中卡终端在卡中的突出量 插槽与锯齿形部分交替地改变,并且插槽端子整体上平行布置成一排。
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公开(公告)号:US07291018B2
公开(公告)日:2007-11-06
申请号:US11449765
申请日:2006-06-09
IPC分类号: H01R12/00
CPC分类号: G06K19/07732 , G06K19/07 , G06K19/0719 , G06K19/072 , G06K19/07733 , G06K19/07743 , H01L2224/05553 , H01L2224/48137 , H01L2924/01055 , H01L2924/01078 , H01L2924/01079 , H01L2924/14
摘要: A multifunction IC card (MFC) has compatibility with a multimedia card, an SD card, etc. in that connector terminals (#1 through #13) are disposed on a card substrate (1) in two rows in a zigzag fashion, and realizes multifunction facilities in that a memory card unit (3) and an SIM (Subscriber Identity Module) card unit (4) are respectively exclusively connected and mounted to predetermined terminals of the connector terminals (#1 through #13). The memory card unit (3) and the SIM card unit (4) are respectively separately provided with areas for storing secrete codes for security. Thus, one IC card is capable of implementing multifunction facilities different in security level. Owing to the adoption of a plural-column layout corresponding to a form typified by the zigzag fashion in an array of the connector terminals, a relatively simple structure can be adopted in a card slot, wherein the amounts of protrusion of slot terminals in a card slot are alternately changed in association with a zigzag section, and the slot terminals are disposed in a row in parallel as a whole.
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公开(公告)号:US07267287B2
公开(公告)日:2007-09-11
申请号:US11619129
申请日:2007-01-02
CPC分类号: G06K19/07735 , G06K19/07 , G06K19/073 , G06K19/07732 , H01L23/5388 , H01L23/60 , H01L23/62 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L25/16 , H01L25/165 , H01L25/18 , H01L27/0251 , H01L2224/05553 , H01L2224/05554 , H01L2224/05599 , H01L2224/05624 , H01L2224/05647 , H01L2224/32145 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48145 , H01L2224/48227 , H01L2224/48228 , H01L2224/49113 , H01L2224/73265 , H01L2224/85399 , H01L2225/06562 , H01L2924/00014 , H01L2924/01019 , H01L2924/01021 , H01L2924/01039 , H01L2924/01055 , H01L2924/01079 , H01L2924/10161 , H01L2924/1301 , H01L2924/13091 , H01L2924/14 , H01L2924/16152 , H01L2924/181 , H01L2924/19041 , H01L2924/19105 , H01L2924/19107 , H01L2924/3011 , H01L2924/3025 , Y10S257/922 , H01L2924/00012 , H01L2924/00 , H01L2224/45015 , H01L2924/207
摘要: An IC card capable of reinforcing the prevention of the electrostatic damage without causing a rise in the cost of a semiconductor integrated circuit chip. The semiconductor integrated circuit chip (2) is mounted on a card substrate (1), and plural connection terminals (3) are exposed. The connection terminals are connected to predetermined external terminals (4) of the semiconductor integrated circuit chip, first overvoltage protection elements (7, 8, 9) connected to the external terminals are integrated in the semiconductor integrated circuit chip, and second overvoltage protection elements such as surface-mount type varistors (11) connected to the connection terminals are mounted on the card substrate. The varistors are variable resistor elements having a current tolerating ability greater than that of the first overvoltage protection elements. The varistors have been selected by taking into consideration a relationship between the characteristics and the ability of the first overvoltage protection elements contained in the semiconductor integrated circuit chip, and exhibit the effect for preventing the electrostatic damage.
摘要翻译: 一种IC卡,其能够增强防止静电损伤,而不会导致半导体集成电路芯片的成本上升。 半导体集成电路芯片(2)安装在卡片基板(1)上,多个连接端子(3)露出。 连接端子连接到半导体集成电路芯片的预定外部端子(4),连接到外部端子的第一过电压保护元件(7,8,9)集成在半导体集成电路芯片中,第二过电压保护元件 因为连接到连接端子的表面安装型变阻器(11)安装在卡片基板上。 变阻器是具有比第一过电压保护元件大的电流容许能力的可变电阻器元件。 通过考虑包含在半导体集成电路芯片中的第一过电压保护元件的特性和能力之间的关系,已经选择了变阻器,并且具有防止静电损坏的效果。
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公开(公告)号:US06573567B1
公开(公告)日:2003-06-03
申请号:US09689663
申请日:2000-10-13
IPC分类号: H01L2362
CPC分类号: G06K19/07735 , G06K19/07 , G06K19/073 , G06K19/07732 , H01L23/5388 , H01L23/60 , H01L23/62 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L25/16 , H01L25/165 , H01L25/18 , H01L27/0251 , H01L2224/05553 , H01L2224/05554 , H01L2224/05599 , H01L2224/05624 , H01L2224/05647 , H01L2224/32145 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48145 , H01L2224/48227 , H01L2224/48228 , H01L2224/49113 , H01L2224/73265 , H01L2224/85399 , H01L2225/06562 , H01L2924/00014 , H01L2924/01019 , H01L2924/01021 , H01L2924/01039 , H01L2924/01055 , H01L2924/01079 , H01L2924/10161 , H01L2924/1301 , H01L2924/13091 , H01L2924/14 , H01L2924/16152 , H01L2924/181 , H01L2924/19041 , H01L2924/19105 , H01L2924/19107 , H01L2924/3011 , H01L2924/3025 , Y10S257/922 , H01L2924/00012 , H01L2924/00 , H01L2224/45015 , H01L2924/207
摘要: An IC card capable of reinforcing the prevention of the electrostatic damage without causing a rise in the cost of a semiconductor integrated circuit chip. The semiconductor integrated circuit chip (2) is mounted on a card substrate (1), and plural connection terminals (3) are exposed. The connection terminals are connected to predetermined external terminals (4) of the semiconductor integrated circuit chip, first overvoltage protection elements (7, 8, 9) connected to the external terminals are integrated in the semiconductor integrated circuit chip, and second overvoltage protection elements such as surface-mount type varistors (11) connected to the connection terminals are mounted on the card substrate. The varistors are variable resistor elements having a current tolerating ability greater than that of the first overvoltage protection elements. The varistors have been selected by taking into consideration a relationship between the characteristics and the ability of the first overvoltage protection elements contained in the semiconductor integrated circuit chip, and exhibit the effect for preventing the electrostatic damage.
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公开(公告)号:US08018038B2
公开(公告)日:2011-09-13
申请号:US12835847
申请日:2010-07-14
IPC分类号: H01L23/02 , H01L23/52 , H01L23/538 , H01L23/58 , G06K19/07
CPC分类号: G06K19/07735 , G06K19/07 , G06K19/073 , G06K19/07732 , H01L23/5388 , H01L23/60 , H01L23/62 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L25/16 , H01L25/165 , H01L25/18 , H01L27/0251 , H01L2224/05553 , H01L2224/05554 , H01L2224/05599 , H01L2224/05624 , H01L2224/05647 , H01L2224/32145 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48145 , H01L2224/48227 , H01L2224/48228 , H01L2224/49113 , H01L2224/73265 , H01L2224/85399 , H01L2225/06562 , H01L2924/00014 , H01L2924/01019 , H01L2924/01021 , H01L2924/01039 , H01L2924/01055 , H01L2924/01079 , H01L2924/10161 , H01L2924/1301 , H01L2924/13091 , H01L2924/14 , H01L2924/16152 , H01L2924/181 , H01L2924/19041 , H01L2924/19105 , H01L2924/19107 , H01L2924/3011 , H01L2924/3025 , Y10S257/922 , H01L2924/00012 , H01L2924/00 , H01L2224/45015 , H01L2924/207
摘要: An IC card capable of reinforcing the prevention of the electrostatic damage without causing a rise in the cost of a semiconductor integrated circuit chip. The semiconductor integrated circuit chip (2) is mounted on a card substrate (1), and plural connection terminals (3) are exposed. The connection terminals are connected to predetermined external terminals (4) of the semiconductor integrated circuit chip, first overvoltage protection elements (7, 8, 9) connected to the external terminals are integrated in the semiconductor integrated circuit chip, and second overvoltage protection elements such as surface-mount type varistors (11) connected to the connection terminals are mounted on the card substrate. The varistors are variable resistor elements having a current tolerating ability greater than that of the first overvoltage protection elements. The varistors have been selected by taking into consideration a relationship between the characteristics and the ability of the first overvoltage protection elements contained in the semiconductor integrated circuit chip, and exhibit the effect for preventing the electrostatic damage.
摘要翻译: 一种IC卡,其能够增强防止静电损伤,而不会导致半导体集成电路芯片的成本上升。 半导体集成电路芯片(2)安装在卡片基板(1)上,多个连接端子(3)露出。 连接端子连接到半导体集成电路芯片的预定外部端子(4),连接到外部端子的第一过电压保护元件(7,8,9)集成在半导体集成电路芯片中,第二过电压保护元件 因为连接到连接端子的表面安装型变阻器(11)安装在卡片基板上。 变阻器是具有比第一过电压保护元件大的电流容许能力的可变电阻器元件。 通过考虑包含在半导体集成电路芯片中的第一过电压保护元件的特性和能力之间的关系,已经选择了变阻器,并且具有防止静电损坏的效果。
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公开(公告)号:US07552876B2
公开(公告)日:2009-06-30
申请号:US11924044
申请日:2007-10-25
IPC分类号: G06K19/06
CPC分类号: G06K19/07732 , G06K19/07743 , G11C5/066 , H01L25/18 , H01L2223/54406 , H01L2223/54486 , H01L2224/48145 , H01L2224/48227 , H01L2224/49171 , H01L2225/06562 , H01L2924/01021 , H01L2924/01039 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H01L2924/3011 , H05K1/117 , H01L2924/00 , H01L2924/00012
摘要: An IC card has a card substrate having semiconductor integrated circuit chips mounted thereon and a plurality of connector terminals formed thereon. The connector terminals are exposed from a casing. The connector terminals are laid out in plural sequences in staggered form between sequences adjacent to one another forward and backward as viewed in an IC card inserting direction. Owing to the adoption of the staggered layout, a structure or configuration wherein the amounts of protrusions of socket terminals of a card socket are changed and the socket terminals are laid out in tandem, can be adopted with relative ease. If a connector terminal arrangement of a downward or low-order IC card is adopted as a specific connector terminal sequence as it is, whereas a function dedicated for an upward or high-order IC card is assigned to another staggered connector terminal arrangement, then backward compatibility can also be implemented with ease.
摘要翻译: IC卡具有安装在其上的半导体集成电路芯片的卡片基板和形成在其上的多个连接器端子。 连接器端子从壳体露出。 连接器端子以IC卡插入方向观察时以相互相邻的序列之间的交错形式以多个顺序布置。 由于采用交错布局,所以可以相对容易地采用其中插座插座的插座端子的突出量改变并且插座端子串联布置的结构或配置。 如果采用向下或低阶IC卡的连接器端子排列作为特定的连接器端子序列,而专门用于向上或高位IC卡的功能被分配给另一个交错的连接器端子装置,则向后 兼容性也可以轻松实现。
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公开(公告)号:US20080257968A1
公开(公告)日:2008-10-23
申请号:US11924044
申请日:2007-10-25
IPC分类号: G06K19/06
CPC分类号: G06K19/07732 , G06K19/07743 , G11C5/066 , H01L25/18 , H01L2223/54406 , H01L2223/54486 , H01L2224/48145 , H01L2224/48227 , H01L2224/49171 , H01L2225/06562 , H01L2924/01021 , H01L2924/01039 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H01L2924/3011 , H05K1/117 , H01L2924/00 , H01L2924/00012
摘要: An IC card has a card substrate having semiconductor integrated circuit chips mounted thereon and a plurality of connector terminals formed thereon. The connector terminals are exposed from a casing. The connector terminals are laid out in plural sequences in staggered form between sequences adjacent to one another forward and backward as viewed in an IC card inserting direction. Owing to the adoption of the staggered layout, a structure or configuration wherein the amounts of protrusions of socket terminals of a card socket are changed and the socket terminals are laid out in tandem, can be adopted with relative ease. If a connector terminal arrangement of a downward or low-order IC card is adopted as a specific connector terminal sequence as it is, whereas a function dedicated for an upward or high-order IC card is assigned to another staggered connector terminal arrangement, then backward compatibility can also be implemented with ease.
摘要翻译: IC卡具有安装在其上的半导体集成电路芯片的卡片基板和形成在其上的多个连接器端子。 连接器端子从壳体露出。 连接器端子以IC卡插入方向观察时以相互相邻的序列之间的交错形式以多个顺序布置。 由于采用交错布局,所以可以相对容易地采用其中插座插座的插座端子的突出量改变并且插座端子串联布置的结构或配置。 如果采用向下或低阶IC卡的连接器端子排列作为特定的连接器端子序列,而专门用于向上或高位IC卡的功能被分配给另一个交错的连接器端子装置,则向后 兼容性也可以轻松实现。
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公开(公告)号:US07234644B2
公开(公告)日:2007-06-26
申请号:US11378277
申请日:2006-03-20
CPC分类号: G06K19/07732 , G06K19/07743 , G11C5/066 , H01L25/18 , H01L2223/54406 , H01L2223/54486 , H01L2224/48145 , H01L2224/48227 , H01L2224/49171 , H01L2225/06562 , H01L2924/01021 , H01L2924/01039 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H01L2924/3011 , H05K1/117 , H01L2924/00 , H01L2924/00012
摘要: An IC card has a card substrate having semiconductor integrated circuit chips mounted thereon and a plurality of connector terminals formed thereon. The connector terminals are exposed from a casing. The connector terminals are laid out in plural sequences in staggered form between sequences adjacent to one another forward and backward as viewed in an IC card inserting direction. Owing to the adoption of the staggered layout, a structure or configuration wherein the amounts of protrusions of socket terminals of a card socket are changed and the socket terminals are laid out in tandem, can be adopted with relative ease. If a connector terminal arrangement of a downward or low-order IC card is adopted as a specific connector terminal sequence as it is, whereas a function dedicated for an upward or high-order IC card is assigned to another staggered connector terminal arrangement, then backward compatibility can also be implemented with ease.
摘要翻译: IC卡具有安装在其上的半导体集成电路芯片的卡片基板和形成在其上的多个连接器端子。 连接器端子从壳体露出。 连接器端子以IC卡插入方向观察时以相互相邻的序列之间的交错形式以多个顺序布置。 由于采用交错布局,所以可以相对容易地采用其中插座插座的插座端子的突出量改变并且插座端子串联布置的结构或配置。 如果采用向下或低阶IC卡的连接器端子排列作为特定的连接器端子序列,而专门用于向上或高位IC卡的功能被分配给另一个交错的连接器端子装置,则向后 兼容性也可以轻松实现。
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公开(公告)号:US20070023530A1
公开(公告)日:2007-02-01
申请号:US11487812
申请日:2006-07-17
CPC分类号: G06K19/077 , G06K19/07739 , Y10S439/945
摘要: A card tray to be mounted to a memory card can make the memory card mountable in a card slot for memory cards conforming to standards different from those to which the memory card conforms. The card tray has a main body and a recessed mount section. The recessed mount section is formed such that the holder of a second memory card can be mounted to one of the major surfaces of the main body. A memory-card-mounted body is produced when the second memory card is mounted to the recessed mount section. The card tray is configured such that, when the first memory card is placed on the memory-card-mounted body with the left and right edges thereof aligned with each other, the contact pieces of the first memory card and the contact pieces of the second memory card have longitudinally overlapping parts and transversally overlapping parts as viewed from above.
摘要翻译: 要安装到存储卡的卡片托盘可以使存储卡可安装在符合与存储卡所符合的标准不同的存储卡的卡插槽中。 卡片托盘具有主体和凹入的安装部分。 凹入的安装部分形成为使得第二存储卡的保持器可以安装到主体的主要表面之一。 当第二存储卡安装到凹入的安装部分时,产生存储卡安装体。 卡片托盘被构造成使得当第一存储卡被放置在其左右边缘彼此对准的存储卡安装体上时,第一存储卡的接触片和第二存储卡的接触片 存储卡具有从上方观察的纵向重叠部分和横向重叠部分。
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公开(公告)号:US20060183355A1
公开(公告)日:2006-08-17
申请号:US11399396
申请日:2006-04-07
IPC分类号: H01R12/00
CPC分类号: G06K19/0719 , G06K19/072 , G06K19/077 , G06K19/07732 , G06K19/07733 , G06K19/07743 , G06K19/07745 , H01L2224/48137 , H01R27/00
摘要: A multifunction IC card (MFC) has compatibility with a multimedia card, an SD card, etc. in that connector terminals (#1 through #13) are disposed on a card substrate (1) in two rows in a zigzag fashion, and realizes multifunction facilities in that a memory card unit (3) and an SIM (Subscriber Identity Module) card unit (4) are respectively connected and mounted to predetermined terminals of the connector terminals (#1 through #13). The memory card unit (3) and the SIM card unit (4) are respectively separately provided with areas for storing secret codes for security. Thus, one IC card is capable of implementing multifunction facilities different in security level. Owing to the adoption of a plural-column layout corresponding to a form typified by the zigzag fashion in an array of the connector terminals, a relatively simple structure can be adopted in a card slot.
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