公开(公告)号：US20110306182A1

公开(公告)日：2011-12-15

申请号：US13206181

申请日：2011-08-09

申请人： Fumitsugu Fukuyo ,  Kenshi Fukumitsu ,  Naoki Uchiyama ,  Ryuji Sugiura

发明人： Fumitsugu Fukuyo ,  Kenshi Fukumitsu ,  Naoki Uchiyama ,  Ryuji Sugiura

IPC分类号： H01L21/78

CPC分类号： H01L21/2633 ,  B23K26/0853 ,  B23K26/40 ,  B23K26/53 ,  B23K2101/40 ,  B23K2103/50 ,  B28D1/221 ,  H01L21/6835 ,  H01L21/6836 ,  H01L21/78 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L2221/68327 ,  H01L2221/68336 ,  H01L2224/274 ,  H01L2224/2919 ,  H01L2224/83191 ,  H01L2224/8385 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/0106 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/07802 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/351 ,  H01L2924/3512 ,  H01L2924/00

摘要： Multiphoton absorption is generated, so as to form a part which is intended to be cut 9 due to a molten processed region 13 within a silicon wafer 11, and then an adhesive sheet 20 bonded to the silicon wafer 11 is expanded. This cuts the silicon wafer 11 along the part which is intended to be cut 9 with a high precision into semiconductor chips 25. Here, opposing cut sections 25a, 25a of neighboring semiconductor chips 25, 25 are separated from each other from their close contact state, whereby a die-bonding resin layer 23 is also cut along the part which is intended to be cut 9. Therefore, the silicon wafer 11 and die-bonding resin layer 23 can be cut much more efficiently than in the case where the silicon wafer 11 and die-bonding resin layer 23 are cut with a blade without cutting a base 21.

摘要翻译： 产生多光子吸收，从而形成由于硅晶片11内的熔融处理区域13而被切割的部分9，然后，粘合到硅晶片11的粘合片20膨胀。 这样，将硅晶片11沿着要被切割的部分9以高精度切割成半导体芯片25.这里，相邻的半导体芯片25,25的相对的切割部分25a，25a从它们的紧密接触状态彼此分离 由此，沿着要切割的部分9也切割芯片接合树脂层23.因此，与硅晶片11和芯片接合树脂层23的情况相比，可以更有效地切割硅晶片11和芯片接合树脂层23。 11和芯片接合树脂层23用刀片切割而不切割基部21。

公开(公告)号：US20110021004A1

公开(公告)日：2011-01-27

申请号：US12896296

申请日：2010-10-01

申请人： Fumitsugu FUKUYO ,  Kenshi Fukumitsu ,  Naoki Uchiyama ,  Toshimitsu Wakuda

发明人： Fumitsugu FUKUYO ,  Kenshi Fukumitsu ,  Naoki Uchiyama ,  Toshimitsu Wakuda

IPC分类号： H01L21/302 ,  B23K26/00

CPC分类号： H01L21/78 ,  B23K20/023 ,  B23K20/16 ,  B23K20/233 ,  B23K20/26 ,  B23K26/03 ,  B23K26/032 ,  B23K26/034 ,  B23K26/046 ,  B23K26/0624 ,  B23K26/066 ,  B23K26/073 ,  B23K26/0853 ,  B23K26/16 ,  B23K26/364 ,  B23K26/40 ,  B23K26/53 ,  B23K2101/40 ,  B23K2103/50 ,  B28D5/0011 ,  B65G2249/04 ,  C03B33/023 ,  C03B33/082 ,  C03B33/102 ,  C03C23/0025 ,  G02F1/1368 ,  H01L21/6836 ,  H01L2221/68327 ,  Y02P40/57 ,  Y10T29/49144 ,  Y10T83/0341

摘要： A laser beam machining method and a laser beam machining device capable of cutting a work without producing a fusing and a cracking out of a predetermined cutting line on the surface of the work, wherein a pulse laser beam is radiated on the predetermined cut line on the surface of the work under the conditions causing a multiple photon absorption and with a condensed point aligned to the inside of the work, and a modified area is formed inside the work along the predetermined determined cut line by moving the condensed point along the predetermined cut line, whereby the work can be cut with a rather small force by cracking the work along the predetermined cut line starting from the modified area and, because the pulse laser beam radiated is not almost absorbed onto the surface of the work, the surface is not fused even if the modified area is formed.

摘要翻译： 一种激光束加工方法和激光束加工装置，其能够切割工件而不产生在工件表面上的预定切割线的定影和裂纹，其中脉冲激光束照射在工件的预定切割线上 在导致多光子吸收的条件下并且具有与工件内部对准的凝聚点的工作表面，并且沿着预定的切割线沿着预定的切割线沿着预定的切割线移动凝聚点而在工件内部形成改质区域 由此，可以用相当小的力通过从修改区域开始沿着预定切割线的工作而切割工件，并且因为辐射的脉冲激光束几乎不被吸收到工件的表面上，所以表面不熔合 即使形成了修改区域。

公开(公告)号：US20100311313A1

公开(公告)日：2010-12-09

申请号：US12744714

申请日：2008-11-18

申请人： Naoki Uchiyama

发明人： Naoki Uchiyama

IPC分类号： B24B1/00 ,  B24B7/22 ,  B23K26/36

CPC分类号： H01L21/304 ,  B23K26/0823 ,  B23K26/0869 ,  B23K26/40 ,  B23K26/53 ,  B23K2101/40 ,  B23K2103/50 ,  B24B1/00 ,  B24B7/228

摘要： A working object grinding method capable of grinding a working object reliably is provided. A working object 1 is irradiated with a laser beam while locating a converging point therewithin, so as to form a reformed region 7 in the working object 1 along a reformed-region forming line set at a predetermined distance inside from an outer edge of the working object 1 along the outer edge, and a rear face 21 of the working object 1 is ground. As a result, the reformed region 7 or fissures C1 extending therefrom can inhibit fissures generated in an outer edge portion 25 upon grinding the working object 1 from advancing to the inside, whereby the working object 1 can be prevented from fracturing.

摘要翻译： 提供能够可靠地研磨加工对象物的工件对象研磨方法。 工件1用激光束照射，同时在其间定位会聚点，以便沿加工区域形成线形成重新形成区域7，该重整区域沿着设置在工作对象1的外边缘内部预定距离内的重整区域形成线 物体1沿着外边缘，并且加工对象物1的背面21被研磨。 结果，由此可以使被加工区域7或从其延伸的裂缝C1能够抑制加工对象物1向内侧磨削而在外缘部25产生裂纹，能够防止加工对象物1的破裂。

公开(公告)号：US20100203707A1

公开(公告)日：2010-08-12

申请号：US12762444

申请日：2010-04-19

申请人： Yoshimaro Fujii ,  Fumitsugu Fukuyo ,  Kenshi Fukumitsu ,  Naoki Uchiyama

发明人： Yoshimaro Fujii ,  Fumitsugu Fukuyo ,  Kenshi Fukumitsu ,  Naoki Uchiyama

IPC分类号： H01L21/78

CPC分类号： H01L21/78 ,  B23K26/0057 ,  B23K26/0622 ,  B23K26/40 ,  B23K26/53 ,  B23K2103/50 ,  B23K2203/50 ,  B28D5/00 ,  B28D5/0011 ,  H01L21/268 ,  H01L21/304 ,  H01L21/30604 ,  H01L21/6836 ,  H01L21/76894 ,  H01L23/544 ,  H01L23/562 ,  H01L2221/68327 ,  H01L2221/68336 ,  H01L2223/5446 ,  H01L2924/00 ,  H01L2924/0002

摘要： A substrate dividing method which can thin and divide a substrate while preventing chipping and cracking from occurring. This substrate dividing method comprises the steps of irradiating a semiconductor substrate 1 having a front face 3 formed with functional devices 19 with laser light while positioning a light-converging point within the substrate, so as to form a modified region including a molten processed region due to multiphoton absorption within the semiconductor substrate 1, and causing the modified region including the molten processed region to form a starting point region for cutting; and grinding a rear face 21 of the semiconductor substrate 1 after the step of forming the starting point region for cutting such that the semiconductor substrate 1 attains a predetermined thickness.

摘要翻译： 一种衬底分割方法，其可以在防止发生破裂和破裂的同时使衬底细分割。 该基板分割方法包括以下步骤：将具有形成有功能元件19的正面3的半导体基板1照射在基板内，同时将聚光点定位在基板内，从而形成包含熔融处理区域的改质区域 在半导体衬底1内进行多光子吸收，并且使包含熔融处理区域的改性区域形成切割起点区域; 在形成用于切割的起点区域的步骤之后，研磨半导体衬底1的后表面21，使得半导体衬底1达到预定厚度。

公开(公告)号：US20100166614A1

公开(公告)日：2010-07-01

申请号：US12377121

申请日：2007-06-21

申请人： Naoki Uchiyama ,  Tomomi Kanai

发明人： Naoki Uchiyama ,  Tomomi Kanai

IPC分类号： G01N27/12

CPC分类号： G01N27/12 ,  G01N33/0031 ,  G01N33/005

摘要： A hydrogen-gas concentration sensor comprises a substrate, and a plurality of hydrogen detecting films formed on the substrate, adjacent to one another. The hydrogen detecting films have a thin film layer, and a catalyst layer formed on the thin film layer. Each catalyst layer, when in contact with a hydrogen gas, exerts photocatalysis to hydrogenate each thin film layer reversibly and causes the electric resistance value thereof to change reversibly. The individual thin film layers have different sensitivities of a change in the hydrogen gas concentration vs. a change in the resistance value and different hydrogen gas concentration measurement ranges. The hydrogen-gas concentration sensor measures the hydrogen gas concentration with a thin film layer having a high sensitivity when the hydrogen gas concentration is low, and measures the hydrogen gas concentration with a thin film layer having a wide measurement range when the hydrogen gas concentration is high.

摘要翻译： 氢气浓度传感器包括彼此相邻的基板和形成在基板上的多个氢气检测膜。 氢检测膜具有薄膜层和形成在薄膜层上的催化剂层。 每个催化剂层当与氢气接触时进行光催化，以可逆地氢化每个薄膜层，并使其电阻值可逆地改变。 各个薄膜层具有与氢气浓度变化相对于电阻值和不同氢气浓度测量范围的变化的不同灵敏度。 当氢气浓度低时，氢气浓度传感器利用具有高灵敏度的薄膜层来测量氢气浓度，并且当氢气浓度为1时测量具有宽测量范围的薄膜层的氢气浓度 高。

公开(公告)号：US07615721B2

公开(公告)日：2009-11-10

申请号：US11250404

申请日：2005-10-17

申请人： Fumitsugu Fukuyo ,  Kenshi Fukumitsu ,  Naoki Uchiyama ,  Toshimitsu Wakuda ,  Kazuhiro Atsumi ,  Kenichi Muramatsu

发明人： Fumitsugu Fukuyo ,  Kenshi Fukumitsu ,  Naoki Uchiyama ,  Toshimitsu Wakuda ,  Kazuhiro Atsumi ,  Kenichi Muramatsu

IPC分类号： B23K26/00 ,  H01L21/78

CPC分类号： H01L21/78 ,  B23K20/023 ,  B23K20/16 ,  B23K20/233 ,  B23K20/26 ,  B23K26/03 ,  B23K26/032 ,  B23K26/034 ,  B23K26/046 ,  B23K26/0624 ,  B23K26/066 ,  B23K26/073 ,  B23K26/0853 ,  B23K26/16 ,  B23K26/364 ,  B23K26/40 ,  B23K26/53 ,  B23K2101/40 ,  B23K2103/50 ,  B28D5/0011 ,  B65G2249/04 ,  C03B33/023 ,  C03B33/082 ,  C03B33/102 ,  C03C23/0025 ,  G02F1/1368 ,  H01L21/6836 ,  H01L2221/68327 ,  Y02P40/57 ,  Y10T29/49144 ,  Y10T83/0341

摘要： A laser beam machining method and a laser beam machining device capable of cutting a work without producing a fusing and a cracking out of a predetermined cutting line on the surface of the work, wherein a pulse laser beam is radiated on the predetermined cut line on the surface of the work under the conditions causing a multiple photon absorption and with a condensed point aligned to the inside of the work, and a modified area is formed inside the work along the predetermined determined cut line by moving the condensed point along the predetermined cut line, whereby the work can be cut with a rather small force by cracking the work along the predetermined cut line starting from the modified area and, because the pulse laser beam radiated is not almost absorbed onto the surface of the work, the surface is not fused even if the modified area is formed.

摘要翻译： 一种激光束加工方法和激光束加工装置，其能够切割工件而不产生在工件表面上的预定切割线的定影和裂纹，其中脉冲激光束照射在工件的预定切割线上 在导致多光子吸收的条件下并且具有与工件内部对准的凝聚点的工作表面，并且沿着预定的切割线沿着预定的切割线沿着预定的切割线移动凝聚点而在工件内部形成改质区域 由此，可以用相当小的力通过从修改区域开始沿着预定切割线的工作而切割工件，并且因为辐射的脉冲激光束几乎不被吸收到工件的表面上，所以表面不熔合 即使形成了修改区域。

公开(公告)号：US20090202881A1

公开(公告)日：2009-08-13

申请号：US12279302

申请日：2007-02-09

申请人： Naoki Uchiyama

发明人： Naoki Uchiyama

IPC分类号： H01M8/12

CPC分类号： H01M8/04022 ,  H01M8/04111 ,  H01M2008/1293 ,  H01M2250/407 ,  Y02E60/563

摘要： A solid-oxide fuel cell having a fuel pole and an air pole joined to a solid oxide electrolyte is arranged in a combustion exhaust gas flow channel of an engine or the like (fuel cell containing section), thereby placed in a flow of high-temperature combustion exhaust gas introduced through an exhaust gas introduction section into the fuel cell containing section and discharged through an exhaust gas discharge section, so that the solid-oxide fuel cell is heated by the thermal energy of the combustion exhaust gas and generates electric power using a hydrocarbon compound and carbon oxide in the combustion exhaust gas, as fuel gas.

摘要翻译： 在发动机等的燃烧废气流路（燃料电池容纳部）中配置具有与固体氧化物电解质结合的燃料极和空气极的固体氧化物型燃料电池， 将通过排气导入部导入燃料电池容纳部的高温燃烧废气通过废气排出部排出，使得固体氧化物燃料电池被燃烧废气的热能加热，并使用 作为燃料气体的燃烧废气中的烃化合物和碳氧化物。

公开(公告)号：US20070085099A1

公开(公告)日：2007-04-19

申请号：US10571142

申请日：2004-09-09

申请人： Kenshi Fukumitsu ,  Fumitsugu Fukuyo ,  Naoki Uchiyama ,  Ryuji Sugiura ,  Kazuhiro Atsumi

发明人： Kenshi Fukumitsu ,  Fumitsugu Fukuyo ,  Naoki Uchiyama ,  Ryuji Sugiura ,  Kazuhiro Atsumi

IPC分类号： H01L33/00

CPC分类号： B23K26/0884 ,  B23K26/40 ,  B23K26/53 ,  B23K2101/40 ,  B23K2103/50 ,  B28D5/0011

摘要： A semiconductor substrate cutting method which can efficiently cut a semiconductor substrate having a front face formed with a functional device together with a die bonding resin layer is provided. A wafer 11 having a front face 3 formed with a functional device 15 is irradiated with laser light L while positioning a light-converging point P within the wafer 11 with the rear face 17 of the wafer 11 acting as a laser light incident face, so as to generate multiphoton absorption, thereby forming a starting point region for cutting 8 due to a molten processed region 13 within the wafer 11 along a line along which the substrate should be cut 5. Consequently, a fracture can be generated from the starting point region for cutting 8 naturally or with a relatively small force, so as to reach the front face 3 and rear face 17. Therefore, when an expansion film 21 is attached to the rear face 17 of the wafer 11 by way of a die bonding resin layer 23 after forming the starting point region for cutting 8 and then expanded, the wafer 11 and die bonding resin layer 23 can be cut along the line along which the substrate should be cut 5.

摘要翻译： 提供一种半导体衬底切割方法，其可以与芯片接合树脂层一起有效地切割具有由功能器件形成的正面的半导体衬底。 在晶片11的背面17作为激光入射面的状态下，将聚光点P定位在晶片11内的激光L照射形成有功能元件15的正面3的晶圆11， 以产生多光子吸收，由此由于晶片11内的熔融处理区域13沿着基板应被切割的线5而形成用于切割的起始点区域8。 因此，可以自然地以相对小的力从起始点区域8产生断裂，以到达前表面3和后表面17。 因此，在形成切割起点区域8之后，通过芯片接合树脂层23将膨胀膜21安装在晶片11的背面17上，然后膨胀时，晶片11和芯片接合树脂层23可以 沿着基板切割的线切割5。

公开(公告)号：US06549832B2

公开(公告)日：2003-04-15

申请号：US09968808

申请日：2001-10-03

申请人： Tooru Nakasako ,  Naoki Uchiyama ,  Kouji Tamenori

发明人： Tooru Nakasako ,  Naoki Uchiyama ,  Kouji Tamenori

IPC分类号： B60L1112

CPC分类号： B60W20/00 ,  B60K6/48 ,  B60K6/52 ,  B60K17/354 ,  B60K17/356 ,  B60K28/16 ,  B60L3/0046 ,  B60L11/14 ,  B60L15/2009 ,  B60L15/2045 ,  B60L2240/36 ,  B60L2240/423 ,  B60L2240/486 ,  B60L2240/647 ,  B60L2240/662 ,  B60L2260/28 ,  B60T2210/12 ,  B60W10/06 ,  B60W10/08 ,  B60W10/26 ,  B60W2510/244 ,  B60W2510/246 ,  B60W2550/12 ,  B60W2550/148 ,  B60W2710/0666 ,  B60W2710/083 ,  B60W2710/105 ,  B60W2710/1061 ,  Y02T10/6221 ,  Y02T10/6265 ,  Y02T10/6286 ,  Y02T10/645 ,  Y02T10/70 ,  Y02T10/7077 ,  Y02T10/7283 ,  Y02T10/7291 ,  Y02T90/16 ,  Y10S903/903 ,  Y10S903/916 ,  Y10S903/917

摘要： A control device 6 for a front and rear wheel drive vehicle wherein one of a front wheel pair and a rear wheel pair is driven with an engine 3 and the other one of the front and rear wheel pairs is driven with an electric motor 5 supplied with electric power from an electric storage means is disclosed as including a drive condition detection means for detecting a running condition of the vehicle, a road surface frictional coefficient estimating means 60 for estimating a road surface frictional coefficient, an atmospheric temperature detection means for detecting an atmospheric temperature, a temperature detection means for detecting a temperature of the electric storage means, a motor drive power calculation means 61 for calculating a drive power of the electric motor responsive to the detected running condition and the estimated road surface frictional coefficient, and a control mode changeover means 62, 63 for changing over control modes during calculation of the drive power of the electric motor responsive to the detected atmospheric temperature or/and the temperature of the electric storage means.

公开(公告)号：US06528959B2

公开(公告)日：2003-03-04

申请号：US09906054

申请日：2001-07-17

申请人： Kazuhiko Kitano ,  Toshihiko Fukuda ,  Takahiro Yonekura ,  Naoki Uchiyama ,  Kenji Honda ,  Tooru Nakasako

发明人： Kazuhiko Kitano ,  Toshihiko Fukuda ,  Takahiro Yonekura ,  Naoki Uchiyama ,  Kenji Honda ,  Tooru Nakasako

IPC分类号： H02P766

CPC分类号： B60W20/10 ,  B60K6/48 ,  B60K6/52 ,  B60K28/16 ,  B60L2240/486 ,  B60T8/1769 ,  B60T8/48 ,  B60T2201/04 ,  B60T2270/602 ,  B60W10/06 ,  B60W10/08 ,  B60W20/00 ,  B60W2520/10 ,  B60W2530/00 ,  B60W2540/10 ,  B60W2550/142 ,  B60W2710/0666 ,  B60W2710/1061 ,  B60W2720/106 ,  Y02T10/6221 ,  Y02T10/6265 ,  Y02T10/6286 ,  Y10S903/916

摘要： There is provided a driving force control system for a front-and-rear wheel drive vehicle, which is capable maintaining an optimum slip condition of the drive wheels even on a low-friction road surface, ensuring a proper grip of rear wheels even on a low-friction road surface or a downhill slope, even when the driver operates the steering wheel while the vehicle is performing decelerating travel on such a road, and smoothly performing the assistance of an electric motor when the vehicle is accelerated without developing a torque step, thereby ensuring stable traveling and excellent acceleration and drivability. The front-and-rear wheel drive vehicle drives the front wheels by an engine, and rear wheels by an electric motor via an electromagnetic clutch. The target driving force for driving the vehicle is calculated based on at least a vehicle speed and an accelerator pedal opening. The present traveling condition of the vehicle is determined. The driving force for driving the vehicle is controlled based on the calculated target driving force in dependence on the determined traveling condition of the vehicle.