摘要:
A circuit for electrostatic discharge (ESD) protection includes a resistor a capacitor connected in series with the resistor, a first transistor including a gate, the gate being connected to a first power supply providing a first voltage to the gate via the resistor and a first terminal connected to the first power supply, a second transistor including a gate, the gate being connected to a second power supply, the second power supply providing a second voltage smaller than the first voltage, the second transistor having a first terminal connected to a second terminal of the first transistor, and a third transistor including a gate, the gate being connected to the second power supply, a first terminal of the third transistor being connected to a second terminal of the second transistor, and a second terminal being connected to a reference voltage different from the first voltage and the second voltage.
摘要:
A diode with low substrate current leakage and suitable for BiCMOS process technology. A buried layer is formed on a semiconductor substrate. A connection region and well contact the buried layer. Isolation regions are adjacent to two sides of the buried layer, each deeper than the buried layer. The isolation regions and the buried layer isolate the connection zone and the well from the substrate. The first doped region in the well is a first electrode. The well and the connection region are electrically connected, acting as a second electrode.
摘要:
An active device array substrate includes pixel units, scan lines, data lines, electrostatic discharge (ESD) protection elements, a short ring and an ESD biased generator. Each pixel unit is electrically connected to the corresponding scan line and data line. Each ESD protection element has a first connection terminal, a second connection terminal and a third connection terminal, wherein the first connection terminal is electrically connected to one of the corresponding scan line and data line, the second connection terminal is electrically connected to the short ring, and the third connection terminal is electrically connected to the ESD biased generator. As an ESD stress occurs, the ESD biased generator provides a voltage to the ESD protection elements to turn on them. It causes that the accumulated electrostatic charges are conducted into the lowest potential of the substrate through the short rings, so as to prevent the pixel units from ESD damaging.
摘要:
The present invention provides ESD protection circuits. The circuit includes: a resistor, a capacitance, a first transistor, an inverter set, and a second transistor. The resistor is connected between a first voltage and node N1. The capacitor is connected between node N1 and a second voltage. The first transistor has a first terminal coupled to the first voltage, a second terminal coupled to the second voltage, and a third terminal coupled to node N2. The inverter set has an input terminal coupled to node N1 and an output terminal coupled to node N2. The second transistor has a first terminal coupled to a first inverter of the inverter set, a second terminal coupled to the second voltage, and a third terminal coupled to an output terminal of a second inverter of the inverter set. The output terminals of the first and the second inverters correspond to opposite logic levels.
摘要:
A semiconductor device suitable for applications in an electrostatic discharge (ESD) protection circuit, including a semiconductor substrate, a first well formed in the substrate, a second well formed in the substrate, and a first doped region formed in the second well, wherein the first well, the second well, and the first doped region collectively form a parasitic bipolar junction transistor (BJT), and wherein the first well is the collector of the BJT, the second well is the base of the BJT, and the first doped region is the emitter of the BJT.
摘要:
An ESD protection circuit with impedance matching for radio frequency integrated circuits is provided. Nodes at the ends of a transmission line, respectively have at least one ESD component coupled between each and one of the power rails. The ESD components discharge ESD currents and the transmission lines provide RF matching.
摘要:
An ESD protection circuit with tunable gate-bias coupled between a first and second pads for receiving power supply voltages. The ESD protection circuit includes a diode, a resistor coupled between the cathode of the diode and the first pad, a capacitor coupled between the cathode of the diode and the second pad, a first transistor of a first conductivity type having a gate coupled to the cathode of the diode, a drain coupled to the anode of the diode and a source coupled to the second pad, a second transistor of a second conductivity type having a gate coupled to the cathode of the diode, a drain coupled to the anode of the diode and a source coupled to the first pad, and a third transistor of the first conductivity type having a gate coupled to the anode of the diode, a drain coupled to the first pad and a source coupled to the second pad.
摘要:
An output buffer circuit with low-voltage devices to driver high-voltage signals for PCI-X applications is proposed. Because power supply voltage of PCI-X is at 3.3V, the high-voltage gate-oxide stress is a serious problem to design PCI-X I/O circuit in a 0.13 μm 1V/2.5V CMOS process with only low-voltage gate oxide. This proposed output buffer circuit can be operated at 133 MHz in 3.3V PCI-X environment without causing high-voltage gate-oxide reliability problem. In this design, the circuit is implemented in a 0.13 μm 1V/2.5V CMOS process and the output signal swing can be 3.3V. Besides, a level converter that converts 0V˜1V voltage swing to 1V˜3.3V voltage swing is also presented.
摘要:
A thin-film transistor (TFT) with body contacts is disclosed. It is used in polysilicon TFT LCD's. A body contact region for separating the gate electrode, a source region, and a drain region is made in the TFT. Through the dopants in the body contact region and different impurities in the source region and the drain region, a body-trigger bias is imposed on the body of the TFT. This method reduces the threshold voltage of the TFT driving circuit, thereby increasing the driving current.
摘要:
An ESD protection circuit design incorporating a single, or a plurality of, parallel inductor and capacitor, also known as LC tank(s), to avoid power loss by parasitic capacitance in ESD circuits. The first design described incorporates a LC tank structure. The second includes two LC tank structures. These structures can be expanded to form ESD protection circuit structures stacked with n-stages LC tanks. The last design described is ESD protection circuits formed by stacking the first design. These designs can avoid power gain loss from parasitic capacitance of ESD, because the parameters of LC tank can be designed to resonant at a desired operating frequency. Each of these designs can be altered slightly to create variant designs with equal identical ESD protection capabilities.