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101.
公开(公告)号:US20220350763A1
公开(公告)日:2022-11-03
申请号:US17748762
申请日:2022-05-19
Applicant: Rambus Inc.
Inventor: Frederick A. Ware , Ely Tsern , John Eric Linstadt , Thomas J. Giovannini , Kenneth L. Wright
Abstract: The embodiments described herein describe technologies of dynamic random access memory (DRAM) components for high-performance, high-capacity registered memory modules, such as registered dual in-line memory modules (RDIMMs). One DRAM component may include a set of memory cells and steering logic. The steering logic may include a first data interface and a second data interface. The first and second data interfaces are selectively coupled to a controller component in a first mode and the first data interface is selectively coupled to the controller component in a second mode and the second data interface is selectively coupled to a second DRAM component in the second mode.
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102.
公开(公告)号:US20220345155A1
公开(公告)日:2022-10-27
申请号:US17744311
申请日:2022-05-13
Applicant: Rambus Inc.
Inventor: Frederick A. Ware , John Eric Linstadt
Abstract: Memory controllers, devices and associated methods are disclosed. In one embodiment, a memory controller includes write circuitry to transmit write data to a memory device, the write circuitry includes a write error detection correction (EDC) encoder to generate first error information associated with the write data. Data bus inversion (DBI) circuitry conditionally inverts data bits associated with each of the write data words based on threshold criteria. Read circuitry receives read data from the memory device. The read circuitry includes a read EDC encoder to generate second error information associated with the received read data. Logic evaluates the first and second error information and conditionally reverse-inverts at least a portion of the read data based on the decoding.
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公开(公告)号:US20220077327A1
公开(公告)日:2022-03-10
申请号:US17445371
申请日:2021-08-18
Applicant: Rambus Inc.
Inventor: Yohan Frans , Simon Li , John Eric Linstadt , Jun Kim
IPC: H01L31/0236 , G06F12/02 , G06F13/16 , G06F3/06 , G06F13/372
Abstract: A memory controller comprises a command interface to transmit a memory command to a plurality of memory devices associated with the memory controller. The memory controller also comprises an acknowledgement interface to receive an acknowledgment status packet from the plurality of memory devices over a shared acknowledgement link coupled between the memory controller and the plurality of memory devices, the acknowledgement status packet indicating whether the command was received by the plurality of memory devices. In addition, the memory controller comprises a memory controller core to decode the acknowledgment status packet to identify a portion of the acknowledgement status packet corresponding to each of the plurality of memory devices.
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公开(公告)号:US20220066672A1
公开(公告)日:2022-03-03
申请号:US17505503
申请日:2021-10-19
Applicant: Rambus Inc.
Inventor: Frederick A. Ware , John Eric Linstadt
IPC: G06F3/06
Abstract: A compute system includes an execution unit (e.g. of a CPU) with a memory controller providing access to a hybrid physical memory. The physical memory is “hybrid” in that it combines a cache of relatively fast, durable, and expensive memory (e.g. DRAM) with a larger amount of relatively slow, wear-sensitive, and inexpensive memory (e.g. flash). A hybrid controller component services memory commands from the memory controller component and additionally manages cache fetch and evict operations that keep the cache populated with instructions and data that have a high degree of locality of reference. The memory controller alerts the hybrid controller of available access slots to the cache so that the hybrid controller can use the available access slots for cache fetch and evict operations with minimal interference to the memory controller.
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公开(公告)号:US11164622B2
公开(公告)日:2021-11-02
申请号:US17101574
申请日:2020-11-23
Applicant: Rambus Inc.
Inventor: Frederick A. Ware , John Eric Linstadt , Kenneth L. Wright
IPC: G11C7/10 , G11C11/4093 , G11C11/4096 , G06F11/10 , G11C7/02 , G11C29/52 , G11C29/04
Abstract: Described are memory modules that support different error detection and correction (EDC) schemes in both single- and multiple-module memory systems. The memory modules are width configurable and support the different EDC schemes for relatively wide and narrow module data widths. Data buffers on the modules support the half-width and full-width modes, and also support time-division-multiplexing to access additional memory components on each module in support of enhanced EDC.
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公开(公告)号:US11035989B2
公开(公告)日:2021-06-15
申请号:US15776386
申请日:2016-11-03
Applicant: Rambus Inc.
Inventor: Patrick R. Gill , David G. Stork , John Eric Linstadt
Abstract: An imaging system includes a phase grating overlying a two-dimensional array of pixels, which may be thermally sensitive pixels for use in infrared imaging. The phase grating comprises a two-dimensional array of identical subgratings that define a system of Cartesian coordinates. The subgrating and pixel arrays are sized and oriented such that the pixels are evenly distributed with respect to the row and column intersections of the subgratings. The location of each pixel thus maps to a unique location beneath a virtual archetypical subgrating. Portions of the phase grating extend beyond the edges of the pixels array to interference pattern in support of Fourier-domain imaging.
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公开(公告)号:US20210174863A1
公开(公告)日:2021-06-10
申请号:US17101574
申请日:2020-11-23
Applicant: Rambus Inc.
Inventor: Frederick A. Ware , John Eric Linstadt , Kenneth L. Wright
IPC: G11C11/4093 , G11C29/52 , G11C7/02 , G11C11/4096 , G06F11/10 , G11C29/04
Abstract: Described are memory modules that support different error detection and correction (EDC) schemes in both single- and multiple-module memory systems. The memory modules are width configurable and support the different EDC schemes for relatively wide and narrow module data widths. Data buffers on the modules support the half-width and full-width modes, and also support time-division-multiplexing to access additional memory components on each module in support of enhanced EDC.
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108.
公开(公告)号:US11025274B2
公开(公告)日:2021-06-01
申请号:US16690764
申请日:2019-11-21
Applicant: Rambus Inc.
Inventor: Frederick A. Ware , John Eric Linstadt
Abstract: Memory controllers, devices and associated methods are disclosed. In one embodiment, a memory controller includes write circuitry to transmit write data to a memory device, the write circuitry includes a write error detection correction (EDC) encoder to generate first error information associated with the write data. Data bus inversion (DBI) circuitry conditionally inverts data bits associated with each of the write data words based on threshold criteria. Read circuitry receives read data from the memory device. The read circuitry includes a read EDC encoder to generate second error information associated with the received read data. Logic evaluates the first and second error information and conditionally reverse-inverts at least a portion of the read data based on the decoding.
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公开(公告)号:US20210118480A1
公开(公告)日:2021-04-22
申请号:US17089899
申请日:2020-11-05
Applicant: Rambus Inc.
Inventor: Frederick A. Ware , John Eric Linstadt , Kenneth L. Wright
IPC: G11C11/00 , G06F12/0804 , G06F12/084 , G06F12/0895 , G11C5/04 , G11C14/00 , G06F12/02
Abstract: A memory module includes cache of relatively fast and durable dynamic, random-access memory (DRAM) in service of a larger amount of relatively slow and wear-sensitive nonvolatile memory. Local controller manages communication between the DRAM cache and nonvolatile memory to accommodate disparate access granularities, reduce the requisite number of memory transactions, and minimize the flow of data external to nonvolatile memory components.
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公开(公告)号:US20210117091A1
公开(公告)日:2021-04-22
申请号:US17075357
申请日:2020-10-20
Applicant: Rambus Inc.
Inventor: Frederick A. Ware , John Eric Linstadt
IPC: G06F3/06 , G11C11/4091 , G11C11/4076 , G11C7/06 , G11C7/22 , G11C7/18 , G11C11/4097
Abstract: Same sized blocks of data corresponding to a single read/write command are stored in the same memory array of a memory device, but using different formats. A first one of these formats spreads the data in the block across a larger number of memory subarrays (a.k.a., memory array tiles—MATs) than a second format. In this manner, the data blocks stored in the first format can be accessed with lower latency than the blocks stored in the second format because more data can be read from the array simultaneously. In addition, since the data stored in the second format is stored in fewer subarrays, it takes less energy to read a block stored in the second format. Thus, a system may elect, on a data block by data block basis, whether to conserve power or improve speed.
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