摘要:
There is provided a solid state imaging device using a MOS image sensor of a threshold voltage modulation system employed in a video camera, an electronic camera, an image input camera, a scanner, a facsimile, or the like. In configuration, in the solid state imaging device that comprises a photo diode formed in a second semiconductor layer 15a of opposite conductivity type in a first semiconductor layer 12 and 32 of one conductivity type, and a light signal detecting insulated gate field effect transistor formed in a fourth semiconductor layer 15b of opposite conductivity type in a third semiconductor layer 12 of one conductivity type adjacently to the photo diode, a carrier pocket 25 is provided in the fourth semiconductor layer 15b, and a portion of the first semiconductor layer 12, 32 under the second semiconductor layer 15a is thicker than a portion of the third semiconductor layer 12 under the fourth semiconductor layer 15b in a depth direction.
摘要:
A barrier area is located adjacent a horizontal transfer area and spaced from a field insulating area. The barrier area includes an insulating layer and a conductor extending from the horizontal transfer layer over the surface of a semiconductor substrate, a barrier layer of a second conductivity type formed under the surface of the semiconductor substrate and adjacent a first impurity layer of a first conductivity type of the horizontal transfer area, and a second impurity layer extending from the horizontal transfer area and formed under the barrier layer. A discharge area is located between the barrier area and the field insulating area. The discharge area includes a field insulating layer interposed between the insulating layer and the conductor extending from the barrier layer over the surface of the semiconductor substrate, and a discharge layer of the first conductivity type formed under the surface of the semiconductor substrate and adjacent the barrier layer of the barrier area over the surface layer. An impurity concentration of the discharge layer is greater than that of the first impurity layer.
摘要:
A semiconductor device has plural output circuits. Each of the plural output circuits has a semiconductor switching element and a heat protection circuit including a diode. When the heat protection circuit in a predetermined output circuit detects that heat emitted from the semiconductor switching element in the predetermined output circuit, the heat protection circuit turns off the semiconductor switching element in the predetermined output circuit. The plural output circuits are thermally isolated from each other by a trench and an insulation film. The trench and the insulation film prevent the heat from being transmitted from the predetermined output circuit to an adjacent output circuit. Therefore, even if the heat, by which the semiconductor switching element in the predetermined output circuit is turned off, is generated at the predetermined output circuit, the semiconductor switching element in the adjacent output circuit is not turned off by the heat.
摘要:
An anti-reflective layer is formed on the sidewalls of metal interconnects in an integrated circuit containing photodetector devices. After fabricating the photodetector devices, the metal interconnects are formed. An anti-reflective layer is formed over the interconnects and is directionally etched so that a portion of the anti-reflective layer remains covering the interconnect sidewalls, thereby reducing optical cross-talk in the photodetector devices due to sidewall reflection.
摘要:
In general, the output of a buried channel CCD is provided with a floating diffusion (4), which forms a storage site to determine the size of an electric charge. For this purpose, the floating diffusion may be connected to the input of an amplifier, such as a source follower (8). The charge is transferred to the floating zone from below an output gate OG to which a DC voltage is applied. To obtain a high sensitivity, i.e. a high voltage per electron, it is important to keep the capacitance of the floating zone as small as possible. The capacitance can be reduced by narrowing the channel at the output. This method of reducing C, however, is limited in known structures because this shape of the channel may induce an electric field in the channel which counteracts the transfer to the floating zone. To suppress this effect, the gate oxide (5) below the output gate is provided with a thicker part (5b) adjoining the floating diffusion (4). By virtue thereof, an additional field is induced below the output gate, which enhances the transfer of charge to the floating zone. This enables the channel to be narrowed, resulting in a low floating-zone capacitance, without decreasing the transfer efficiency. Said capacitance is reduced further by the thick oxide, which leads to a small capacitance between the floating zone and the output gate.
摘要:
The invention provides a semiconductor device, manufactured with low manufacturing costs, that prevents the breakdown voltage from lowering. The semiconductor device according to the invention includes a p-type highly resistive semiconductor substrate; an n-type offset region in the surface portion of the substrate; a p-type base region in the surface portion of the substrate, the base region including an nnull-type source region in the surface portion thereof, the base region including a channel portion in the extended portion thereof extended between the source region and the n-type offset region; a p-type offset region in the surface portion of the n-type offset region, the potential of the p-type offset region being fixed at the source potential; an nnull-type drain region in the surface portion of the n-type offset region; a field oxide film on the p-type offset region; a gate oxide film on the channel portion of the base region; a gate electrode on the gate oxide film; a source electrode on source region; a drain electrode on the drain region; an interlayer film; a protection film; and a spiral polysilicon thin film on the field oxide film, one end of the thin film being connected to the drain electrode, another end of the thin film being connected to the source electrode, the thin film being formed of pn-diodes connected in series.
摘要:
The present invention relates to the formation, on a substrate having a display area and a peripheral area, of a gate wire including a plurality of gate lines and gate electrodes in a display area and gate pads in the peripheral area, and of a common wire, including a common signal line and a plurality of common electrodes in the display area. A gate insulating layer, a semiconductor layer, an ohmic contact layer and a conductor layer are sequentially deposited, and the conductor layer and the ohmic contact layer are patterned to form a data wire including a plurality of data lines, a source electrode and a drain electrode of the display area, and data pads of the peripheral area, and an ohmic contact layer pattern thereunder. A passivation layer is deposited and a positive photoresist layer is coated thereon. The photoresist layer is exposed to light through one or more masks having different transmittances between the display area and the peripheral area. The photoresist layer is developed to form a photoresist pattern having the thickness that varies depending on position. At this time, a thin portion and a thick portion of the photoresist pattern are provided for the display area, and a thick portion and a zero thickness portion for the peripheral area. In the peripheral area, the portions of the passivation layer, the semiconductor layer, and the gate insulating layer on the gate pads, and the portions of the passivation layer on the data pads and under the zero thickness portion are removed. In the display area, the thin portion of the photoresist pattern, and the portions of the passivation layer and the semiconductor layer thereunder are removed, but the portions of the passivation layer under the thick portions of the photoresist pattern are not removed. Then, a plurality of pixel electrodes, redundant gate pads, and redundant data pads are formed.
摘要:
An array of photodiodes includes regions of a second conductivity type formed in a semiconductive region of a first conductivity type, divided into three interleaved sub-arrays. All the photodiodes of a same sub-array are coated with a same interference filter including at least one insulating layer of determined thickness coated with at least one conductive layer. According to the present invention, the conductive layers are electrically connected to the semiconductive region of a first conductivity type.
摘要:
A semiconductor energy detector as disclosed herein is arranged so that an aluminum wiring pattern is formed on the front side of transfer electrodes of a CCD vertical shift register, which pattern includes meander-shaped auxiliary wirings for performing auxiliary application/supplement and additional wirings for performing auxiliary supplement of transfer voltages in a way independent of the auxiliary wirings with respective ones of such wirings being connected to corresponding transfer electrodes to thereby avoid a problem as to lead resistivities at those transfer electrodes made of polycrystalline silicon, thus achieving the intended charge transfer at high speeds with high efficiency.
摘要:
A barrier area is located adjacent a horizontal transfer area and spaced from a field insulating area. The barrier area includes an insulating layer and a conductor extending from the horizontal transfer layer over the surface of a semiconductor substrate, a barrier layer of a second conductivity type formed under the surface of the semiconductor substrate and adjacent a first impurity layer of a first conductivity type of the horizontal transfer area, and a second impurity layer extending from the horizontal transfer area and formed under the barrier layer. A discharge area is located between the barrier area and the field insulating area. The discharge area includes a field insulating layer interposed between the insulating layer and the conductor extending from the barrier layer over the surface of the semiconductor substrate, and a discharge layer of the first conductivity type formed under the surface of the semiconductor substrate and adjacent the barrier layer of the barrier area over the surface layer. An impurity concentration of the discharge layer is greater than that of the first impurity layer.