摘要:
The invention concerns an apparatus for inspection of a wafer, encompassing at least one incident-light illumination device that radiates an illuminating light beam which is incident obliquely onto a surface of a wafer to be inspected, and an image capture device for capturing an image of the surface in a dark-field arrangement. The wafer inspection apparatus is characterized in that at least one deflection device is provided in order to deflect an associated illuminating light beam onto the surface of the wafer.
摘要:
The present invention relates to an apparatus for measuring the position of an object (30), comprising at least one laser interferometer system (29) for determining a position displacement of the object (30) in at least one spatial direction, wherein the at least one laser interferometer system (29), together with the object (30), are accommodated in a climate chamber (40) comprising an area (42) with air intake apertures and an area (44) with air exhaust apertures, wherein it is suggested to provide means for directing in operation at least part of the airflow (46) through the climate chamber (40) into the area of the laser axes (52, 54) of the at least one laser interferometer system (29).
摘要:
The present invention relates to a reference-beam interferometer for determining the position of a traversable stage, wherein an evacuated tube is inserted into the longer of the two interferometer legs. The tube is closed off by windows, which have a negative coefficient of thermal expansion and which can have a coating for reflecting heat radiation. Moreover, thermal compensation plates are inserted into the shorter of the two beam paths.
摘要:
The present invention relates to an apparatus and method for automatically inspecting a wafer, having a light source and an illumination optics for illuminating the wafer for inspection, wherein the illumination optics comprises a variable gray filter for adjusting the illumination power.
摘要:
A method for determining the positions of structures (3) on a mask (2) is disclosed. The method is implemented in a metrology tool (1) comprising a measurement table (20) which is movable in X-coordinate direction and Y-coordinate direction. A first intensity profile (IX) is recorded along a first measurement direction (MRX), which is parallel to the X-coordinate direction. A second intensity profile (IY) is recorded along a second measurement direction (MRY), which is parallel to the Y-coordinate direction. A two-dimensional position of a centre of gravity (S) with respect to the coordinate system of the metrology tool (1) is determined from the first intensity profile (IX) and the second intensity profile (IY).
摘要:
A coordinate measuring machine is disclosed having an orientor automatically orienting a substrate associated therewith. A control and computing unit is further associated with the coordinate measuring machine, so that self-calibration may be performed on the basis of at least two different and automatically set orientations of the substrate.
摘要:
A device for determining the position of a structure (3) on an object (2) in relation to a coordinate system is disclosed. The object (2) is placed on a measuring table (20) which is movable in one plane (25a), wherein a block (25) defines the plane (25a). At least one optical arrangement (40, 50) is provided for transmitted light illumination and/or reflected light illumination. The optical arrangement (40, 50) comprises an illumination apparatus (41, 51) for reflected light illumination and/or transmitted light illumination and at least one first or second optical element (9a, 9b), wherein at least part of the at least one optical element (9a, 9b) extends into the space (110) between the block (25) and an optical system support (100). The block (25) and/or the optical system support (100) separates the illumination apparatus (41, 51) spatially from the plane (25a) in which the measuring table (20) is movable.
摘要:
A method for determining the position of an edge bead removal line of a disk-like object having an edge area and an alignment mark on the edge area is disclosed, wherein the edge area including the edge bead removal line is imaged on a line-by-line basis, an intensity profile I of the imaged edge area including the edge bead removal line is obtained with a camera on a line-by-line basis, and the edge area and the alignment mark are detected, wherein the local intensity maxima I′max of the intensity profile I are plotted as points in a diagram, segment sets are formed in the diagram, the segment sets are fitted in ellipses, and a quality criterion qges is determined for each ellipse.
摘要:
A device for measuring the position of at least one structure on a substrate is disclosed. The substrate to be measured is positioned in a mirror body. A flat insert is provided in the mirror body and is formed such that the substrate and the insert together always have the same optical thickness, irrespective of the mechanical thickness of the substrate.
摘要:
A method is disclosed which is suitable for the calibration of a measuring table (20) of a coordinate measuring machine (1). For this purpose, a mask (2) is deposited in a three-point support of the measuring table (20), wherein the mask (2) used for the calibration of the measuring table (20) is a mask (2), which is used for the semiconductor production. The measurement of positions of a plurality of different structures (3) which are arranged in a distributed manner on the mask (2) is carried out. The structures (3) are available in an initial orientation on the mask (2). The mask (2) is rotated and the position of the structures (3) is determined in the rotated orientation. Afterwards, the mask (2) is shifted and the position of the structures (3) is also determined. A total correction function for eliminating coordinate-dependant measuring errors is determined, wherein the total correction function has a first correction function and a second correction function.