公开(公告)号：US12222659B2

公开(公告)日：2025-02-11

申请号：US18098482

申请日：2023-01-18

Applicant: Applied Materials, Inc.

Inventor： Venkatakaushik Voleti ,  Mehdi Vaez-Iravani

IPC: G03F9/00 ,  G03F7/00

Abstract: Methods and apparatus for detecting metrology data are provided herein. For example, an apparatus comprises a substrate support configured to support a substrate and another substrate disposed on the substrate, an incoherent light source configured to transmit an illumination beam through the substrate and the another substrate, a set of optics configured to direct the illumination beam when transmitted through the substrate and the another substrate, an actuator operably coupled to the substrate support and configured to move the substrate and another substrate back and forth in a scanning pattern, and a sensor operably coupled to the actuator, synchronized therewith, and configured to receive the illumination beam from the set of optics to obtain subsurface images of the substrate and the another substrate.

公开(公告)号：US12221694B2

公开(公告)日：2025-02-11

申请号：US16601400

申请日：2019-10-14

Applicant: Applied Materials, Inc.

Inventor： Pramit Manna ,  Swaminathan T. Srinivasan ,  Timothy J. Franklin

IPC: C23C16/44 ,  B08B9/032 ,  C23C16/455 ,  C23C16/505 ,  H01J37/32

Abstract: A method for cleaning one or more interior surfaces of a processing chamber includes removing a processed substrate from the processing chamber, and introducing a first cleaning chemistry into the processing chamber to generate a first internal pressure of greater than 1.1 atm within the processing chamber and remove deposited contaminants from the one or more interior surfaces of the processing chamber. The method further comprises removing the cleaning chemistry from the processing chamber.

公开(公告)号：US20250046610A1

公开(公告)日：2025-02-06

申请号：US18364249

申请日：2023-08-02

Applicant: Applied Materials, Inc.

Inventor： Jialiang WANG ,  Guangyan ZHONG ,  Soonil LEE ,  Eswaranand VENKATASUBRAMANIAN ,  Abhijit B. MALLICK

IPC: H01L21/033 ,  C23C16/27 ,  C23C16/507 ,  H01L21/3065 ,  H01L21/308 ,  H01L21/311

Abstract: The present disclosure provides a method of processing a substrate. The method includes flowing a deposition gas comprising a hydrocarbon compound into a processing volume of a process chamber having a substrate positioned on an electrostatic chuck. A plasma is generated at the substrate by applying a first RF bias to the electrostatic chuck to deposit a diamond-like carbon film on the substrate. The diamond-like carbon film is doped with a metal dopant to form a doped diamond-like carbon film. The metal dopant is thermally annealed to the doped diamond-like carbon film.

公开(公告)号：US20250046599A1

公开(公告)日：2025-02-06

申请号：US18364260

申请日：2023-08-02

Applicant: Applied Materials, Inc.

Inventor： Jialiang WANG ,  Soonil LEE ,  Eswaranand VENKATASUBRAMANIAN ,  Abhijit B. MALLICK

IPC: H01L21/02 ,  C23C16/04 ,  C23C16/26 ,  C23C16/458 ,  C23C16/509 ,  C23C16/56 ,  H01J37/32 ,  H01L21/311

Abstract: The present disclosure provides a method. The method includes positioning a substrate on an electrostatic chuck in a processing volume of a processing chamber. A plasma is generated at the substrate by applying a RF bias to the electrostatic chuck. A first layer of a diamond-like carbon film is deposited in an opening of the substrate by flowing a first deposition gas comprising a hydrocarbon compound into the processing volume. The first layer is etched to remove a portion of the first layer. A second layer of the diamond-like carbon film is deposited in the opening to fill an upper portion of the opening by flowing a second deposition gas into the processing volume.

公开(公告)号：US20250046026A1

公开(公告)日：2025-02-06

申请号：US18793389

申请日：2024-08-02

Applicant: Applied Materials, Inc.

Inventor： David Alexander SELL ,  Sihui HE ,  Kevin MESSER ,  Kunal SHASTRI ,  Jinxin FU ,  Samarth BHARGAVA

IPC: G06T19/00 ,  G02B5/04 ,  G02B6/10

Abstract: The present disclosure relates to augmented reality devices and related methods. The augmented reality devices include a projection system. The projection system includes a projector including a major axis. The projected is configured to project an image along the major axis. A prism is configured to refract the image. The image includes a first spectrum, a second spectrum, and a third spectrum. A waveguide is disposed at a wrap angle from a plane formed from the major axis of the projector. The waveguide includes an input coupler, and an output coupler.

公开(公告)号：US20250045900A1

公开(公告)日：2025-02-06

申请号：US18922194

申请日：2024-10-21

Applicant: Applied Materials, Inc.

Inventor： Yash Chhabra ,  Abyaya Dhar ,  Joseph Liu ,  Yi Nung Wu ,  Boon Sen Chan ,  Sidda Reddy Kurakula ,  Chandrasekhar Roy

IPC: G06T7/00 ,  G01N21/95

Abstract: A method includes identifying one or more images of an edge of a susceptor pocket formed in an upper surface of a susceptor of a substrate processing system. An angle identification component is disposed in the susceptor pocket. The method further includes causing, based on the one or more images, performance of an action associated with the susceptor.

公开(公告)号：US20250041908A1

公开(公告)日：2025-02-06

申请号：US18781131

申请日：2024-07-23

Applicant: Applied Materials, Inc.

Inventor： Jason A. RYE ,  Alex DURADO

IPC: B08B3/04 ,  B01F23/23 ,  B01F23/232 ,  B01F25/452 ,  B08B13/00

Abstract: Embodiments herein provide a semiconductor substrate cleaning chamber. The cleaning chamber includes side walls that partially define a cleaning volume, a pedestal disposed within the side walls, and a cleaning arm disposed above the pedestal. The cleaning arm includes a nozzle assembly disposed on a nozzle end of the cleaning arm. The nozzle assembly includes a housing, and a body disposed within the housing and having a gas port disposed through the body and configured to aerate a fluid passing through the nozzle assembly.

公开(公告)号：US12217981B2

公开(公告)日：2025-02-04

申请号：US17689453

申请日：2022-03-08

Applicant: Applied Materials, Inc.

Inventor： Vijayabhaskara Venkatagiriyappa ,  Srinivas Ramakrishna ,  Mario Daniel Sanchez

IPC: H01L21/67

Abstract: Lid separators for vacuum processing chamber lid separation and vacuum processing chambers incorporating same are provided herein. In some embodiments, a lid separator for a vacuum processing chamber includes: a shaft having a first end and an opposing second end, wherein the shaft is threaded along at least a first portion of the shaft; and a contact pad having an outer diameter greater than an outer diameter of the shaft, a recess disposed in a first side of the contact pad, and a central opening disposed through a second side of the contact pad, opposite the first side, and into the recess, wherein the shaft is coupled to the contact pad, wherein the first end of the shaft extends through the central opening and into the recess without reaching the first side of the contact pad, and wherein the first portion and the second end of the shaft extend away from the second side of the contact pad.

公开(公告)号：US12216015B2

公开(公告)日：2025-02-04

申请号：US18531478

申请日：2023-12-06

Applicant: Applied Materials, Inc.

Inventor： Chuang-Chia Lin ,  David Peterson ,  Philip Allan Kraus ,  Amir Bayati

IPC: G01L19/00 ,  G01N29/02 ,  H03H9/02 ,  H03H9/145

Abstract: Embodiments disclosed herein include diagnostic substrates and methods of using the diagnostic substrates to extract plasma parameters. In an embodiment, a diagnostic substrate comprises a substrate and an array of resonators across the substrate. In an embodiment, the array of resonators comprises at least a first resonator with a first structure and a second resonator with a second structure. In an embodiment, the first structure is different than the second structure.

公开(公告)号：US20250040191A1

公开(公告)日：2025-01-30

申请号：US18776441

申请日：2024-07-18

Applicant: Applied Materials, Inc.

Inventor： Dejiu Fan ,  Yun-Chu Tsai ,  Sheng-Wen Wang ,  Dong Kil Yim ,  Soo Young Choi

IPC: H01L29/786 ,  C23C14/08 ,  C23C14/58 ,  C23C16/06 ,  C23C16/455 ,  C23C16/56 ,  H01L21/02 ,  H01L29/66

Abstract: Embodiments described herein relate to engineering metal oxide layer interfaces to improve electronic device stability. For example, a transistor device can include a base structure and a metal oxide layer disposed on the base structure. The metal oxide layer includes at least one region having a gradient profile with respect to oxygen (O2) composition.