Abstract:
An irregular voltage detection and cutoff circuit using a bandgap reference voltage generation circuit includes the bandgap reference voltage generation circuit, which generates a bandgap reference voltage from the power-supply voltage, a reference voltage generator, which generates a first reference voltage and a second reference voltage in the same voltage level as the bandgap reference voltage from the power-supply voltage, a voltage detector, which generates a detection voltage from the power-supply voltage, and a comparator, which generates a switching control signal that cuts off the power-supply voltage by comparing the first and second reference voltages with the detection voltage.
Abstract:
A method and apparatus of classifying repetitive defects on a substrate is provided. Defects of dies on the substrate are sequentially compared with a predetermined reference die. Sets of coordinates are marked on the reference die which are corresponding to the position of the defects on the dies on the substrate. Then, repetitive defects are classified which are repeatedly marked in a specified region on the reference die.
Abstract:
An organic light emitting diode display device capable of reducing power consumption by limiting a current to lower the total luminance if an area exhibiting a high luminance is larger than a threshold, and a driving method thereof are disclosed. The device includes a luminance controller for controlling an emission time of the pixel unit by determining a luminance limit of the pixel unit corresponding to a sum of the values of the video data input into one frame; and a power source controller for controlling driving of the luminance controller to correspond to the luminance limit of the pixel unit.
Abstract:
In a method of aligning a wafer, which is capable of precisely and rapidly aligning the wafer, and a wafer alignment apparatus using the method of aligning the wafer, a first wafer is aligned to form a first template pattern corresponding to an image of the first wafer. Image data of a second wafer is inputted. A kind of the second wafer is different from that of the first wafer. A second template pattern is formed by transforming the first template pattern in response to the image data of the second wafer. The second wafer is then aligned in response to the second template pattern. Accordingly, the template pattern is formed using the image data to align the wafer although wafers having different images are inspected, thereby rapidly forming the template pattern.
Abstract:
Disclosed herein is a composition for preventing or treating pruritic or irritant skin diseases which comprises, as a vanilloid receptor antagonist, a thiourea derivative, a pharmaceutically acceptable salt thereof, a hydrate thereof or a solvate thereof, together with a pharmaceutically acceptable carrier.
Abstract:
A substrate has an array testing system for use in a liquid crystal display device. The substrate includes a plurality of array cells each including a display area, a non-display area surrounding the display area, and a pad area adjacent to first and second sides of the non-display area. The substrate further includes a plurality of test pads outside the plurality of array cells and a plurality of test lines each connecting a corresponding one of the array cells with a corresponding one of the test pads. Here, each one of the test lines partially pass through the non-display area of an array cell adjacent to the corresponding one of the array cells.
Abstract:
The diarylbenzopyran derivatives represented by formula I, and the pharmaceutically acceptable salts thereof, are disclosed. The composition comprising the compound of formula I, or a pharmaceutically acceptable salt thereof, shows an excellent selective inhibition of cyclooxygenase-2.
Abstract:
A method for manufacturing a thin cold rolled inner shield steel sheet for use in a braun tube is disclosed. With this method, a steel sheet with superior magnetic field shielding properties can be manufactured by carrying two steps of cold rolling without adding an expensive alloy element, and without using a special decarburizing facility such as OCA. The method includes the following steps. There is prepared a steel slab composed of, in wt %, 0.0025% or less of C, 0.05-0.25% of Mn, 0.05-0.15% of Si, 0.015 or less of Al, and a balance of Fe and other impurity elements. Then a hot rolling is carried out on the steel slab at a temperature of 910° C. or above. Then a first cold rolling is carried out, and a first annealing is carried out at above a recrystallization temperature. Then a second cold rolling is carried out at a reduction ratio of 25-45%.
Abstract:
A refrigerator made by a blow-molding process. The refrigerator has a cabinet made by a blow molding and formed at an upper front portion thereof with a first two-stepped groove which surrounds an inlet of a freezing chamber and formed at a lower front portion thereof with a second two-stepped groove which surrounds an inlet of a refrigerating chamber, an upper door formed at a rear periphery portion thereof, which faces the refrigerating chamber, with a first recess corresponding to the first two-stepped groove, a lower door formed at a rear periphery portion thereof, which faces the freezing chamber, with a second recess corresponding to the second two-stepped groove, an upper gasket received in the first recess and having a first magnet therein, a lower gasket received in the second recess and having a second magnet therein, a first coupling member for fixing the upper door to a front surface of the cabinet when the freezing chamber is closed by the upper door, and a second coupling member for fixing the lower door to the front surface of the cabinet when the refrigerating chamber is closed by the lower door. The refrigerator is light in weight and, since the cabinet is made by a blow molding process, the manufacturing time and the assembling steps are reduced.
Abstract:
An electrical interconnection method, where two substrates are interconnected by an electrical connection medium, includes the steps of: depositing conductive particles on the connection surface of one of two substrates which are to be interconnected; depositing paste on the connection surface of another substrate; and interconnecting the connection surfaces of the two substrates. Also, the interconnection method according to another embodiment embodiment includes the steps of: depositing conductive particles on the connection surface of one of two substrates which are to be interconnected; contacting the connection surfaces of the two substrates; and injecting paste into a gap between the two substrates to interconnect the two substrates.