公开(公告)号：US20240110943A1

公开(公告)日：2024-04-04

申请号：US18540446

申请日：2023-12-14

Applicant: Microfabrica Inc.

Inventor： Onnik Yaglioglu

IPC: G01R1/067 ,  G01R1/073 ,  H01R13/03

CPC classification number: G01R1/06716 ,  G01R1/06755 ,  G01R1/06761 ,  G01R1/07342 ,  H01R13/03 ,  H01R13/2407 ,  H01R2201/20

Abstract: Probe structures, probe arrays) and methods for making such structures include incorporation of nano-fibers and metal composites to provide structures with improved material properties. Nano-fiber incorporation may occur by co-deposition of fibers and metal, selective placement of fibers followed by deposition of metal, or general placement of fibers followed by selective deposition of a metal. Structures may be formed from single layers of fibers and deposited metal or from multiple layers formed adjacent to one another or attached to one another after formation. All portions, or only selected portions, of a structure may include composites of metal and nano-fibers.

公开(公告)号：US20240103038A1

公开(公告)日：2024-03-28

申请号：US17898400

申请日：2022-08-29

Applicant: Microfabrica Inc.

Inventor： Ming Ting Wu

IPC: G01R1/067 ,  G01R1/073 ,  G01R3/00

CPC classification number: G01R1/06722 ,  G01R1/06738 ,  G01R1/0735 ,  G01R3/00

Abstract: Probe structures, arrays, methods of using probes and arrays, and/or methods for making probes and/or arrays wherein the probes include at least one flat tensional spring segments and in some embodiments include narrowed channel passage segments (e.g. by increasing width of plunger elements or by decreasing channel widths) along portions of channel lengths (e.g. not entire channel lengths) to enhance stability or pointing accuracy while still allowing for assembled formation of movable probe elements.

公开(公告)号：US20240094636A1

公开(公告)日：2024-03-21

申请号：US17390835

申请日：2021-07-30

Applicant: Microfabrica Inc.

Inventor： Onnik Yaglioglu

IPC: G03F7/09 ,  G01R1/073

CPC classification number: G03F7/09 ,  G01R1/07307 ,  G03F7/094

Abstract: Probe array formation embodiments of the invention (e.g., that are used to form full arrays or multi-probe subarrays that are to be assembled into full arrays) provide simultaneous formation of many probes of an array or subarray while the probes are in an array configuration. These embodiments provide for the creation and deformation of array formation templates that include holes or openings for depositing probe material wherein the openings are either fully formed (i.e. fully actualized) prior to deformation or are latently formed by chemical or structural changes to the template material

公开(公告)号：US20240094261A1

公开(公告)日：2024-03-21

申请号：US17401252

申请日：2021-08-12

Applicant: Microfabrica Inc.

Inventor： Michael S. Lockard ,  Uri Frodis ,  Dennis R. Smalley

IPC: G01R3/00 ,  G01R1/067

CPC classification number: G01R3/00 ,  G01R1/06722 ,  G01R1/06761

Abstract: Probes for testing (e.g. wafer level testing or socket level testing) of electronic devices (e.g. semiconductor devices) and more particularly, arrays of such probes are provided. Probes are formed by initially fabricating probe preforms in batch with bases and/or ends located in array patterns, directly or indirectly on one or more build substrates with the arrayed preforms being in a longitudinally compressed state and whereafter the preforms are longitudinally plastically deformed to yield probes or partially formed probes with extended longitudinal lengths. Probes may be formed with deformable spring elements formed from one or more single layers which are joined by vertical elements located on other layers or they may be formed by spring elements that are formed as multi-layer structures. Arrays may include probe preforms with laterally overlapping or interlaced structures (but longitudinally displaced) which may remain laterally overlapping or become laterally displaced upon plastic deformation.

公开(公告)号：US20240094252A1

公开(公告)日：2024-03-21

申请号：US17493802

申请日：2021-10-04

Applicant: Microfabrica Inc.

Inventor： Jia Li ,  Arun S. Veeramani ,  Stefano Felici ,  Dennis R. Smalley

IPC: G01R1/067 ,  G01R3/00

CPC classification number: G01R1/06761 ,  G01R1/06716 ,  G01R3/00

Abstract: Dual shield probes are provided having one or more of a plurality of different features including: discontinuous dielectric spacers, fixed nodes, sliding nodes, shield nodes, bridges, stops, interlocked dielectric and conductive elements, along with methods of using and making such probes.

公开(公告)号：US20240085457A1

公开(公告)日：2024-03-14

申请号：US18518116

申请日：2023-11-22

Applicant: Microfabrica Inc.

Inventor： Ming Ting Wu ,  Garret R. Smalley ,  Dennis R. Smalley

IPC: G01R1/067

CPC classification number: G01R1/06722

Abstract: Embodiments are directed to probe structures, arrays, methods of using probes and arrays, and/or methods for making probes and/or arrays. In the various embodiments, probes include at least two springs separated by a movable stop while in other embodiments, three or more springs may be included with two or more movable stops. Movable stops interact with fixed stops that are either part of the probes themselves or part of separate elements that engage with the probes (such as array frame structures) that provide for the retention, longitudinal and/or lateral positioning of probes and possibly for orientation of the probes about a longitudinal axis. Fixed stops provide for controlled limits for movement of the movable stops which in turn allow for enhanced compliant or elastic performance of the probes upon increased probe compression in either one direction, in the order of tip compressions, or in both directions or tip compression orders (e.g. to provide one or more decreases in spring constant upon reaching one or more compression levels (or biasing force levels) with a given tip compression direction and/or order).

公开(公告)号：US20240061017A1

公开(公告)日：2024-02-22

申请号：US18469263

申请日：2023-09-18

Applicant: MICROFABRICA INC.

Inventor： MIchael S. Lockard ,  Uri Frodis ,  Dennis R. Smalley

IPC: G01R1/073 ,  G01R3/00 ,  G01R1/067

CPC classification number: G01R1/07378 ,  G01R3/00 ,  G01R1/06761

Abstract: Probe arrays include spacers attached to the probes that were formed along with the probes. Methods of making probe arrays by (1) forming probes on their sides and possibly as linear arrays or combination subarrays (e.g. as a number of side-to-side joined linear arrays) having probes fixed in array positions by a sacrificial material that is temporarily retained after formation of the probes; (2) assembling the probe units into full array configurations using the spacers attached to the probes or using alternative alignment structures to set the spacing and/or alignment of the probe(s) of one unit with another unit; and (3) fixing the probes in their configurations (e.g. bonding to a substrate and/or engaging the probes with one or more guide plates) wherein the spacers are retained or are removed, in whole or in part, prior to putting the array to use.

公开(公告)号：US11867721B1

公开(公告)日：2024-01-09

申请号：US17139936

申请日：2020-12-31

Applicant: Microfabrica Inc.

Inventor： Ming Ting Wu ,  Garret R. Smalley ,  Dennis R. Smalley

IPC: G01R1/067

CPC classification number: G01R1/06722

Abstract: Embodiments are directed to probe structures, arrays, methods of using probes and arrays, and/or methods for making probes and/or arrays. In the various embodiments, probes include at least two springs separated by a movable stop while in other embodiments, three or more springs may be included with two or more movable stops. Movable stops interact with fixed stops that are either part of the probes themselves or part of separate elements that engage with the probes (such as array frame structures) that provide for the retention, longitudinal and/or lateral positioning of probes and possibly for orientation of the probes about a longitudinal axis. Fixed stops provide for controlled limits for movement of the movable stops which in turn allow for enhanced compliant or elastic performance of the probes upon increased probe compression in either one direction, in the order of tip compressions, or in both directions or tip compression orders (e.g. to provide one or more decreases in spring constant upon reaching one or more compression levels (or biasing force levels) with a given tip compression direction and/or order).

公开(公告)号：US20230358785A1

公开(公告)日：2023-11-09

申请号：US18295716

申请日：2023-04-04

Applicant: Microfabrica Inc.

Inventor： Arun S. Veeramani ,  Ming Ting Wu ,  Dennis R. Smalley

IPC: G01R1/067 ,  G01R1/073

CPC classification number: G01R1/06722 ,  G01R1/06727 ,  G01R1/07314

Abstract: Probe array for contacting electronic components includes a plurality of probes for making contact between two electronic circuit elements and an array plate mounting and retention configuration. The probes may comprise lower retention features that protrudes from a probe body with a size and configuration that limits the longitudinal extent to which the probes can be inserted into plate probe holes of an array plate and an upper retention feature having a lateral configuration that is sized to pass through the extension provided by the side wall feature of the plate probe hole when aligned and after longitudinally locating the upper retention feature above the extension, the retention feature undergoes displacement relative to the upper plate probe hole such that the upper retention feature can no longer longitudinally pass through the extension of the upper plate probe hole.

公开(公告)号：US20230349947A1

公开(公告)日：2023-11-02

申请号：US18295728

申请日：2023-04-04

Applicant: Microfabrica Inc.

Inventor： Arun S. Veeramani ,  Ming Ting Wu ,  Dennis R. Smalley

IPC: G01R1/073 ,  G01R1/067

CPC classification number: G01R1/06722 ,  G01R1/07314

Abstract: Probe array for contacting electronic components includes a plurality of probes for making contact between two electronic circuit elements and an array plate mounting and retention configuration. The probes may comprise lower retention features that protrudes from a probe body with a size and configuration that limits the longitudinal extent to which the probes can be inserted into plate probe holes of a array plate and an upper retention feature comprising at least one tab-like feature extending laterally from the body of the probe at a level above and longitudinally spaced from the lower retention feature; and wherein after longitudinally locating the upper retention feature above the plate probe hole in the array plate, the upper retention feature undergoes lateral displacement such that the upper retention feature can no longer longitudinally pass through the plate probe hole in the array plate.