公开(公告)号：US20090258290A1

公开(公告)日：2009-10-15

申请号：US12487877

申请日：2009-06-19

Applicant: Sang Ho Lee ,  Sang-Do Heo

Inventor： Sang Ho Lee ,  Sang-Do Heo

IPC: H01M2/02

CPC classification number: H01M2/0275 ,  H01M2/021 ,  H01M2/0217 ,  H01M2/0267 ,  H01M2/0287 ,  H01M2/08 ,  H01M10/425 ,  H01M2200/106

Abstract: The present invention is related to a pouch type lithium secondary battery. The pouch type lithium secondary battery according to the present invention may comprise an electrode assembly including a positive electrode, a separator and a negative electrode, and a pouch having a groove for receiving the electrode assembly and upper and lower portions of which are fused to each other around the groove to form flange-shaped edges. In particular, the edges may be at least partially covered at ends thereof with insulating material. As a result, a short circuit between a metal foil of the pouch and the negative electrode of the battery can be prevented, and corrosion of the battery may be also prevented.

Abstract translation: 本发明涉及袋型锂二次电池。 根据本发明的袋型锂二次电池可以包括包括正电极，隔膜和负电极的电极组件和具有用于容纳电极组件的槽的袋，其上部和下部与每个 其他围绕凹槽形成法兰形边。 特别地，边缘可以在其端部至少部分地用绝缘材料覆盖。 结果，可以防止袋的金属箔与电池的负极之间的短路，并且还可以防止电池的腐蚀。

公开(公告)号：US20090212408A1

公开(公告)日：2009-08-27

申请号：US12037291

申请日：2008-02-26

Applicant: DaeSik Choi ,  Sang-Ho Lee ,  Soo-San Park

Inventor： DaeSik Choi ,  Sang-Ho Lee ,  Soo-San Park

IPC: H01L23/49

CPC classification number: H01L23/3128 ,  H01L23/4951 ,  H01L23/49551 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L25/105 ,  H01L2223/6677 ,  H01L2224/32014 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06596 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/01013 ,  H01L2924/078 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: An integrated circuit package system comprising: providing a package die; and connecting a connector lead having a first connector end with a protruded connection surface and a lowered structure over the package die.

Abstract translation: 一种集成电路封装系统，包括：提供封装管芯; 并且将具有第一连接器端部的连接器引线与在封装模具上的突出的连接表面和降低的结构连接。

公开(公告)号：US20090165987A1

公开(公告)日：2009-07-02

申请号：US12306216

申请日：2007-06-22

Applicant: Jung Wook Cho ,  Hyun Seok Jeong ,  Jong Min Park ,  Goo Hwa Kim ,  Oh Duck Kwon ,  Joong Ki Park ,  Soo Kyu Lee ,  Sang Ho Lee ,  Ki Hyeon Moon

Inventor： Jung Wook Cho ,  Hyun Seok Jeong ,  Jong Min Park ,  Goo Hwa Kim ,  Oh Duck Kwon ,  Joong Ki Park ,  Soo Kyu Lee ,  Sang Ho Lee ,  Ki Hyeon Moon

IPC: B22D11/11

CPC classification number: B22D11/108 ,  B22D11/111 ,  B22D11/165

Abstract: The present invention relates to a continuous casting machine and method using molten mold flux. The continuous casting machine includes a mold cover for covering an upper portion of a mold; a mold flux melting unit for melting mold flux to be supplied into the mold; and a mold flux delivery unit for supplying the mold with the molten mold flux melted in the mold flux melting unit, wherein the delivery unit includes an injection tube with one end connected to the mold flux melting unit and the other end positioned in the mold through the mold cover, and an injection tube heater for heating the injection tube. According to the present invention, since a slag bear continuous casting machine and method using molten mold flux is removed, a consumption of mold flux is greatly increased compared with a case of a conventional casting work, so that the friction between a mold and a solidified shell is reduced. As a result, an amount of scarfing of a cast piece is greatly reduced and no carbon pick-up occurs.

Abstract translation: 本发明涉及使用熔融熔渣的连续铸造机和方法。 连续铸造机包括用于覆盖模具的上部的模具盖; 用于熔化待供应到模具中的熔渣的熔模熔化单元; 以及模具通量输送单元，用于向模具供应在熔剂熔化单元中熔化的熔融熔渣，其中所述输送单元包括注射管，所述注射管的一端连接到模具熔剂单元，而另一端位于模具通过 模具盖和用于加热注射管的注射管加热器。 根据本发明，由于去除了渣渣连续铸造机和使用熔融模具助熔剂的方法，与常规铸造工艺相比，模具熔剂的消耗大大增加，使得模具和固化的模具之间的摩擦 壳减少。 结果，铸件的切割量大大降低，并且不会发生碳吸收。

公开(公告)号：US20090152740A1

公开(公告)日：2009-06-18

申请号：US11957862

申请日：2007-12-17

Applicant: Soo-San Park ,  BumJoon Hong ,  Sang-Ho Lee ,  Jong-Woo Ha ,  DaeSik Choi

Inventor： Soo-San Park ,  BumJoon Hong ,  Sang-Ho Lee ,  Jong-Woo Ha ,  DaeSik Choi

IPC: H01L23/538

CPC classification number: H01L23/552 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45014 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73204 ,  H01L2224/73207 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/206

Abstract: An integrated circuit package system includes: mounting a flip chip over a carrier with a non-active side of the flip chip facing the carrier; mounting a substrate over the flip chip; connecting an internal interconnect between the flip chip and the carrier; and encapsulating the flip chip and the internal interconnect over the carrier with the substrate exposed.

Abstract translation: 集成电路封装系统包括：将倒装芯片安装在载体上，其中倒装芯片的非活动侧面向载体; 将衬底安装在倒装芯片上; 连接倒装芯片和载体之间的内部互连; 并且在衬底被暴露的情况下将倒装芯片和内部互连封装在载体上。

公开(公告)号：US20090057861A1

公开(公告)日：2009-03-05

申请号：US11849087

申请日：2007-08-31

Applicant: Soo-San Park ,  BumJoon Hong ,  Sang-Ho Lee ,  Jong-Woo Ha

Inventor： Soo-San Park ,  BumJoon Hong ,  Sang-Ho Lee ,  Jong-Woo Ha

IPC: H01L23/02 ,  H01L21/56

CPC classification number: H01L23/3128 ,  H01L24/48 ,  H01L25/03 ,  H01L25/0657 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/45014 ,  H01L2224/48227 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

Abstract: An integrated circuit package-in-package system includes: mounting a first integrated circuit device over a substrate; mounting an integrated circuit package system having an inner encapsulation over the first integrated circuit device with a first offset; mounting a second integrated circuit device over the first integrated circuit device and adjacent to the integrated circuit package system; connecting the integrated circuit package system and the substrate; and forming a package encapsulation as a cover for the first integrated circuit device, the integrated circuit package system, and the second integrated circuit device.

Abstract translation: 集成电路封装包装系统包括：将第一集成电路器件安装在衬底上; 在第一集成电路装置上安装具有第一偏移的内封装的集成电路封装系统; 将第二集成电路装置安装在所述第一集成电路装置上并与所述集成电路封装系统相邻; 连接集成电路封装系统和基板; 以及形成作为第一集成电路器件，集成电路封装系统和第二集成电路器件的封装的封装封装。

公开(公告)号：US07456088B2

公开(公告)日：2008-11-25

申请号：US11306627

申请日：2006-01-04

Applicant: Soo-San Park ,  Hyeog Chan Kwon ,  Sang-Ho Lee ,  Jong-Woo Ha

Inventor： Soo-San Park ,  Hyeog Chan Kwon ,  Sang-Ho Lee ,  Jong-Woo Ha

IPC: H01L21/44

CPC classification number: H01L25/0657 ,  H01L21/561 ,  H01L23/3128 ,  H01L25/03 ,  H01L25/50 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2225/0651 ,  H01L2225/06555 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An integrated circuit package system is provided including providing a wafer with bond pads formed on the wafer. A solder bump is deposited on one or more bond pads. The bond pads and the solder bump are embedded within a mold compound formed on the wafer. A groove is formed in the mold compound to expose a portion of the solder bump. The wafer is singulated into individual die structures at the groove.

Abstract translation: 提供了一种集成电路封装系统，其包括在晶片上提供形成有接合焊盘的晶片。 焊料凸块沉积在一个或多个焊盘上。 接合焊盘和焊料凸块嵌入在晶片上形成的模具化合物中。 在模具化合物中形成凹槽以暴露焊料凸块的一部分。 将晶片在凹槽处分成单独的模具结构。

公开(公告)号：US07435819B2

公开(公告)日：2008-10-14

申请号：US11664528

申请日：2005-10-11

Applicant: Sang-Geon Kim ,  Seung-Jin Lee ,  Eun-Young Park ,  Mvong-Suk Ko ,  Jin-Wan Kim ,  Kwang-Do Choi ,  Jee-Woong Lim ,  Sang-Ho Lee

Inventor： Sang-Geon Kim ,  Seung-Jin Lee ,  Eun-Young Park ,  Mvong-Suk Ko ,  Jin-Wan Kim ,  Kwang-Do Choi ,  Jee-Woong Lim ,  Sang-Ho Lee

IPC: C07D471/02 ,  A61K31/44

CPC classification number: C07D495/04

Abstract: The present invention relates to new compounds directly increasing kinase activity of p90 ribosomal S6 kinase 1 (RSK1), a pharmaceutical composition comprising them as active ingredient, a use thereof to prevent or treat hepatic fibrosis or cirrhosis, and a method for preventing or treating hepatic fiborsis or cirrhosis, comprising administering a therapeutically effective amount of the composition to mammal.

Abstract translation: 本发明涉及直接增加p90核糖体S6激酶1（RSK1）的激酶活性的新化合物，其是包含它们作为活性成分的药物组合物，其用于预防或治疗肝纤维化或肝硬化的用途，以及用于预防或治疗肝脏的方法 纤维性或肝硬化，包括向哺乳动物施用治疗有效量的组合物。

公开(公告)号：US07412354B2

公开(公告)日：2008-08-12

申请号：US11410834

申请日：2006-04-26

Applicant: Sang Ho Lee ,  Jang Keun Oh

Inventor： Sang Ho Lee ,  Jang Keun Oh

IPC: G06F15/00

CPC classification number: G06F11/3419 ,  G06F11/3423 ,  Y02D10/34

Abstract: The present invention relates to a method for measuring a quantity of usage of a CPU, in particular to a method for measuring a quantity of usage of a CPU which is capable of getting a credible quantity of usage of a CPU without amending an algorithm in order to adapt it to the an operating system, e.g., MS-Windows System, or requiring a complicated code. The method uses various algorithms provided by the operating system on the behalf of a registry storing a quantity of usage of a CPU inside a system. Accordingly the present invention can measure a quantity of usage of a CPU easily without lowering a performance of the operating system.

Abstract translation: 本发明涉及一种用于测量CPU使用量的方法，特别涉及一种用于测量CPU使用量的方法，该方法能够获得CPU的可靠数量的使用量，而无需按顺序修改算法 以适应操作系统，例如MS-Windows系统，或需要复杂的代码。 该方法使用由操作系统提供的各种算法，代表存储系统内CPU使用量的注册表。 因此，本发明可以容易地测量CPU的使用量而不降低操作系统的性能。

公开(公告)号：US20080172663A1

公开(公告)日：2008-07-17

申请号：US11953191

申请日：2007-12-10

Applicant: Sang Ho Lee

Inventor： Sang Ho Lee

IPC: G06F9/44 ,  G06F15/16

CPC classification number: H04L51/38

Abstract: A method of displaying an attachment file list in a mobile communication terminal comprises receiving a message, selecting an attachment file list view menu in order to check entire attachment files comprised in the message, and extracting the attachment files comprised in the message and then displaying a list of the extracted attachment files.

Abstract translation: 一种在移动通信终端中显示附件文件列表的方法包括接收消息，选择附件文件列表视图菜单以便检查包含在消息中的整个附件文件，以及提取消息中包含的附件​​文件，然后显示 提取的附件文件列表。

公开(公告)号：US20080153262A1

公开(公告)日：2008-06-26

申请号：US11615929

申请日：2006-12-22

Applicant: Taewoo Lee ,  Sang-Ho Lee

Inventor： Taewoo Lee ,  Sang-Ho Lee

IPC: H01L21/304

CPC classification number: H01L21/78

Abstract: A wafer system is provided including providing a wafer having a topside and a backside, forming a partial cut from the topside of the wafer within a wafer rim and thinning the wafer from the backside for exposing the partial cut at the backside within the wafer rim.

Abstract translation: 提供晶片系统，其包括提供具有顶侧和后侧的晶片，在晶片边缘内从晶片的顶侧形成部分切割，并从晶片边缘减薄晶片，以暴露晶片边缘内侧的部分切割。