公开(公告)号：US08383458B2

公开(公告)日：2013-02-26

申请号：US12974265

申请日：2010-12-21

申请人： DaeSik Choi ,  BumJoon Hong ,  Sang-Ho Lee ,  Jong-Woo Ha ,  Soo-San Park

发明人： DaeSik Choi ,  BumJoon Hong ,  Sang-Ho Lee ,  Jong-Woo Ha ,  Soo-San Park

IPC分类号： H01L21/00 ,  H01L23/02

CPC分类号： H01L24/81 ,  H01L23/552 ,  H01L24/14 ,  H01L24/17 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L25/03 ,  H01L25/105 ,  H01L2224/1134 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/32014 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/81194 ,  H01L2224/81801 ,  H01L2224/83 ,  H01L2224/8592 ,  H01L2225/06562 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1088 ,  H01L2924/00013 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/3025 ,  H01L2924/3511 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2924/00012 ,  H01L2924/00011 ,  H01L2924/00

摘要： A method for manufacturing an integrated circuit package system includes: providing a base package including a first integrated circuit coupled to a base substrate by an electrical interconnect formed on one side; and mounting an offset package over the base package, the offset package electrically coupled to the base substrate via a system interconnect.

摘要翻译： 一种用于制造集成电路封装系统的方法，包括：通过在一侧形成的电互连，提供包括耦合到基底基板的第一集成电路的基底封装; 以及将偏移封装安装在所述基底封装上，所述偏移封装通过系统互连电耦合到所述基底衬底。

公开(公告)号：US20090057864A1

公开(公告)日：2009-03-05

申请号：US12201896

申请日：2008-08-29

申请人： DaeSik Choi ,  BumJoon Hong ,  Sang-Ho Lee ,  Jong-Woo Ha ,  Soo-San Park

发明人： DaeSik Choi ,  BumJoon Hong ,  Sang-Ho Lee ,  Jong-Woo Ha ,  Soo-San Park

IPC分类号： H01L23/488 ,  H01L21/58

CPC分类号： H01L24/81 ,  H01L23/552 ,  H01L24/14 ,  H01L24/17 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L25/03 ,  H01L25/105 ,  H01L2224/1134 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/32014 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/81194 ,  H01L2224/81801 ,  H01L2224/83 ,  H01L2224/8592 ,  H01L2225/06562 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1088 ,  H01L2924/00013 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/3025 ,  H01L2924/3511 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2924/00012 ,  H01L2924/00011 ,  H01L2924/00

摘要： A method for manufacturing an integrated circuit package system includes: providing a base package including a first integrated circuit coupled to a base substrate by an electrical interconnect formed on one side; and mounting an offset package over the base package, the offset package electrically coupled to the base substrate via a system interconnect.

摘要翻译： 一种用于制造集成电路封装系统的方法，包括：通过在一侧形成的电互连，提供包括耦合到基底基板的第一集成电路的基底封装; 以及将偏移封装安装在所述基底封装上，所述偏移封装通过系统互连电耦合到所述基底衬底。

公开(公告)号：US20110084373A1

公开(公告)日：2011-04-14

申请号：US12974265

申请日：2010-12-21

申请人： DaeSik Choi ,  BumJoon Hong ,  Sang-Ho Lee ,  Jong-Woo Ha ,  Soo-San Park

发明人： DaeSik Choi ,  BumJoon Hong ,  Sang-Ho Lee ,  Jong-Woo Ha ,  Soo-San Park

IPC分类号： H01L23/48 ,  H01L21/50

CPC分类号： H01L24/81 ,  H01L23/552 ,  H01L24/14 ,  H01L24/17 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L25/03 ,  H01L25/105 ,  H01L2224/1134 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/32014 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/81194 ,  H01L2224/81801 ,  H01L2224/83 ,  H01L2224/8592 ,  H01L2225/06562 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1088 ,  H01L2924/00013 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/3025 ,  H01L2924/3511 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2924/00012 ,  H01L2924/00011 ,  H01L2924/00

摘要： A method for manufacturing an integrated circuit package system includes: providing a base package including a first integrated circuit coupled to a base substrate by an electrical interconnect formed on one side; and mounting an offset package over the base package, the offset package electrically coupled to the base substrate via a system interconnect.

摘要翻译： 一种用于制造集成电路封装系统的方法，包括：通过在一侧形成的电互连，提供包括耦合到基底基板的第一集成电路的基底封装; 以及将偏移封装安装在所述基底封装上，所述偏移封装通过系统互连电耦合到所述基底衬底。

公开(公告)号：US07872340B2

公开(公告)日：2011-01-18

申请号：US12201896

申请日：2008-08-29

申请人： DaeSik Choi ,  BumJoon Hong ,  Sang-Ho Lee ,  Jong-Woo Ha ,  Soo-San Park

发明人： DaeSik Choi ,  BumJoon Hong ,  Sang-Ho Lee ,  Jong-Woo Ha ,  Soo-San Park

IPC分类号： H01L23/02

CPC分类号： H01L24/81 ,  H01L23/552 ,  H01L24/14 ,  H01L24/17 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L25/03 ,  H01L25/105 ,  H01L2224/1134 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/32014 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/81194 ,  H01L2224/81801 ,  H01L2224/83 ,  H01L2224/8592 ,  H01L2225/06562 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1088 ,  H01L2924/00013 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/3025 ,  H01L2924/3511 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2924/00012 ,  H01L2924/00011 ,  H01L2924/00

摘要： A method for manufacturing an integrated circuit package system includes: providing a base package including a first integrated circuit coupled to a base substrate by an electrical interconnect formed on one side; and mounting an offset package over the base package, the offset package electrically coupled to the base substrate via a system interconnect.

摘要翻译： 一种用于制造集成电路封装系统的方法，包括：通过在一侧形成的电互连，提供包括耦合到基底基板的第一集成电路的基底封装; 以及将偏移封装安装在所述基底封装上，所述偏移封装通过系统互连电耦合到所述基底衬底。

公开(公告)号：US20090152740A1

公开(公告)日：2009-06-18

申请号：US11957862

申请日：2007-12-17

申请人： Soo-San Park ,  BumJoon Hong ,  Sang-Ho Lee ,  Jong-Woo Ha ,  DaeSik Choi

发明人： Soo-San Park ,  BumJoon Hong ,  Sang-Ho Lee ,  Jong-Woo Ha ,  DaeSik Choi

IPC分类号： H01L23/538

CPC分类号： H01L23/552 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45014 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73204 ,  H01L2224/73207 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/206

摘要： An integrated circuit package system includes: mounting a flip chip over a carrier with a non-active side of the flip chip facing the carrier; mounting a substrate over the flip chip; connecting an internal interconnect between the flip chip and the carrier; and encapsulating the flip chip and the internal interconnect over the carrier with the substrate exposed.

摘要翻译： 集成电路封装系统包括：将倒装芯片安装在载体上，其中倒装芯片的非活动侧面向载体; 将衬底安装在倒装芯片上; 连接倒装芯片和载体之间的内部互连; 并且在衬底被暴露的情况下将倒装芯片和内部互连封装在载体上。

公开(公告)号：US20090057862A1

公开(公告)日：2009-03-05

申请号：US11849127

申请日：2007-08-31

申请人： Jong-Woo Ha ,  BumJoon Hong ,  Sang-Ho Lee ,  Soo-San Park

发明人： Jong-Woo Ha ,  BumJoon Hong ,  Sang-Ho Lee ,  Soo-San Park

IPC分类号： H01L23/538 ,  H01L21/56

CPC分类号： H01L25/03 ,  H01L23/3128 ,  H01L24/73 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73257 ,  H01L2224/73265 ,  H01L2225/06558 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/19105 ,  H01L2924/19106 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2924/00012

摘要： An integrated circuit package-in-package system includes: mounting an integrated circuit device over a package carrier; forming a subassembly including: providing an integrated circuit package system having a carrier interposer with an integrated circuit die thereover, and mounting a device under the carrier interposer; mounting the subassembly over the integrated circuit device; and encapsulating the subassembly and the integrated circuit device over the package carrier.

摘要翻译： 集成电路封装包装系统包括：将集成电路装置安装在封装载体上; 形成子组件，其包括：提供集成电路封装系统，其具有其上具有集成电路管芯的载体插入器，以及将器件安装在所述载体插入器下; 将组件安装在集成电路装置上; 并将该组件和该集成电路器件封装在该封装载体上。

公开(公告)号：US07812435B2

公开(公告)日：2010-10-12

申请号：US11849087

申请日：2007-08-31

申请人： Soo-San Park ,  BumJoon Hong ,  Sang-Ho Lee ,  Jong-Woo Ha

发明人： Soo-San Park ,  BumJoon Hong ,  Sang-Ho Lee ,  Jong-Woo Ha

IPC分类号： H01L23/02

CPC分类号： H01L23/3128 ,  H01L24/48 ,  H01L25/03 ,  H01L25/0657 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/45014 ,  H01L2224/48227 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： An integrated circuit package-in-package system includes: mounting a first integrated circuit device over a substrate; mounting an integrated circuit package system having an inner encapsulation over the first integrated circuit device with a first offset; mounting a second integrated circuit device over the first integrated circuit device and adjacent to the integrated circuit package system; connecting the integrated circuit package system and the substrate; and forming a package encapsulation as a cover for the first integrated circuit device, the integrated circuit package system, and the second integrated circuit device.

摘要翻译： 集成电路封装包装系统包括：将第一集成电路器件安装在衬底上; 在第一集成电路装置上安装具有第一偏移的内封装的集成电路封装系统; 将第二集成电路装置安装在所述第一集成电路装置上并与所述集成电路封装系统相邻; 连接集成电路封装系统和基板; 以及形成作为第一集成电路器件，集成电路封装系统和第二集成电路器件的封装的封装封装。

公开(公告)号：US20090057861A1

公开(公告)日：2009-03-05

申请号：US11849087

申请日：2007-08-31

申请人： Soo-San Park ,  BumJoon Hong ,  Sang-Ho Lee ,  Jong-Woo Ha

发明人： Soo-San Park ,  BumJoon Hong ,  Sang-Ho Lee ,  Jong-Woo Ha

IPC分类号： H01L23/02 ,  H01L21/56

CPC分类号： H01L23/3128 ,  H01L24/48 ,  H01L25/03 ,  H01L25/0657 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/45014 ,  H01L2224/48227 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： An integrated circuit package-in-package system includes: mounting a first integrated circuit device over a substrate; mounting an integrated circuit package system having an inner encapsulation over the first integrated circuit device with a first offset; mounting a second integrated circuit device over the first integrated circuit device and adjacent to the integrated circuit package system; connecting the integrated circuit package system and the substrate; and forming a package encapsulation as a cover for the first integrated circuit device, the integrated circuit package system, and the second integrated circuit device.

摘要翻译： 集成电路封装包装系统包括：将第一集成电路器件安装在衬底上; 在第一集成电路装置上安装具有第一偏移的内封装的集成电路封装系统; 将第二集成电路装置安装在所述第一集成电路装置上并与所述集成电路封装系统相邻; 连接集成电路封装系统和基板; 以及形成作为第一集成电路器件，集成电路封装系统和第二集成电路器件的封装的封装封装。

公开(公告)号：US20100320621A1

公开(公告)日：2010-12-23

申请号：US12871031

申请日：2010-08-30

申请人： Soo-San Park ,  BumJoon Hong ,  Sang-Ho Lee ,  Jong-Woo Ha

发明人： Soo-San Park ,  BumJoon Hong ,  Sang-Ho Lee ,  Jong-Woo Ha

IPC分类号： H01L23/538 ,  H01L21/60

CPC分类号： H01L23/3128 ,  H01L24/48 ,  H01L25/03 ,  H01L25/0657 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/45014 ,  H01L2224/48227 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method for manufacturing of an integrated circuit package-in-package system includes: mounting a first integrated circuit device over a substrate; mounting an integrated circuit package system having an inner encapsulation over the first integrated circuit device with a first offset; mounting a second integrated circuit device over the first integrated circuit device and adjacent to the integrated circuit package system; connecting the integrated circuit package system and the substrate; and forming a package encapsulation as a cover for the first integrated circuit device, the integrated circuit package system, and the second integrated circuit device.

摘要翻译： 一种用于制造集成电路封装包装系统的方法，包括：将第一集成电路器件安装在衬底上; 在第一集成电路装置上安装具有第一偏移的内封装的集成电路封装系统; 将第二集成电路装置安装在所述第一集成电路装置上并与所述集成电路封装系统相邻; 连接集成电路封装系统和基板; 以及形成作为第一集成电路器件，集成电路封装系统和第二集成电路器件的封装的封装封装。

公开(公告)号：US08093727B2

公开(公告)日：2012-01-10

申请号：US12871031

申请日：2010-08-30

申请人： Soo-San Park ,  BumJoon Hong ,  Sang-Ho Lee ,  Jong-Woo Ha

发明人： Soo-San Park ,  BumJoon Hong ,  Sang-Ho Lee ,  Jong-Woo Ha

IPC分类号： H01L23/538

CPC分类号： H01L23/3128 ,  H01L24/48 ,  H01L25/03 ,  H01L25/0657 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/45014 ,  H01L2224/48227 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method for manufacturing of an integrated circuit package-in-package system includes: mounting a first integrated circuit device over a substrate; mounting an integrated circuit package system having an inner encapsulation over the first integrated circuit device with a first offset; mounting a second integrated circuit device over the first integrated circuit device and adjacent to the integrated circuit package system; connecting the integrated circuit package system and the substrate; and forming a package encapsulation as a cover for the first integrated circuit device, the integrated circuit package system, and the second integrated circuit device.

摘要翻译： 一种用于制造集成电路封装包装系统的方法，包括：将第一集成电路器件安装在衬底上; 在第一集成电路装置上安装具有第一偏移的内封装的集成电路封装系统; 将第二集成电路装置安装在所述第一集成电路装置上并与所述集成电路封装系统相邻; 连接集成电路封装系统和基板; 以及形成作为第一集成电路器件，集成电路封装系统和第二集成电路器件的封装的封装封装。