公开(公告)号：US07929033B2

公开(公告)日：2011-04-19

申请号：US12173002

申请日：2008-07-14

Applicant: Chi-Kuei Lee ,  Ying-Cheng Wu

Inventor： Chi-Kuei Lee ,  Ying-Cheng Wu

IPC: H04N5/335 ,  H01L27/00

CPC classification number: H01L27/14618 ,  H01L25/043 ,  H01L25/0657 ,  H01L27/14625 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/09701 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: An image sensor package includes a first substrate, an image sensor chip, a processing chip and a plurality of passive elements. The first substrate has a supporting surface and a bottom surface opposite to the supporting surface. The image sensor chip is disposed on the supporting surface and electrically connected to the first substrate. The image sensor chip package further includes a second substrate. The processing chip and the passive elements are mounted on the second substrate and electrically connected to the second substrate. The bottom surface of the first substrate defines a cavity for receiving the second substrate, the processing chip and the passive elements therein.

Abstract translation: 图像传感器封装包括第一基板，图像传感器芯片，处理芯片和多个无源元件。 第一基板具有支撑表面和与支撑表面相对的底表面。 图像传感器芯片设置在支撑表面上并电连接到第一基板。 图像传感器芯片封装还包括第二基板。 处理芯片和无源元件安装在第二基板上并电连接到第二基板。 第一基板的底表面限定用于接收第二基板，处理芯片和其中的无源元件的空腔。

公开(公告)号：US07916212B2

公开(公告)日：2011-03-29

申请号：US12210534

申请日：2008-09-15

Applicant: Ying-Cheng Wu ,  Te-Chun Chou

Inventor： Ying-Cheng Wu ,  Te-Chun Chou

IPC: H04N5/225 ,  H01L31/0203

CPC classification number: H01L27/14618 ,  H01L27/14625 ,  H01L27/14636 ,  H01L2224/05001 ,  H01L2224/05023 ,  H01L2224/131 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/3025 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2924/014

Abstract: An image sensor package includes an image sensor chip, a sidewall, an encapsulation glass, conductive material, and a plurality of solder balls. The image sensor chip comprises a photosensitive area, a non-photosensitive area surrounding the photosensitive area, and a plurality of bonding pads formed on the non-photosensitive area. The sidewall is located on the non-photosensitive are and defines a plurality of first through holes aligned with and corresponding to the bonding pads. The encapsulation glass is located on the sidewall. A plurality of solder balls are formed on the encapsulation glass aligned with the bonding pads, respectively. The encapsulation glass defines a plurality of second through holes each corresponding to a bonding pad and a corresponding solder ball. The image sensor package further comprises a conductive material through which the first and second through holes penetrate.

Abstract translation: 图像传感器封装包括图像传感器芯片，侧壁，封装玻璃，导电材料和多个焊球。 图像传感器芯片包括感光区域，环绕感光区域的非感光区域和形成在非感光区域上的多个接合焊盘。 侧壁位于非感光体上，并且限定与接合焊盘对准并对应于接合焊盘的多个第一通孔。 封装玻璃位于侧壁上。 分别在与焊盘对准的封装玻璃上形成多个焊球。 封装玻璃限定多个第二通孔，每个通孔对应于焊盘和相应的焊球。 图像传感器封装还包括导电材料，第一和第二通孔穿过该导电材料。

公开(公告)号：US20110048949A1

公开(公告)日：2011-03-03

申请号：US12548876

申请日：2009-08-27

Applicant: Yuanpang Samuel Ding ,  Ying-Cheng Lo

Inventor： Yuanpang Samuel Ding ,  Ying-Cheng Lo

IPC: B01D61/48 ,  B01D61/44

CPC classification number: A61M1/1696 ,  A61M1/284 ,  A61M1/287 ,  A61M2209/088

Abstract: Dialysis treatment devices and methods for removing urea from dialysis waste streams are provided. In a general embodiment, the present disclosure provides a dialysis treatment device including a first cell having a first electrodialysis unit, a second cell having at least one of a urease compartment and a sorbent compartment and in fluid communication with the first cell, and a third cell having a second electrodialysis unit and in fluid communication with the second cell.

Abstract translation: 提供了用于从透析废物流中除去尿素的透析治疗装置和方法。 在一般实施方案中，本公开提供了一种透析治疗装置，其包括具有第一电渗析装置的第一细胞，具有尿素酶隔室和吸附剂隔室中的至少一个并与第一细胞流体连通的第二细胞， 电池具有第二电渗析单元并与第二电池流体连通。

公开(公告)号：US20100272185A1

公开(公告)日：2010-10-28

申请号：US12311375

申请日：2006-09-30

Applicant: Yong Ying Gao ,  Yu Wen Wu ,  Ying Cheng

Inventor： Yong Ying Gao ,  Yu Wen Wu ,  Ying Cheng

IPC: H04N7/50

CPC classification number: H04N19/34 ,  H04N19/122 ,  H04N19/14 ,  H04N19/176 ,  H04N19/186 ,  H04N19/196 ,  H04N19/33 ,  H04N19/463

Abstract: Enhanced dynamic range requires more than 8 bit representation for single color components of pixels. For this purpose, normal color resolution images and high color resolution images are available. Backward compatibility can be achieved by a layered approach using a color enhancement layer, and a conventional image as color base layer. Both have same spatial and temporal resolution. Encoding of the color enhancement layer uses prediction and residual. A methods for optimized color enhancement prediction is disclosed. Color bit depth prediction is done by constructing a polynomial that approximates for all pixels of one color component of a block the color enhancement layer from the color base layer. A predicted version of the high color resolution image and a residual are generated and updated by a residual. The coefficients are compressed and added as metadata to the data stream.

Abstract translation: 增强的动态范围对于像素的单色组件需要超过8位的表示。 为此，可以使用正常的颜色分辨率图像和高分辨率图像。 可以通过使用颜色增强层和常规图像作为基色层的分层方法来实现向后兼容性。 两者具有相同的空间和时间分辨率。 颜色增强层的编码使用预测和残差。 公开了一种用于优化颜色增强预测的方法。 通过构建一个多项式来完成彩色位深度预测，所述多项式近似来自颜色基础层的颜色增强层的块的一个颜色分量的所有像素。 通过残差生成和更新高分辨率图像和残差的预测版本。 系数被压缩并作为元数据添加到数据流中。

公开(公告)号：US20100259949A1

公开(公告)日：2010-10-14

申请号：US12757345

申请日：2010-04-09

Applicant: Zhi-Ting YE ,  Chang-Wei Yu ,  Nien-Ying Yang ,  Kuo-Jui Huang ,  Ying-Cheng Shih ,  Hsiu-Ping Lee

Inventor： Zhi-Ting YE ,  Chang-Wei Yu ,  Nien-Ying Yang ,  Kuo-Jui Huang ,  Ying-Cheng Shih ,  Hsiu-Ping Lee

IPC: F21V7/04

CPC classification number: G02B6/0055 ,  G02B6/0088

Abstract: A backlight module includes a frame, a reflective sheet, a light guide plate, a light source, and an optical film set. The frame defines an accommodation space, and the reflective sheet is disposed in the accommodation space. The light guide plate is disposed in the accommodation space and on one surface of the reflective sheet. The optical film set is disposed one side of the light guide plate opposite the reflective sheet. The reflective sheet is hollowed out at a position overlapping the light source to form at least one opening so as to reduce light halos.

Abstract translation: 背光模块包括框架，反射片，导光板，光源和光学膜组。 框架限定了容纳空间，并且反射片设置在容纳空间中。 导光板设置在容纳空间和反射片的一个表面上。 光学膜组被设置在与反射片相对的导光板的一侧。 反射片在与光源重叠的位置处被挖空以形成至少一个开口，以便减少光晕。

公开(公告)号：US20100217178A1

公开(公告)日：2010-08-26

申请号：US12389751

申请日：2009-02-20

Applicant: Ying-Cheng Lo ,  Alp Akonur ,  Isaac Martis ,  Andrew C. Hayes

Inventor： Ying-Cheng Lo ,  Alp Akonur ,  Isaac Martis ,  Andrew C. Hayes

IPC: A61M1/28 ,  G06N5/02 ,  G06F17/10 ,  G06G7/60

CPC classification number: A61M1/28 ,  A61M1/1613 ,  A61M1/287 ,  G06F19/3481 ,  G16H50/50

Abstract: A method for peritoneal dialysis treatment includes (i) predicting results of a plurality of patient therapy outcomes for a plurality of different mixed dextrose level dialysis solutions; (ii) selecting one of the mixed dextrose level solutions for a patient based on the results; and (iii) performing at least one therapy using different unmixed dextrose level solutions that combine to simulate a like cumulative concentration that would be achieved using the selected mixed dextrose level solution.

Abstract translation: 腹膜透析治疗的方法包括（i）预测多种不同混合葡萄糖水平透析溶液的多种患者治疗结果的结果; （ii）基于结果选择患者的混合葡萄糖水平溶液之一; 和（iii）使用不同混合葡萄糖水平溶液进行至少一种治疗，其组合以模拟使用所选择的混合葡萄糖水平溶液将达到的类似累积浓度。

公开(公告)号：US07700991B2

公开(公告)日：2010-04-20

申请号：US11946868

申请日：2007-11-29

Applicant: Ching-Nan Hsiao ,  Ying-Cheng Chuang ,  Chung-Lin Huang ,  Shih-Yang Chiu

Inventor： Ching-Nan Hsiao ,  Ying-Cheng Chuang ,  Chung-Lin Huang ,  Shih-Yang Chiu

IPC: H01L29/76

CPC classification number: H01L29/7881 ,  H01L29/66825

Abstract: A method for fabricating the memory structure includes: providing a substrate having a pad, forming an opening in the pad, forming a first spacer on a sidewall of the opening, filling the opening with a sacrificial layer, removing the first spacer and exposing a portion of the substrate, removing the exposed substrate to define a first trench and a second trench, removing the sacrificial layer to expose a surface of the substrate to function as a channel region, forming a first dielectric layer on a surface of the first trench, a surface of the second trench and a surface of the channel region, filling the first trench and the second trench with a first conductive layer, forming a second dielectric layer on a surface of the first conductive layer and the surface of the channel region, filling the opening with a second conductive layer, and removing the pad.

Abstract translation: 一种用于制造存储器结构的方法包括：提供具有焊盘的衬底，在焊盘中形成开口，在开口的侧壁上形成第一间隔物，用牺牲层填充开口，移除第一间隔物并露出一部分 去除所述暴露的衬底以限定第一沟槽和第二沟槽，去除所述牺牲层以暴露所述衬底的表面以用作沟道区域，在所述第一沟槽的表面上形成第一介电层， 第二沟槽的表面和沟道区的表面，用第一导电层填充第一沟槽和第二沟槽，在第一导电层的表面和沟道区的表面上形成第二介电层，填充第二沟槽 用第二导电层打开，并移除垫。

公开(公告)号：US07696465B2

公开(公告)日：2010-04-13

申请号：US12192084

申请日：2008-08-14

Applicant: Ying-Cheng Wu ,  Chi-Kuei Lee ,  Shih-Min Wang

Inventor： Ying-Cheng Wu ,  Chi-Kuei Lee ,  Shih-Min Wang

IPC: H01L27/00

CPC classification number: H01L27/14618 ,  H01L27/14683 ,  H01L2224/05001 ,  H01L2224/05026 ,  H01L2224/13 ,  H01L2224/13025 ,  H01L2924/00014 ,  H01L2224/05099

Abstract: An exemplary image sensor package includes a substrate, an imaging area, a circuit layer and two passive components. The substrate has a first surface and a second surface, which are opposite to each other. An image sensing area is formed on the first surface of the substrate and a circuit layer is formed on the second surface of the substrate. The passive components opposite to the image sensing area are soldered to the circuit layer of the second surface.

Abstract translation: 示例性的图像传感器封装包括基板，成像区域，电路层和两个无源部件。 基板具有彼此相对的第一表面和第二表面。 在基板的第一表面上形成图像感测区域，并且在基板的第二表面上形成电路层。 与图像感测区域相对的无源部件被焊接到第二表面的电路层。

公开(公告)号：US07554184B2

公开(公告)日：2009-06-30

申请号：US11448570

申请日：2006-06-07

Applicant: Steven Webster ,  Ying-Cheng Wu

Inventor： Steven Webster ,  Ying-Cheng Wu

IPC: H01L23/02 ,  H01L23/48

CPC classification number: H01L27/14618 ,  H01L27/14683 ,  H01L31/0203 ,  H01L2224/32014 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2924/16195 ,  H01L2924/00014

Abstract: A chip package (200) includes a carrier (20), a chip (22), a second conductive means (26) and a transparent cover (28). The carrier (20) includes a base (24). The chip is mounted on the base and has an active area (222). The second conductive means electronically connects the chip with the conductive means. The first adhesive means is applied around the active area of the chip. The transparent cover is mounted to the base of the carrier. The cover is adhered with the first adhesive means so as to define a sealing space (32) for sealing the active area of the chip therein. It can be seen that the active area of the chip is sufficiently protected from pollution by the small volume of the sealing space.

Abstract translation: 芯片封装（200）包括载体（20），芯片（22），第二导电装置（26）和透明盖（28）。 载体（20）包括基座（24）。 芯片安装在基座上并具有有源区域（222）。 第二导电装置将芯片与导电装置电连接。 第一粘合装置被施加在芯片的有效区域周围。 透明盖安装在托架的底座上。 该盖用第一粘合装置粘合以便限定用于密封芯片的有效区域的密封空间（32）。 可以看出，芯片的有效面积被充分保护，免受小体积密封空间的污染。

公开(公告)号：US20090143723A1

公开(公告)日：2009-06-04

申请号：US11947261

申请日：2007-11-29

Applicant: Edward Szpara ,  Steven C. Jepson ,  Michael A. Gloss ,  Paul D. Rahn ,  William R. Griswold ,  Ying-Cheng Lo

Inventor： Edward Szpara ,  Steven C. Jepson ,  Michael A. Gloss ,  Paul D. Rahn ,  William R. Griswold ,  Ying-Cheng Lo

IPC: A61M1/28

CPC classification number: A61M1/28 ,  A61M1/282 ,  A61M1/288 ,  A61M39/105 ,  A61M39/223 ,  A61M39/284 ,  A61M39/285 ,  A61M2039/1061

Abstract: A peritoneal dialysis flow control device in one embodiment includes: (i) a first cap including a first medical fluid line connection and a second medical fluid line connection; (ii) a gasket mated with the first cap where the gasket defines a first aperture in fluid communication with a first port and a second aperture in fluid communication with a second port; and (iii) a second cap including a third medical fluid line connection where the second cap is sealed rotatably to the gasket.

Abstract translation: 一个实施例中的腹膜透析流量控制装置包括：（i）第一帽，其包括第一医疗流体管线连接和第二医疗流体管线连接; （ii）与所述第一盖配合的垫圈，其中所述垫圈限定与第一端口流体连通的第一孔和与第二端口流体连通的第二孔; 和（iii）第二帽，其包括第三医疗流体管线连接，其中第二帽可旋转地密封到垫圈。