公开(公告)号：USD591328S1

公开(公告)日：2009-04-28

申请号：US29271027

申请日：2007-01-09

Applicant: Chih-Ming Chen

Designer： Chih-Ming Chen

公开(公告)号：USD585852S1

公开(公告)日：2009-02-03

申请号：US29287612

申请日：2007-08-29

Applicant: Chih-Ming Chen

Designer： Chih-Ming Chen

公开(公告)号：US20080230884A1

公开(公告)日：2008-09-25

申请号：US11725827

申请日：2007-03-19

Applicant: Wen-Kun Yang ,  Diann-Fang Lin ,  Tung-Chuan Wang ,  Hsien-Wen Hsu ,  Chih-Ming Chen

Inventor： Wen-Kun Yang ,  Diann-Fang Lin ,  Tung-Chuan Wang ,  Hsien-Wen Hsu ,  Chih-Ming Chen

IPC: H01L23/02 ,  H01L23/48 ,  H01L23/04 ,  H01L23/52

CPC classification number: H01L23/3128 ,  H01L23/3135 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0655 ,  H01L25/50 ,  H01L2224/05554 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2924/00014 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: The present invention provides a semiconductor device package having multi-chips with side-by-side configuration comprising a substrate with die receiving through holes, connecting through holes structure and first contact pads on an upper surface and second contact pads on a lower surface of the substrate. A first die having first bonding pads and a second die having second bonding pads are respectively disposed within the die receiving through holes. The first adhesion material is formed under the first and second die and the substrate, and the second adhesion material is filled in the gap between the first and second die and sidewall of the die receiving though holes of the substrate. Further, bonding wires are formed to couple between the first bonding pads and the first contact pads, between the second bonding pads and the first contact pads. A dielectric layer is formed on the bonding wires, the first and second die and the substrate. A build up layer is form on the lower surface of substrate and the back side of first and second die.

Abstract translation: 本发明提供一种具有并排配置的多芯片的半导体器件封装，包括：具有通孔的基板，其中，所述基板具有通孔，连接通孔结构和上表面上的第一接触焊盘;以及第二接触焊盘， 基质。 具有第一接合焊盘的第一管芯和具有第二接合焊盘的第二管芯分别设置在管芯接收通孔内。 第一粘合材料形成在第一模具和第二模具和基板之下，并且第二粘合材料填充在第一和第二模具之间的间隙中以及接收基板的贯穿孔的模具的侧壁。 此外，形成接合线以在第二接合焊盘和第一接触焊盘之间在第一接合焊盘和第一接触焊盘之间耦合。 在接合线，第一和第二管芯和基板上形成介电层。 在基板的下表面和第一和第二模具的背面上形成堆积层。

公开(公告)号：US20080182776A1

公开(公告)日：2008-07-31

申请号：US11700226

申请日：2007-01-31

Applicant: Yu-Der Lee ,  Chi-Yu Huang ,  Chih-Ming Chen

Inventor： Yu-Der Lee ,  Chi-Yu Huang ,  Chih-Ming Chen

IPC: A61K31/711 ,  A61K38/02 ,  A61K47/14 ,  A61K31/167 ,  A61K31/37

CPC classification number: A61K9/5138 ,  A61K9/1075 ,  A61K9/5192 ,  A61K31/167 ,  A61K31/37 ,  A61K31/711

Abstract: A process for preparing the drug-loaded cyanoacrylate nanoparticles is described. The cyanoacrylate nanoparticles which effectively deliver biological and therapeutic agents are synthesized by miniemulsion polymerization with surfactant, pluronic F127 or F68. Before initiation of polymerization, active agents with particularly highly hydrophobicity are dissolved in cyanoacrylate monomer. Compared with the drug-loaded polyalkylcyanoacrylate nanoparticles produced by emulsion polymerization, those produced by miniemulsion polymerization possess higher loading and encapsulation efficiencies. While the content of dissolved agents increases, furthermore, the loading and encapsulation efficiencies increase concurrently.

Abstract translation: 描述了制备负载药物的氰基丙烯酸酯纳米颗粒的方法。 通过与表面活性剂pluronic F127或F68的细乳液聚合合成有效递送生物和治疗剂的氰基丙烯酸酯纳米粒子。 在聚合开始之前，具有特别高度疏水性的活性剂溶解在氰基丙烯酸酯单体中。 与通过乳液聚合制备的载药聚氰基丙烯酸甲酯纳米颗粒相比，通过细乳液聚合制备的纳米颗粒具有更高的负载和包封效率。 而溶解剂的含量增加，此外，负载和封装效率同时增加。

公开(公告)号：US20080176044A1

公开(公告)日：2008-07-24

申请号：US11624883

申请日：2007-01-19

Applicant: Chi-Chuan Lee ,  Chih-Ming Chen

Inventor： Chi-Chuan Lee ,  Chih-Ming Chen

IPC: G01F23/02

CPC classification number: G01F23/02 ,  H01L21/67057 ,  H01L21/67253 ,  Y10T428/24777

Abstract: A window for an acid-base tank suitable for arrangement on a cleaning machine including at least one acid-base tank with an opening on a sidewall of the acid-base tank is described. The window for the acid-base tank at least includes a supporting plate, an annular washer, a transparent observe window and a transparent separation plate. The supporting plate has the same shape as the opening on the sidewall of the cleaning machine, is disposed on the opening, and has a first window opening. The annular washer is disposed on the supporting plate around the first window opening. The transparent observe window is pressed and covered on the annular washer. The transparent separation plate located between the supporting plate and the acid-base tank is disposed on the supporting plate and covers the first window opening. Furthermore, the chemical resistance of the transparent separation plate is better than that of quartz.

Abstract translation: 描述了适用于在包括至少一个在酸碱罐的侧壁上具有开口的酸碱槽的清洁机上布置的酸碱槽的窗口。 酸碱罐的窗口至少包括支撑板，环形垫圈，透明观察窗和透明隔板。 支撑板具有与清洁机侧壁上的开口相同的形状，设置在开口上，并且具有第一窗口。 环形垫圈围绕第一窗口设置在支撑板上。 透明观察窗被按压并覆盖在环形垫圈上。 位于支撑板和酸碱罐之间的透明分隔板设置在支撑板上并覆盖第一窗口。 此外，透明分离板的耐化学性优于石英。

公开(公告)号：USD568371S1

公开(公告)日：2008-05-06

申请号：US29287739

申请日：2007-09-13

Applicant: Chih-Ming Chen

Designer： Chih-Ming Chen

公开(公告)号：US20080099771A1

公开(公告)日：2008-05-01

申请号：US11798655

申请日：2007-05-16

Applicant: Charng-Shyang Jong ,  Ming-Sen Hsu ,  Chin-Fu Ku ,  Chih-Ming Chen ,  Deng-Huei Hwang

Inventor： Charng-Shyang Jong ,  Ming-Sen Hsu ,  Chin-Fu Ku ,  Chih-Ming Chen ,  Deng-Huei Hwang

IPC: H01L21/00 ,  H01L33/00

CPC classification number: H01L33/486 ,  H01L33/005 ,  H01L33/62 ,  H01L33/641 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/13034 ,  H01L2924/19041 ,  H01L2924/00014

Abstract: This invention discloses a light emitting diode, a wafer level package method, a wafer level bonding method, and a circuit structure for a wafer level package. The light emitting diode includes a package carrier, a conducting material, at least one light emitting diode structure and a package material. The package carrier has at least one package unit and two through holes on the package carrier and corresponding to the package unit. The conducting material is disposed in the through holes and formed at the bottom of the package unit. The light emitting diode structure is formed on a substrate. The substrate having a light emitting diode structure is flipped over in the package unit, and the electrodes of the light emitting diode structure are bonded with the conducting material. After the substrate is removed, a package material is stuffed in the package unit or on the light emitting diode structure.

Abstract translation: 本发明公开了一种用于晶片级封装的发光二极管，晶片级封装方法，晶片级结合方法和电路结构。 发光二极管包括封装载体，导电材料，至少一个发光二极管结构和封装材料。 封装载体在封装载体上具有至少一个封装单元和两个通孔，并对应于封装单元。 导电材料设置在通孔中并形成在封装单元的底部。 发光二极管结构形成在基板上。 具有发光二极管结构的基板在封装单元中被翻转，并且发光二极管结构的电极与导电材料接合。 在去除衬底之后，封装材料填充在封装单元中或发光二极管结构上。

公开(公告)号：US20080092342A1

公开(公告)日：2008-04-24

申请号：US11583819

申请日：2006-10-20

Applicant: Chih-Ming Chen

Inventor： Chih-Ming Chen

IPC: A45F5/00

CPC classification number: A42B3/185 ,  A45F2200/0541 ,  Y10T24/13 ,  Y10T24/1394

Abstract: A coupling device of a pair of safety goggles for use in a hat brim of the present invention is designed for coupling a fastening belt of the safety goggles with the hat brim of a hat body. The coupling device has a base having an outward extended arched gap, wherein the base is relatively rotatable so as to allow the hat brim of the hat body to be rotated into the gap of the base. In addition, the base is coupled with a hooking body for further coupling with the fastening belt of the safety goggles. Accordingly, the coupling device of the present invention can be assembled easily and conveniently.

Abstract translation: 用于本发明帽帽中的一对安全护目镜的连接装置被设计用于将安全护目镜的紧固带与帽体的帽缘相连接。 联接装置具有底部，其具有向外延伸的拱形间隙，其中基座相对可旋转，以便允许帽体的帽边缘旋转到底座的间隙中。 此外，基座与钩体联接，用于与安全护目镜的紧固带进一步联接。 因此，本发明的联接装置可以容易且方便地组装。

公开(公告)号：US20080062048A1

公开(公告)日：2008-03-13

申请号：US11518239

申请日：2006-09-11

Applicant: Cho-Kang Hsu ,  Chih-Ming Chen

Inventor： Cho-Kang Hsu ,  Chih-Ming Chen

IPC: H01Q1/24

CPC classification number: H01Q7/00 ,  H01Q1/38 ,  H01Q5/00 ,  H01Q5/371

Abstract: A chip antenna module with two loops is disposed on a ceramic housing for receiving two different frequencies, and an adjustable matching loop is disposed on the housing for shortening the development time of the antenna module by means of adjusting the adjustable matching loop. The chip antenna module comprises a ceramic housing, a first loop, a second loop, and a matching loop. The first loop is disposed on a top surface of the housing for receiving a first frequency, the second loop is disposed on a top surface of the housing for receiving a second frequency, and the matching loop is disposed on a bottom surface of the housing for adjusting a matching impedance. In order to satisfy the system requirements of the matching impedance, a user can simply adjust the path of the matching loop via the special loop design of the matching loop.

Abstract translation: 具有两个环的芯片天线模块设置在陶瓷外壳上，用于接收两个不同的频率，并且可调整的匹配环路设置在外壳上，以通过调节可调整的匹配环来缩短天线模块的显影时间。 芯片天线模块包括陶瓷外壳，第一环，第二环和匹配环。 所述第一环路设置在所述壳体的顶表面上以接收第一频率，所述第二环路设置在所述壳体的顶表面上以接收第二频率，并且所述匹配环路设置在所述壳体的底表面上 调整匹配阻抗。 为了满足匹配阻抗的系统要求，用户可以通过匹配循环的特殊循环设计简单地调整匹配循环的路径。

公开(公告)号：US20080048918A1

公开(公告)日：2008-02-28

申请号：US11509655

申请日：2006-08-25

Applicant: Kang-Neng Hsu ,  Chih-Ming Chen ,  Liang-Neng Lee ,  Kuo-Wei Wu

Inventor： Kang-Neng Hsu ,  Chih-Ming Chen ,  Liang-Neng Lee ,  Kuo-Wei Wu

IPC: H01Q1/24 ,  H01Q1/36

CPC classification number: H01Q1/362 ,  H01Q5/357

Abstract: A column antenna apparatus and a manufacturing method thereof are disclosed. This invention forms a metal layer with at least two spiral structures on a column body. The column antenna apparatus can simplify the manufacturing process and enhance the yield rate. The column antenna apparatus includes a column body, a metal layer and at least two spiral structures. The metal layer is formed on the surface of the column body, and the at least two spiral structures are formed on the metal layer for increasing bandwidth of low frequency. Each spiral structure is formed by removing a part of the metal layer, and the column body is exposed via the at least two spiral structures.

Abstract translation: 公开了列天线装置及其制造方法。 本发明在柱体上形成具有至少两个螺旋结构的金属层。 列天线装置可以简化制造过程并提高产率。 列天线装置包括柱体，金属层和至少两个螺旋结构。 金属层形成在柱体的表面上，并且在金属层上形成至少两个螺旋结构，以增加低频带宽。 通过去除金属层的一部分而形成每个螺旋结构，并且柱体经由至少两个螺旋结构暴露。