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公开(公告)号:US10942321B1
公开(公告)日:2021-03-09
申请号:US16559979
申请日:2019-09-04
Inventor: Sujith Chandran , Marcus Dahlem , Ajey Poovannummoottil Jacob , Yusheng Bian , Bruna Paredes , Jaime Viegas
Abstract: Structures for a wavelength-division multiplexing filter and methods of fabricating a structure for a wavelength-division multiplexing filter. The structure includes a first waveguide core, a second waveguide core laterally spaced from the first waveguide core, and a ring resonator arranged in a vertical direction over the first waveguide core and the second waveguide core. The ring resonator is also arranged in a lateral direction between the first waveguide core and the second waveguide core. The first and second waveguide cores are composed of a semiconductor material, such as single-crystal silicon, and the ring resonator is composed of a dielectric material, such as silicon nitride.
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公开(公告)号:US20250076574A1
公开(公告)日:2025-03-06
申请号:US18242364
申请日:2023-09-05
Applicant: GlobalFoundries U.S. Inc.
Inventor: Md Nabil Shehtab Dhrubo , Andreas D. Stricker , Alexander Derrickson , Subramanian Krishnamurthy , Yusheng Bian , Judson R. Holt
Abstract: Photonics chip structures including a reflector and methods of forming such structures. The photonics chip structure comprises a first waveguide core, a second waveguide core adjacent to the first waveguide core, and a reflector including a plurality of metal contacts over a portion of the first waveguide core. The second waveguide core is configured to couple light to the first waveguide core, and the metal contacts are configured to reflect the light.
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公开(公告)号:US20240402426A1
公开(公告)日:2024-12-05
申请号:US18203321
申请日:2023-05-30
Applicant: GlobalFoundries U.S. Inc.
Inventor: Yusheng Bian , Ryan Sporer , Karen Nummy
Abstract: Structures for a photonics chip that include a reflector and methods of forming such structures. The structure comprises a reflector including a dielectric layer on a semiconductor substrate, a plurality of trenches in the dielectric layer, and a reflector layer. Each trench includes a plurality of sidewalls, and the reflector layer includes a portion on the sidewalls of each trench. The structure further comprises a photonic component over the reflector.
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公开(公告)号:US20240361529A1
公开(公告)日:2024-10-31
申请号:US18139128
申请日:2023-04-25
Applicant: GlobalFoundries U.S. Inc.
Inventor: Keith Donegan , Thomas Houghton , Yusheng Bian , Karen Nummy , Kevin Dezfulian , Takako Hirokawa
CPC classification number: G02B6/305 , G02B6/42 , G02B6/4206
Abstract: Structures including a cavity adjacent to an edge coupler and methods of forming such structures. The structure comprises a semiconductor substrate including a cavity with a sidewall, a dielectric layer on the semiconductor substrate, and an edge coupler on the dielectric layer. The structure further comprises a fill region including a plurality of fill features adjacent to the edge coupler. The fill region includes a reference marker at least partially surrounded by the plurality of fill features, and the reference marker has a perimeter that surrounds a surface area of the dielectric layer, and the surface area overlaps with a portion of the sidewall of the cavity.
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115.
公开(公告)号:US20240347652A1
公开(公告)日:2024-10-17
申请号:US18134100
申请日:2023-04-13
Applicant: GlobalFoundries U.S. Inc.
Inventor: Zhuojie Wu , Yusheng Bian , Judson R. Holt
IPC: H01L31/0232 , H01L31/0224 , H01L31/18
CPC classification number: H01L31/02327 , H01L31/022408 , H01L31/1808
Abstract: Structures including a photodetector and methods of forming a structure including a photodetector. The structure comprises a semiconductor layer comprising a crystalline semiconductor material, a waveguide core including a first sidewall and a second sidewall, and a photodetector including a light-absorbing layer, an anode, and a cathode. The light-absorbing layer includes a first portion and a second portion that are disposed on the semiconductor layer. The first portion of the light-absorbing layer is adjacent to the first sidewall of the waveguide core, and the second portion of the light-absorbing layer is adjacent to the second sidewall of the waveguide core.
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公开(公告)号:US12111495B2
公开(公告)日:2024-10-08
申请号:US17828139
申请日:2022-05-31
Applicant: GlobalFoundries U.S. Inc.
Inventor: Yusheng Bian
CPC classification number: G02B6/1228 , G02B6/12004 , G02B6/305 , G02B2006/12097 , G02B2006/12111 , G02B2006/12121 , G02B2006/12147
Abstract: Structures for an edge coupler and methods of fabricating a structure for an edge coupler. The structure comprises an edge coupler including a first waveguide core and a second waveguide core adjacent to the first waveguide core in a lateral direction. The first waveguide core includes a first section with a first thickness and a first plurality of segments projecting in a vertical direction from the first section. The second waveguide core includes a second section with a second thickness and a second plurality of segments projecting in the vertical direction from the second section.
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公开(公告)号:US20240329299A1
公开(公告)日:2024-10-03
申请号:US18126745
申请日:2023-03-27
Applicant: GlobalFoundries U.S. Inc.
Inventor: Yusheng Bian
CPC classification number: G02B6/12004 , G02B6/1228 , G02B6/125 , G02B2006/12104 , G02B2006/12121
Abstract: Structures for an edge coupler and methods of forming such structures. The structure comprises a semiconductor substrate, a first waveguide core including a curved section and an end that terminates the curved section, and a second waveguide core including a section disposed adjacent to the curved section of the first waveguide core. The first waveguide core is positioned between the second waveguide core and the semiconductor substrate.
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118.
公开(公告)号:US20240210621A1
公开(公告)日:2024-06-27
申请号:US18597173
申请日:2024-03-06
Applicant: GlobalFoundries U.S. Inc.
Inventor: Brett T. Cucci , Yusheng Bian , Abdelsalam Aboketaf , Edward W. Kiewra
CPC classification number: G02B6/1228 , G02B6/1223 , G02B6/125 , G02B6/132 , G02B2006/12061 , G02B2006/12147 , G02B6/1225
Abstract: Disclosed are embodiments of a photonic integrated circuit (PIC) structure with a waveguide core having tapered sidewall liner(s) (e.g., symmetric tapered sidewall liners on opposing sides of a waveguide core, asymmetric tapered sidewall liners on opposing sides of a waveguide core, or a tapered sidewall liner on one side of a waveguide core). In some embodiments, the tapered sidewall liner(s) and waveguide core have different refractive indices. In an exemplary embodiment, the waveguide core is a first material (e.g., silicon) and the tapered sidewall liner(s) is/are a second material (e.g., silicon nitride) with a smaller refractive index than the first material. In another exemplary embodiment, the waveguide core is a first compound and the tapered sidewall liner(s) is/are a second compound with the same elements (e.g., silicon and nitrogen) as the first compound but with a smaller refractive index. Also disclosed are method embodiments for forming such a PIC structure.
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公开(公告)号:US20240201438A1
公开(公告)日:2024-06-20
申请号:US18084921
申请日:2022-12-20
Applicant: GlobalFoundries U.S. Inc.
Inventor: Yusheng Bian
IPC: G02B6/122 , G02B6/13 , H01L31/0232 , H01L31/028 , H01L31/105 , H01L31/18
CPC classification number: G02B6/1228 , G02B6/13 , H01L31/02327 , H01L31/028 , H01L31/105 , H01L31/1808
Abstract: Structures including a photodetector and methods of forming a structure including a photodetector. The structure comprises a photodetector including a pad having a side edge and a light-absorbing layer disposed on the pad. The structure further comprises a waveguide core including a tapered section positioned adjacent to the side edge of the pad and the light-absorbing layer. The tapered section has a width dimension that decreases with decreasing distance from the side edge of the pad.
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公开(公告)号:US20240176067A1
公开(公告)日:2024-05-30
申请号:US18058967
申请日:2022-11-28
Applicant: GlobalFoundries U.S. Inc.
Inventor: Shesh Mani Pandey , Yusheng Bian , Ravi Prakash Srivastava
CPC classification number: G02B6/12004 , G02B6/1228 , G02B6/136 , H01L25/167
Abstract: Structures and methods implement an enlarged multilayer nitride waveguide. The structure may include an inter-level dielectric (ILD) layer over a substrate. A first enlarged multilayer nitride waveguide is positioned in the ILD layer in a region of the substrate. A second multilayer nitride waveguide may also be provided in the ILD layer. A lower cladding layer defines a lower surface of the nitride waveguide(s). The lower cladding layer has a lower refractive index than the nitride waveguide(s). Additional lower refractive index cladding layers can be provided on the upper surface and/or sidewalls of the nitride waveguide(s). The enlarged nitride waveguide may be implemented with other conventional silicon and nitride waveguides.
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