公开(公告)号：US07458879B2

公开(公告)日：2008-12-02

申请号：US11499784

申请日：2006-08-07

申请人： Tetsuji Togawa

发明人： Tetsuji Togawa

IPC分类号： B24B49/00 ,  B24B51/00

CPC分类号： B24B37/30 ,  B24B47/06 ,  B24B49/16 ,  B24B53/017

摘要： A polishing apparatus for polishing a substrate comprises a polishing table having a polishing surface, and a substrate holding apparatus for holding a substrate to be polished and pressing the substrate against the polishing surface. The substrate holding apparatus comprises a vertically movable top ring body for holding a substrate, and a fluid supply source for supplying a fluid under a positive pressure or a negative pressure to a hermetically sealed chamber which is defined in the top ring body so as to control pressure under which the substrate is pressed against the polishing surface. The substrate holding apparatus further comprises a measuring device disposed in a fluid passage interconnecting the hermetically sealed chamber and the fluid supply source for measuring a flow rate of the fluid in the fluid passage.

摘要翻译： 用于抛光基板的抛光装置包括具有抛光表面的抛光台和用于保持要抛光的基板并将基板压靠在抛光表面上的基板保持装置。 基板保持装置包括用于保持基板的可垂直移动的顶环体和用于将正压或负压下的流体供应到限定在顶环体中的气密密封室的流体供给源，以便控制 将基板压在抛光表面上的压力。 基板保持装置还包括设置在将气密密封室和流体供应源互连的流体通道中的测量装置，用于测量流体通道中流体的流量。

公开(公告)号：US07419420B2

公开(公告)日：2008-09-02

申请号：US10539245

申请日：2003-12-26

申请人： Tetsuji Togawa ,  Toshio Watanabe ,  Hiroyuki Yano ,  Gen Toyota ,  Kenji Iwade ,  Yoshikuni Tateyama

发明人： Tetsuji Togawa ,  Toshio Watanabe ,  Hiroyuki Yano ,  Gen Toyota ,  Kenji Iwade ,  Yoshikuni Tateyama

IPC分类号： B24B49/00 ,  B24B5/00

CPC分类号： B24B37/015 ,  B24B41/061 ,  B24B55/02

摘要： A substrate holding mechanism, a substrate polishing apparatus and a substrate polishing method have functions capable of minimizing an amount of heat generated during polishing of a substrate to be polished and of effectively cooling a substrate holding part of the substrate holding mechanism, and also capable of effectively preventing a polishing solution and polishing dust from adhering to an outer peripheral portion of the substrate holding part and drying thereon. The substrate holding mechanism has a mounting flange, a support member 6 and a retainer ring. A substrate to be polished is held on a lower side of the support member surrounded by the retainer ring, and the substrate is pressed against a polishing surface of a polishing table. The mounting flange is provided with a flow passage contiguous with at least the retainer ring. A temperature-controlled gas is supplied through the flow passage to cool the mounting flange, the support member and the retainer ring. The retainer ring is provided with a plurality of through-holes communicating with the flow passage to spray the gas flowing through the flow passage onto the polishing surface of the polishing table.

摘要翻译： 基板保持机构，基板研磨装置和基板研磨方法具有能够使待研磨基板的抛光时产生的热量最小化的功能，并有效地冷却基板保持机构的基板保持部，并且还能够 有效地防止研磨液和抛光尘埃附着在基板保持部的外周部并干燥。 基板保持机构具有安装凸缘，支撑构件6和保持环。 待研磨的基板被保持在由保持环包围的支撑构件的下侧，并且基板被压靠在抛光台的抛光表面上。 安装凸缘设置有至少与保持环相邻的流动通道。 通过流路供给温度控制气体以冷却安装凸缘，支撑构件和保持环。 保持环设置有与流路连通的多个通孔，以将流过流道的气体喷射到抛光台的抛光表面上。

公开(公告)号：US20080139087A1

公开(公告)日：2008-06-12

申请号：US10559135

申请日：2004-06-17

申请人： Tetsuji Togawa ,  Koichi Fukaya ,  Mitsuo Tada ,  Taro Takahashi ,  Yasunari Suto

发明人： Tetsuji Togawa ,  Koichi Fukaya ,  Mitsuo Tada ,  Taro Takahashi ,  Yasunari Suto

IPC分类号： B24B49/04 ,  B24B29/02

CPC分类号： B24B37/013 ,  B24B49/105 ,  B24B49/12 ,  B24B49/16

摘要： The present invention relates to a substrate polishing apparatus and a substrate polishing method for polishing a substrate such as a semiconductor wafer to a flat finish. The substrate polishing apparatus includes a polishing table (100) having a polishing surface (101), a substrate holder (1) for holding and pressing a substrate (W) against the polishing surface (101) of the polishing table (100), and a film thickness measuring device (200) for measuring a thickness of a film on the substrate (W). The substrate holder (1) has a plurality of pressure adjustable chambers (22 to 25), and pressures in the respective chambers (22 to 25) are adjusted based on the film thickness measured by the film thickness measuring device (200).

摘要翻译： 本发明涉及一种用于将诸如半导体晶片的基板抛光到平整的基板抛光装置和基板抛光方法。 基板研磨装置具备：具有抛光面（101）的研磨台（100），将基板（W）保持并压靠在研磨台（100）的研磨面（101）上的基板保持架（1），以及 用于测量衬底（W）上的膜的厚度的膜厚测量装置（200）。 衬底保持器（1）具有多个压力可调节室（22〜25），并且基于由膜厚测量装置（200）测量的膜厚调节各个室（22至25）中的压力。

公开(公告)号：US07311585B2

公开(公告)日：2007-12-25

申请号：US11312571

申请日：2005-12-21

申请人： Tetsuji Togawa ,  Osamu Nabeya ,  Makoto Fukushima ,  Kunihiko Sakurai ,  Hiroshi Yoshida ,  Teruhiko Ichimura

发明人： Tetsuji Togawa ,  Osamu Nabeya ,  Makoto Fukushima ,  Kunihiko Sakurai ,  Hiroshi Yoshida ,  Teruhiko Ichimura

IPC分类号： B24B1/00

CPC分类号： B24B37/30 ,  B24B41/061 ,  B24B49/105

摘要： The present invention relates to a substrate holding apparatus for holding a substrate such as a semiconductor wafer in a polishing apparatus for polishing the substrate to a flat finish. The substrate holding apparatus according to the present invention comprises a top ring body having a receiving space therein, and a vertically movable member which is vertically movable within the receiving space in the top ring body. An abutment member having an elastic membrane is attached to a lower surface of the vertically movable member. The elastic membrane of the abutment member comprises an abutment portion, having a flange projecting outwardly, brought into direct or indirect contact with the substrate, and a connecting portion extending upwardly from a base portion of the flange of the abutment portion and being connected to the vertically movable member. The connecting portion is made of a material having a flexibility higher than that of material of the abutment portion.

摘要翻译： 本发明涉及一种用于将基板（例如半导体晶片）保持在用于将基板抛光到抛光装置的平面光洁度的基板保持装置。 根据本发明的基板保持装置包括其中具有容纳空间的顶环主体和可在顶环体中的容纳空间内垂直移动的可垂直移动的构件。 具有弹性膜的邻接构件附接到可垂直移动构件的下表面。 邻接构件的弹性膜包括邻接部分，其具有向外突出的凸缘，与基底直接或间接接触;以及连接部分，其从邻接部分的凸缘的基部向上延伸并连接到 垂直活动件。 连接部由具有高于邻接部的材料的柔软性的材料制成。

公开(公告)号：US20070293129A1

公开(公告)日：2007-12-20

申请号：US11791218

申请日：2005-12-06

申请人： Tetsuji Togawa ,  Hiroshi Yoshida ,  Osamu Nabeya ,  Makoto Fukushima ,  Koichi Fukaya

发明人： Tetsuji Togawa ,  Hiroshi Yoshida ,  Osamu Nabeya ,  Makoto Fukushima ,  Koichi Fukaya

IPC分类号： B24B37/00 ,  H01L21/304

CPC分类号： B24B37/30

摘要： A substrate holding device according to the present invention includes an elastic membrane to be brought into contact with a rear surface of a substrate, an attachment member for securing at least a portion of the elastic membrane, and a retainer ring for holding a peripheral portion of the substrate while in contact with the elastic membrane. The elastic membrane comprises at least one projecting portion, and the attachment member comprises at least one engagement portion engaging side surfaces of the at least one projecting portion of the elastic membrane. The elastic membrane further comprises bellows portions expandable in a pressing direction so as to allow the elastic membrane to press the substrate, and contractible along the pressing direction.

摘要翻译： 根据本发明的基板保持装置包括与基板的后表面接触的弹性膜，用于固定弹性膜的至少一部分的安装构件和用于保持弹性膜的周边部分的保持环 该基底与弹性膜接触。 弹性膜包括至少一个突出部分，并且附接构件包括接合弹性膜的至少一个突出部分的侧表面的至少一个接合部分。 弹性膜还包括沿挤压方向可膨胀的波纹管部，以使弹性膜按压基板，并沿着挤压方向收缩。

公开(公告)号：US20070111637A1

公开(公告)日：2007-05-17

申请号：US10555702

申请日：2004-02-25

申请人： Tetsuji Togawa ,  Osamu Nabeya

发明人： Tetsuji Togawa ,  Osamu Nabeya

IPC分类号： B24B49/00

CPC分类号： H01L21/6838 ,  B24B37/30 ,  B24B49/16 ,  H01L21/67092

摘要： A substrate holding apparatus holds a substrate such as a semiconductor and presses the substrate against a polishing surface. The substrate holding apparatus includes a top ring body (2) for holding the substrate, a plurality of fluid passages (33, 34, 35, 36) for supplying a fluid to a plurality of pressure chambers (22, 23, 24, 25) defined in the top ring body, and a plurality of sensors (S1, S2, S3, S4) disposed in the fluid passages, respectively, for detecting flowing states of the fluid which flows through the fluid passages.

摘要翻译： 基板保持装置保持诸如半导体的基板，并将基板压靠在抛光表面上。 基板保持装置包括用于保持基板的顶环体（2），用于向多个压力室（22,23,24,25）供给流体的多个流体通道（33,34,35,36） 以及设置在流体通道中的多个传感器（S 1，S 2，S 3，S 4），用于检测流过流体通道的流体的流动状态。

公开(公告)号：US20050260925A1

公开(公告)日：2005-11-24

申请号：US11191962

申请日：2005-07-29

申请人： Tetsuji Togawa

发明人： Tetsuji Togawa

IPC分类号： B24B53/00 ,  B24B37/005 ,  B24B37/30 ,  B24B49/16 ,  B24B53/017 ,  B24B53/02 ,  H01L21/304 ,  B24B49/00 ,  B24B1/00 ,  B24B51/00

CPC分类号： B24B37/30 ,  B24B47/06 ,  B24B49/16 ,  B24B53/017

摘要： A polishing apparatus for polishing a substrate comprises a polishing table having a polishing surface, and a substrate holding apparatus for holding a substrate to be polished and pressing the substrate against the polishing surface. The substrate holding apparatus comprises a vertically movable top ring body for holding a substrate, and a fluid supply source for supplying a fluid under a positive pressure or a negative pressure to a hermetically sealed chamber which is defined in the top ring body so as to control pressure under which the substrate is pressed against the polishing surface. The substrate holding apparatus further comprises a measuring device disposed in a fluid passage interconnecting the hermetically sealed chamber and the fluid supply source for measuring a flow rate of the fluid in the fluid passage.

摘要翻译： 用于抛光基板的抛光装置包括具有抛光表面的抛光台和用于保持要抛光的基板并将基板压靠在抛光表面上的基板保持装置。 基板保持装置包括用于保持基板的可垂直移动的顶环体和用于将正压或负压下的流体供应到限定在顶环体中的气密密封室的流体供给源，以便控制 将基板压在抛光表面上的压力。 基板保持装置还包括设置在将气密密封室和流体供应源互连的流体通道中的测量装置，用于测量流体通道中流体的流量。

公开(公告)号：US06942541B2

公开(公告)日：2005-09-13

申请号：US09922776

申请日：2001-08-07

申请人： Tetsuji Togawa ,  Kunihiko Sakurai ,  Ritsuo Kikuta

发明人： Tetsuji Togawa ,  Kunihiko Sakurai ,  Ritsuo Kikuta

IPC分类号： H01L21/304 ,  B24B37/04 ,  B24B51/00 ,  B24B53/007 ,  B24B7/22

CPC分类号： B24B37/345 ,  B24B37/04 ,  B24B51/00 ,  B24B53/017

摘要： A polishing apparatus polishes a workpiece such as a semiconductor wafer to a flat mirror finish. The polishing apparatus includes a storage cassette for storing workpieces to be polished, at least two polishing units each having at least a turntable with a polishing cloth mounted thereon and a top ring for supporting a workpiece and pressing the workpiece against the polishing cloth, and a cleaning unit for cleaning a workpiece which has been polished by either one of the polishing units in such a state that the workpiece is removed from the top ring. The polishing apparatus further includes a transfer robot for transferring a workpiece between two of the storage cassette, the polishing units and the cleaning unit.

摘要翻译： 抛光装置将诸如半导体晶片的工件抛光成平面镜面。 抛光装置包括用于存储要被抛光的工件的存储盒，至少两个抛光单元，每个抛光单元至少具有安装在其上的抛光布的转台和用于支撑工件并将工件压靠抛光布的顶环，以及 清洁单元，用于在工件从顶环移除的状态下清洁由任一个抛光单元抛光的工件。 抛光装置还包括用于在两个存储盒，抛光单元和清洁单元之间传送工件的传送机器人。

公开(公告)号：US20050130562A1

公开(公告)日：2005-06-16

申请号：US10504873

申请日：2003-02-27

申请人： Osamu Nabeya ,  Tetsuji Togawa

发明人： Osamu Nabeya ,  Tetsuji Togawa

IPC分类号： B24B37/04 ,  B24B49/12 ,  G06T1/00 ,  G06T7/00 ,  H01L21/304 ,  B24B49/00 ,  B24B51/00

CPC分类号： B24B37/005 ,  B24B49/12

摘要： A polishing apparatus 110 which comprises a polishing tool 1 having a polishing surface, and a holder means (top ring 4) for holding a semiconductor wafer (a substrate) W. Polishing apparatus 110 further comprises color CCD camera 10 for taking a color image of a region on the polishing surface; image processor means 40 for determining whether or not any foreign matter exists on the polishing surface based on a condition of a color in the color image data acquired by color CCD camera 10, and apparatus operation control section 45 which in response to the determination of image processing section 40, stops the relative movement between semiconductor wafer W and the polishing surface and separates top ring 4 and the polishing surface from each other.

摘要翻译： 抛光装置110，其包括具有抛光表面的抛光工具1和用于保持半导体晶片（基板）W的保持器装置（顶环4）。抛光装置110还包括彩色CCD照相机10，用于拍摄彩色图像 抛光表面上的区域; 图像处理装置40，用于基于由彩色CCD照相机10获取的彩色图像数据中的颜色的条件以及响应于图像的确定的装置操作控制部分45确定抛光表面上是否存在任何异物 处理部分40停止半导体晶片W与抛光表面之间的相对运动，并将顶环4和抛光表面彼此分开。

公开(公告)号：US20050081890A1

公开(公告)日：2005-04-21

申请号：US10503054

申请日：2003-03-05

申请人： Koji Ato ,  Tetsuji Togawa

发明人： Koji Ato ,  Tetsuji Togawa

IPC分类号： B65D85/86 ,  F26B5/04 ,  F26B5/08 ,  F26B25/06 ,  H01L21/00 ,  H01L21/304 ,  H01L21/306 ,  H01L21/3105 ,  H01L21/316 ,  B08B5/04

CPC分类号： H01L21/67034 ,  F26B5/04 ,  F26B25/063 ,  H01L21/02052 ,  H01L21/3105 ,  H01L21/31695

摘要： A dehydration drying method dehydrates and dries a substrate. The substrate (15) is dehydrated and dried without being rotated while the substrate (15) is accommodated in a carrier (10) operable to carry the substrate (15) between apparatuses for carrying out certain processes.

摘要翻译： 脱水干燥方法使基材脱水并干燥。 基板（15）被脱水和干燥而不旋转，同时基板（15）容纳在可操作以将基板（15）承载在用于执行某些处理的装置之间的载体（10）中。