公开(公告)号：US07850817B2

公开(公告)日：2010-12-14

申请号：US10481001

申请日：2003-04-09

申请人： Satoshi Wakabayashi ,  Tetsuji Togawa ,  Ryuichi Kosuge ,  Koji Ato ,  Hiroshi Sotozaki

发明人： Satoshi Wakabayashi ,  Tetsuji Togawa ,  Ryuichi Kosuge ,  Koji Ato ,  Hiroshi Sotozaki

IPC分类号： C23F1/00

CPC分类号： B24B37/345 ,  H01L21/67219 ,  H01L21/67745 ,  H01L21/67751 ,  H01L21/67766 ,  H01L21/68707

摘要： A polishing apparatus has a plurality of polishing units. Moving mechanisms for moving top rings between polishing positions on polishing surfaces and wafer receiving/delivering positions are provided in each of the polishing units. Linear transporters are provided for transferring a wafer between a plurality of transferring positions including the wafer receiving/delivering positions. Pushers for receiving and delivering the wafer between the linear transporters and the top rings are provided at the transferring positions as the wafer receiving/delivering positions.

摘要翻译： 抛光装置具有多个抛光单元。 在每个抛光单元中设置有用于在抛光表面上的抛光位置和晶片接收/传送位置之间移动顶环的移动机构。 提供线性转运器用于在包括晶片接收/传送位置的多个传送位置之间传送晶片。 用于在线性运送器和顶环之间接收和输送晶片的推动器设置在作为晶片接收/传送位置的转移位置处。

公开(公告)号：US20050081890A1

公开(公告)日：2005-04-21

申请号：US10503054

申请日：2003-03-05

申请人： Koji Ato ,  Tetsuji Togawa

发明人： Koji Ato ,  Tetsuji Togawa

IPC分类号： B65D85/86 ,  F26B5/04 ,  F26B5/08 ,  F26B25/06 ,  H01L21/00 ,  H01L21/304 ,  H01L21/306 ,  H01L21/3105 ,  H01L21/316 ,  B08B5/04

CPC分类号： H01L21/67034 ,  F26B5/04 ,  F26B25/063 ,  H01L21/02052 ,  H01L21/3105 ,  H01L21/31695

摘要： A dehydration drying method dehydrates and dries a substrate. The substrate (15) is dehydrated and dried without being rotated while the substrate (15) is accommodated in a carrier (10) operable to carry the substrate (15) between apparatuses for carrying out certain processes.

摘要翻译： 脱水干燥方法使基材脱水并干燥。 基板（15）被脱水和干燥而不旋转，同时基板（15）容纳在可操作以将基板（15）承载在用于执行某些处理的装置之间的载体（10）中。

公开(公告)号：US09457447B2

公开(公告)日：2016-10-04

申请号：US13073218

申请日：2011-03-28

申请人： Masaya Seki ,  Tetsuji Togawa ,  Masayuki Nakanishi

发明人： Masaya Seki ,  Tetsuji Togawa ,  Masayuki Nakanishi

IPC分类号： B24B1/00 ,  B24B21/00 ,  B24B9/06 ,  B24B21/20 ,  H01L21/306 ,  H01L21/67 ,  H01L21/68 ,  H01L21/84 ,  H01L21/66

CPC分类号： B24B21/002 ,  B24B9/065 ,  B24B21/20 ,  H01L21/30625 ,  H01L21/67092 ,  H01L21/67259 ,  H01L21/68 ,  H01L21/84 ,  H01L22/20

摘要： The polishing apparatus has a polishing unit capable of forming a right-angled cross section by polishing a peripheral portion of the substrate. The polishing unit includes a polishing head having a pressing member configured to press a polishing tape against the peripheral portion of the substrate from above, a tape supply and recovery mechanism configured to supply the polishing tape to the polishing head and to recover the polishing tape from the polishing head, a first moving mechanism configured to move the polishing head in a radial direction of the substrate, and a second moving mechanism configured to move the tape supply and recovery mechanism in the radial direction of the substrate. The guide rollers are arranged such that the polishing tape extends parallel to a tangential direction of the substrate and a polishing surface of the polishing tape is parallel to a surface of the substrate.

摘要翻译： 抛光装置具有能够通过抛光基板的周边部分而形成直角横截面的抛光单元。 抛光单元包括：抛光头，其具有被配置成从上方将研磨带压靠在基板的周边部分上的按压构件，配置成将抛光带供给到抛光头并将抛光带从 抛光头，构造成沿着基板的径向方向移动抛光头的第一移动机构和被配置为沿着基板的径向移动带供给和恢复机构的第二移动机构。 引导辊布置成使得抛光带平行于基板的切线方向延伸，并且抛光带的抛光表面平行于基板的表面。

公开(公告)号：US08979615B2

公开(公告)日：2015-03-17

申请号：US13308857

申请日：2011-12-01

申请人： Masaya Seki ,  Tetsuji Togawa ,  Masayuki Nakanishi ,  Naoki Matsuda ,  Atsushi Yoshida

发明人： Masaya Seki ,  Tetsuji Togawa ,  Masayuki Nakanishi ,  Naoki Matsuda ,  Atsushi Yoshida

IPC分类号： B24B21/04 ,  B24B9/06 ,  B24B21/00

CPC分类号： B24B21/002 ,  B24B9/065 ,  B24B21/004 ,  B24B21/006 ,  B24B21/008 ,  B24B21/20

摘要： The polishing apparatus has a polishing unit capable of polishing a peripheral portion of the substrate to form a right-angled cross section. The polishing apparatus includes: a substrate holder that holds and rotates the substrate; guide rollers that support a polishing tape; and a polishing head having a pressing member that presses an edge of the polishing tape against the peripheral portion of the substrate from above. The guide rollers are arranged such that the polishing tape extends parallel to a tangential direction of the substrate and a polishing surface of the polishing tape is parallel to a surface of the substrate. The substrate holder includes: a holding stage that holds the substrate; and a supporting stage that supports a lower surface of the peripheral portion of the substrate in its entirety. The supporting stage rotates in unison with the holding stage.

摘要翻译： 抛光装置具有能够抛光基板的周边部分以形成直角横截面的抛光单元。 抛光装置包括：保持和旋转衬底的衬底保持器; 支撑抛光带的导辊; 以及抛光头，其具有从上方将研磨带的边缘压靠在基板的周边部分的按压部件。 引导辊布置成使得抛光带平行于基板的切线方向延伸，并且抛光带的抛光表面平行于基板的表面。 基板保持器包括：保持基板的保持台; 以及支撑台，其整体地支撑基板的周边部分的下表面。 支撑台与保持台一致地旋转。

公开(公告)号：US20110207294A1

公开(公告)日：2011-08-25

申请号：US13027551

申请日：2011-02-15

申请人： Masayuki NAKANISHI ,  Tetsuji Togawa ,  Kenya Ito ,  Masaya Seki ,  Kenji Iwade ,  Takeo Kubota

发明人： Masayuki NAKANISHI ,  Tetsuji Togawa ,  Kenya Ito ,  Masaya Seki ,  Kenji Iwade ,  Takeo Kubota

IPC分类号： H01L21/762

CPC分类号： H01L21/02038 ,  B24B9/065 ,  B24B21/002 ,  B24B37/042 ,  H01L21/02087 ,  H01L21/304 ,  H01L21/76256

摘要： A method for manufacturing a semiconductor device makes it possible to efficiently polish with a polishing tape a peripheral portion of a silicon substrate under polishing conditions particularly suited for a deposited film and for silicon underlying the deposited film. The method includes: pressing a first polishing tape against a peripheral portion of a device substrate having a deposited film on a silicon surface while rotating the device substrate at a first rotational speed, thereby removing the deposited film lying in the peripheral portion of the device substrate and exposing the underlying silicon; and pressing a second polishing tape against the exposed silicon lying in the peripheral portion of the device substrate while rotating the device substrate at a second rotational speed, thereby polishing the silicon to a predetermined depth.

摘要翻译： 一种制造半导体器件的方法使得可以在抛光条件下，在特别适用于沉积膜的抛光条件和沉积膜下面的硅的抛光条件下，用研磨带有效地抛光硅衬底的周边部分。 该方法包括：在第一旋转速度旋转器件基板的同时，将第一研磨带压在具有沉积膜的器件基板的周边部分上，同时以第一转速旋转器件基板，从而去除位于器件基板周边部分的沉积膜 并暴露下面的硅; 并且在第二旋转速度旋转所述装置基板的同时将第二研磨带压靠在所述装置基板的周边部分中的暴露的硅上，从而将所述硅抛光至预定的深度。

公开(公告)号：US07708618B2

公开(公告)日：2010-05-04

申请号：US11980667

申请日：2007-10-31

申请人： Hiromi Yajima ,  Yukio Imoto ,  Shoichi Kodama ,  Riichiro Aoki ,  Takashi Omichi ,  Toyomi Nishi ,  Tetsuji Togawa

发明人： Hiromi Yajima ,  Yukio Imoto ,  Shoichi Kodama ,  Riichiro Aoki ,  Takashi Omichi ,  Toyomi Nishi ,  Tetsuji Togawa

IPC分类号： B24B51/00

CPC分类号： H01L21/67161 ,  B08B1/04 ,  B24B27/0023 ,  B24B37/04 ,  B24B37/345 ,  B24B51/00 ,  B24B55/12 ,  F24F3/161 ,  H01L21/67028 ,  H01L21/67046 ,  H01L21/67057 ,  H01L21/67167 ,  H01L21/67219 ,  H01L21/67745 ,  H01L21/67778 ,  H03M13/39 ,  H04N5/4401 ,  H04N5/455

摘要： A polishing apparatus includes an arrangement of a plurality of units to deal with various operations and a robot having at least one arm. The plurality of units are disposed around the robot and include a loading unit for receiving thereon a, e.g. dry, workpiece to be polished, a polishing system including at least one polishing unit for polishing the workpiece, a washing system and a drying system at least including one washing unit for washing and drying the polished workpiece, and an unloading unit for receiving thereon a resultant clean and dry polished workpiece.

摘要翻译： 抛光装置包括用于处理各种操作的多个单元的布置以及具有至少一个臂的机器人。 所述多个单元设置在所述机器人周围，并且包括用于在其上接收的加载单元。 干燥的待抛光工件，包括至少一个用于抛光工件的抛光单元的抛光系统，至少包括一个用于洗涤和干燥抛光的工件的洗涤单元的洗涤系统和干燥系统，以及用于在其上接收的卸载单元 得到清洁和干燥的抛光工件。

公开(公告)号：US20090137190A1

公开(公告)日：2009-05-28

申请号：US12292685

申请日：2008-11-24

申请人： Tetsuji Togawa ,  Keisuke Namiki ,  Satoru Yamaki

发明人： Tetsuji Togawa ,  Keisuke Namiki ,  Satoru Yamaki

IPC分类号： B24B49/00 ,  B24B49/10 ,  B24B53/02 ,  B24B7/20

CPC分类号： B24B53/017 ,  B24B37/013 ,  B24B49/10 ,  B24B49/16

摘要： The present invention provides a dressing method of dressing a polishing pad used in a polishing apparatus for polishing a substrate. This method includes repetitively moving the dresser on an upper surface of the polishing pad in a radial direction of the polishing pad so as to perform a dressing process on the polishing pad, during the dressing process, measuring a height of an upper surface of the polishing pad at a predetermined point in one of plural zones on the polishing surface, and repeating the repetitive moving of the dresser and the measuring of the height of the upper surface of the polishing pad so as to measure the height of the upper surface of the polishing pad in all of the plural zones.

摘要翻译： 本发明提供了一种修整抛光装置中用于抛光基板的抛光垫的修整方法。 该方法包括在抛光垫的径向上重复地将修整器沿抛光垫的径向重复地移动到抛光垫的上表面上，以便在修整过程中对抛光垫进行修整处理，测量抛光上表面的高度 在抛光表面上的多个区域中的一个区域中的预定点处的垫，并且重复修整器的重复移动和测量抛光垫的上表面的高度，以便测量抛光上表面的高度 在所有多个区域中的垫。

公开(公告)号：US20080318499A1

公开(公告)日：2008-12-25

申请号：US12222909

申请日：2008-08-19

申请人： Hozumi Yasuda ,  Tetsuji Togawa ,  Osamu Nabeya ,  Kenichiro Saito ,  Makoto Fukushima ,  Tomoshi Inoue

发明人： Hozumi Yasuda ,  Tetsuji Togawa ,  Osamu Nabeya ,  Kenichiro Saito ,  Makoto Fukushima ,  Tomoshi Inoue

IPC分类号： B24B1/00

CPC分类号： B24B37/32

摘要： A substrate holding apparatus prevents a substrate from slipping out and allows the substrate to be polished stably. The substrate holding apparatus has a top ring body for holding and pressing a substrate against a polishing surface, and a retainer ring for pressing the polishing surface, the retainer ring being disposed on an outer circumferential portion of the top ring body. The retainer ring includes a first member made of a magnetic material and a second member having a magnet disposed on a surface thereof which is held in abutment against the first member.

摘要翻译： 基板保持装置防止基板滑出并允许基板被稳定地抛光。 基板保持装置具有用于将基板保持并压靠在研磨面上的顶环体，以及用于按压研磨面的保持环，保持环设置在顶环体的外周部。 保持环包括由磁性材料制成的第一构件和具有设置在其表面上的磁体的第二构件，该磁体保持抵靠第一构件。

公开(公告)号：US07448940B2

公开(公告)日：2008-11-11

申请号：US11785533

申请日：2007-04-18

申请人： Tetsuji Togawa

发明人： Tetsuji Togawa

IPC分类号： B24B49/00 ,  B24B51/00 ,  B24B1/00

CPC分类号： B24B37/30 ,  H01L21/3212

摘要： A polishing apparatus comprises a first polishing table having a first polishing surface, a substrate carrier for holding a substrate and positioning the substrate so as to bring a surface of the substrate into contact with the first polishing surface, a pressing mechanism for pressing, against the first polishing surface, the surface of the substrate which has been brought into contact with the first polishing surface by the substrate carrier, a retainer ring mounted on the substrate carrier so as to surround the substrate which has been pressed against the first polishing surface by the pressing mechanism, and a retainer-ring-position-adjustment mechanism for adjustably positioning the retainer ring relative to the substrate, which has been pressed against the first polishing surface, in directions toward and away from the first polishing surface.

摘要翻译： 抛光装置包括具有第一抛光表面的第一抛光台，用于保持基板的基板载体，并且定位基板以使基板的表面与第一抛光表面接触;按压机构， 第一抛光表面，已经通过基板载体与第一抛光表面接触的基板的表面，安装在基板载体上的保持环，以便围绕已经被第一抛光表面压靠在基板上的基板 按压机构，以及保持环位置调节机构，用于相对于已经被压靠在第一抛光表面上的保持环可调节地定位在朝向和远离第一抛光表面的方向上。

公开(公告)号：US07223690B2

公开(公告)日：2007-05-29

申请号：US10976040

申请日：2004-10-29

申请人： Fumio Kondo ,  Koji Mishima ,  Akira Tanaka ,  Yoko Suzuki ,  Tetsuji Togawa ,  Hiroaki Inoue

发明人： Fumio Kondo ,  Koji Mishima ,  Akira Tanaka ,  Yoko Suzuki ,  Tetsuji Togawa ,  Hiroaki Inoue

IPC分类号： H01L21/4763 ,  H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC分类号： H01L21/67161 ,  B24B37/005 ,  B24B37/042 ,  B24B37/245 ,  B24B37/345 ,  B24B41/061 ,  B24B49/16 ,  C23C18/1632 ,  C23C18/1653 ,  C25D7/123 ,  H01L21/02074 ,  H01L21/02087 ,  H01L21/0209 ,  H01L21/288 ,  H01L21/2885 ,  H01L21/3212 ,  H01L21/67167 ,  H01L21/67173 ,  H01L21/67184 ,  H01L21/67219 ,  H01L21/6723 ,  H01L21/67393 ,  H01L21/67396 ,  H01L21/67772 ,  H01L21/7684 ,  H01L21/76843 ,  H01L21/76849 ,  H01L21/76864 ,  H01L21/76873 ,  H01L21/76874 ,  H01L21/76877

摘要： A substrate processing method comprising steps for forming a copper film on a surface of a substrate. These steps includes the step of filling a first metal in the trenches so as to form a plated film of the first metal on an entire surface of the substrate by electroplating, wherein the electromagnetic field is adjusted by the virtual anode so that differences of thickness of the plated film between the central portion and the peripheral portion of the substrate being minimized, and polishing and removing the plated film by pressing the substrate to the polishing surface, wherein the pressures pressing the substrate to the polishing surface at a central portion and a peripheral portion are adjusted.

摘要翻译： 一种基板处理方法，包括在基板的表面上形成铜膜的步骤。 这些步骤包括在沟槽中填充第一金属以便通过电镀在基板的整个表面上形成第一金属的镀膜的步骤，其中电磁场由虚拟阳极调节，使得厚度差异 基板的中心部分和周边部分之间的镀膜最小化，并且通过将基板压在研磨表面上来研磨和去除镀膜，其中将基板压在抛光表面的压力在中心部分和周边 部分进行调整。