Abstract:
Systems, methods, and apparatuses are provided for linear envelope elimination and restoration transmitters that are based on the polar modulation operating in conjunction with the orthogonal recursive predistortion technique. The polar modulation technique enhances the battery life by dynamically adjusting the bias level. Further, the analog orthogonal recursive predistortion efficiently corrects amplitude and phase errors in radio frequency (RF) power amplifiers (PA) and enhances the PA output capability. Additionally, even-order distortion components are used to predistort the input signal in a multiplicative manner so that the effective correction bandwidth is greatly enhanced. Also, the predistortion scheme, which uses instantaneously feed-backed envelope distortion signals, allows for correction of any distortion that may occur within the correction loop bandwidth, including envelope memory effects.
Abstract:
Provided is a multiband low noise amplifier including a first transistor, an input matching circuit, and a first capacitor. The first transistor includes a collector electrically connected to a first power supply, a grounded emitter, and a base connected to the other end of a first inductor having one end as an input end of the low noise amplifier. The input matching circuit is connected between the collector and the base of the first transistor. The first capacitor connected to the collector of the first transistior. The input matching circuit includes a varactor. The input matching circuit includes a second capacitor connected to the varactor. The input matching circuit includes a first resistor connected to the varactor. In the multiband low noise amplifier, a varactor having a variable capacitance is installed at an input end, thereby easily performing band switching through bias voltage control by a small amount and minimizing noises that may be caused by a control signal.
Abstract:
A device and method for layout and fabrication of power supply bus lines in an integrated circuit such as a memory circuit are described. In accordance with the present invention, power bus lines and bonding pads of the circuit are not necessarily formed in both edge regions and center regions of the device. The bonding pads are formed in the region according to the package being used, and the power bus lines are formed in the other region. This is accomplished by forming the bonding pads over landing pads. Landing pads are formed in both the center region and the edge region under the top surface of the device. If the device is to be packaged in an edge pad configuration, the bonding pads are formed over the landing pads in the edge region, and power supply bus lines can be formed over the landing pads in the center region. Similarly, if the device is to be packaged in a center pad configuration, the bonding pads are formed over the landing pads in the center region, and the power supply bus lines can be formed over the landing pads in the edge region. The bonding pads are connected to the landing pads by conductive vias. Because the power bus lines are not formed in the same region as bonding pads, they can occupy a relatively large portion of the region in which they are formed. That is, they can be made much larger than they would be using the conventional approach in which both bonding pads and power bus lines are formed in the same region. As a result, the power noise drawbacks of the conventional approach are eliminated.
Abstract:
Systems, methods, and apparatuses are provided for fine-sensing modules that are operative for identifying one or more signal types from an input radio frequency (RF) signal. The fine-sensing modules may include a multiplier that combines an RF input signal and a delayed RF input signal to produce a correlation signal and an integrator that receives the correlation signal from the multiplier, where the integrator determines correlation values from integrating the correlation signal. The fine-sensing module also includes a comparator in communication with the integrator that compares the correlation values to one or more thresholds to generate information indicative of at least one signal feature of the RF input signal.
Abstract:
Systems, methods, and apparatuses are provided for spectrum-sensing cognitive radios that are operative to detect and utilize available RF spectrum resources. The spectrum-sensing cognitive radios include at least one antenna and a frequency-agile radio front-end module in communication with the at least one antenna and configured to transmit and receive radio frequency signals via the at least one antenna. In addition, a spectrum-sensing module, which may include one or both of coarse-sensing and fine-sensing modules, may be in communication with the at least one antenna and be configured to generate RF spectrum usage information. A medium access control (MAC) module is operative to receive the RF spectrum usage information from the spectrum-sensing module. Based upon the received RF spectrum usage information, the MAC module is operative to direct a frequency of operation of the radio front-end module based at least in part on the received spectrum usage information.
Abstract:
Disclosed is a local oscillation circuit for a direct conversion receiver, which includes a local oscillator for outputting a local oscillation signal of a predetermined frequency; and a fractional signal generator for converting the local oscillation signal into a fractional harmonic signal, which has a frequency equal to a frequency of a received signal, and outputting the converted signal to a down converter. The fractional signal generator includes a divider for dividing a frequency of an output signal of the fractional signal generator by a predetermined integer; and a mixer for mixing the local oscillation signal and an output signal of the divider.
Abstract:
Disclosed is a wireless headset apparatus and an operation method thereof. A separate earphone is connected to a wireless headset so that the user can listen to a voice through both the earphone and a built-in speaker included in the wireless headset. When the connected earphone includes a microphone, the function of a built-in microphone included in the wireless headset is interrupted, and a voice is received through the microphone included in the connected earphone, so that the user can smoothly communicate even when the user moves to a noisy area where the communication environment is poor.
Abstract:
A triarylamine-based compound represented by Formula (1), and an organic electroluminescent device using an organic layer including the triarylamine-based compound are provided: where each of Ar1 to Ar8 is independently a substituted or unsubstituted C6-C30 aryl group or a substituted or unsubstituted C2-C30 heteroaryl group. The triarylamine-based compound has superior electric properties and charge transport abilities, and thus is useful as a hole injection material and a hole transport material which are suitable for fluorescent and phosphorescent devices of all colors, including red, green, blue, and white colors. The organic electroluminescent device manufactured using the triarylamine-based compound has high efficiency, low voltage, high luminance, and a long lifespan.
Abstract:
A circuit for sensing an open-circuit lamp is provided. The circuit includes a reference voltage output unit, a voltage sensor, and a comparator. The reference voltage output unit provides a reference voltage. The voltage sensor detects a sensed voltage corresponding to a status of a lamp. The status of the lamp includes an open-circuit status and a closed-circuit status. The comparator compares the sensed voltage with the reference voltage and outputs a result indicating the status of the lamp.
Abstract:
In a semiconductor device fabrication method and in a product formed according to the method, a photosensitive polyimide layer (PSPL) layer is applied to a semiconductor device in a manner which overcomes the limitations of the conventional approaches. The beneficial qualities of an added photoresist layer are utilized to avoid unwanted development of the underlying PSPL layer. In this manner, cracking of the PSPL layer is mitigated or eliminated, reducing the device soft error rate (SER) and increasing device yield. This is accomplished in a reliable and low-cost approach that employs standard device fabrication techniques.