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公开(公告)号:US20030104197A1
公开(公告)日:2003-06-05
申请号:US09996777
申请日:2001-11-30
申请人: JSP CORPORATION
发明人: Kazuhiko Morita , Takashi Muroi , Hirotoshi Kakuta
IPC分类号: B32B003/26
CPC分类号: B32B27/32 , Y10T428/24942 , Y10T428/2495 , Y10T428/249976 , Y10T428/249977 , Y10T428/249986 , Y10T428/249988 , Y10T428/249991 , Y10T428/249992
摘要: The present invention relates to a sheet or board like multiple layers laminated polyolefin foam having a plurality of polyolefin layers laminated on at least one side of a polyolefin foam by a coextrusion method. More specifically, the present invention relates to said multiple layers laminated polyolefin foam, wherein the thickness of the outermost layer constituting the plurality of polyolefin layers is 5 to 80 nullm, and the density d (g/L) of the polyolefin foam, the melt flow rate null (g/10 min) of the polyolefin constituting the innermost layer among the plurality of polyolefin layers, and the thickness Y (nullm) of the innermost layer of the multiple polyolefin layers satisfy the following relationships (1) to (4). Ynull0.29dnullnullnull(1) 5nullnullnull40 nullnull(2) 70nullYnull300 nullnull(3) 100nulldnull300 nullnull(4)
摘要翻译: 本发明涉及通过共挤出法在聚烯烃泡沫的至少一面层叠多个聚烯烃层的多层层压聚烯烃泡沫的片材或板。 更具体地,本发明涉及所述多层层压聚烯烃泡沫,其中构成多个聚烯烃层的最外层的厚度为5-80μm,聚烯烃泡沫的密度d(g / L),熔体 在多个聚烯烃层中构成最内层的聚烯烃的流量x(g / 10分钟)和多个聚烯烃层的最内层的厚度Y(母体)满足以下关系式(1)至(4) 。 Y <= 0.29dx(1)5 <= x <= 40(2)70 <= Y <= 300(3)100 <= d <= 300(4)
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公开(公告)号:US12129350B2
公开(公告)日:2024-10-29
申请号:US17273232
申请日:2019-09-04
申请人: JSP Corporation
发明人: Tatsuya Hayashi , Akinobu Hira
CPC分类号: C08J9/18 , C08J2377/06
摘要: A polyamide-based resin expanded bead comprising a foam layer formed by expanding a polyamide-based resin, wherein on a first DSC curve and a second DSC curve, the first DSC curve has a melting peak (intrinsic peak) having a peak top temperature on a low temperature side equal to or lower than a peak top temperature of a melting peak of the second DSC curve and a melting peak (high temperature peak) having a peak top temperature on a high temperature side exceeding the peak top temperature of the second DSC curve, and, the peak top temperature of the melting peak of the second DSC curve is 180° C. or higher and 280° C. or lower, and the polyamide-based resin expanded bead has an apparent density of 10 to 300 kg/m3 and a closed cell ratio of 85% or more.
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123.
公开(公告)号:US20240301158A1
公开(公告)日:2024-09-12
申请号:US18549445
申请日:2022-03-11
申请人: JSP CORPORATION
发明人: Takumi SAKAMURA , Hajime OHTA
IPC分类号: C08J9/18 , B29C44/02 , B29C44/34 , B29K23/00 , B29K105/00 , B29K105/04 , B29K105/16 , B29K507/04 , C08J3/12 , C08J9/00 , C08J9/12
CPC分类号: C08J9/18 , B29C44/3461 , C08J3/126 , C08J9/0066 , C08J9/122 , B29C44/02 , B29C44/3415 , B29K2023/12 , B29K2023/16 , B29K2105/0005 , B29K2105/0032 , B29K2105/0085 , B29K2105/046 , B29K2105/16 , B29K2105/251 , B29K2507/04 , B29K2995/0063 , C08J2323/16 , C08J2323/18
摘要: A method for producing polypropylene-based resin (PPBR) expanded beads may include dispersing, first expanding, and second expanding. In the dispersing, resin particles are dispersed in a dispersion medium, the resin particles each including a core layer, containing carbon black blended into PPBR in a predetermined ratio, based on 100 parts by mass of PPBR, and a covering layer covering the core layer, containing carbon black blended into a polyolefin-based resin (POBR) in a predetermined ratio, based on 100 parts by mass of POBR. The first expanding expands the core layer of the resin particle to obtain a first expanded bead having a bulk ratio of 5 to 25 times. The second expanding expands the first expanded beads further to obtain second expanded beads. An M2/M1 ratio of a bulk ratio M2 of the second expanded beads to a bulk ratio M1 of the first expanded beads is 1.2 to 3.0.
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公开(公告)号:US20240286334A1
公开(公告)日:2024-08-29
申请号:US18019619
申请日:2021-08-06
申请人: JSP CORPORATION
IPC分类号: B29C48/00 , B29C48/21 , B29K25/00 , B29K105/00 , B29K105/04 , B29L7/00
CPC分类号: B29C48/0012 , B29C48/21 , B29K2023/06 , B29K2025/06 , B29K2105/0008 , B29K2105/0067 , B29K2105/04 , B29K2995/0005 , B29L2007/002
摘要: The multilayer foam sheet includes a polyethylene resin foam layer and a resin layer laminated on at least one of the two surfaces of the foam layer. The resin layer has a multilayer structure formed from a surface layer and an intermediate layer. Both the surface layer and the intermediate layer contain a polyethylene resin and a polymeric antistatic agent. The polymeric antistatic agent is contained in the intermediate layer at a proportion of 30-70 wt % (inclusive). The polymeric antistatic agent is contained in the surface layer at a proportion of at least 5 wt % to less than 30 wt %.
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125.
公开(公告)号:US11993690B2
公开(公告)日:2024-05-28
申请号:US17168762
申请日:2021-02-05
申请人: JSP CORPORATION
发明人: Tatsuya Hayashi
CPC分类号: C08J9/18 , C08J9/228 , C08J2201/03 , C08J2203/14 , C08J2377/00
摘要: The polyamide-based resin expanded beads are expanded beads including a polyamide-based resin as a base resin, in which the average value of bead weight of the expanded beads is 0.5 mg or more and 8 mg or less, the coefficient of variation of the bead weight of the expanded beads is 10% or less, and the average value of the ratio of a long diameter to a short diameter (a long diameter/a short diameter) of the expanded beads measured with a projection image photographing type bead size distribution analyzer is 1 or more and 1.5 or less, the coefficient of variation of the ratio (a long diameter/a short diameter) is 12% or less, the average value of the a short diameter is 1 mm or more and 4 mm or less, and the coefficient of variation of the a short diameter is 10% or less.
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公开(公告)号:US20240025093A1
公开(公告)日:2024-01-25
申请号:US18217651
申请日:2023-07-03
申请人: JSP CORPORATION
发明人: Hisashi MASUMOTO
IPC分类号: B29C44/44
CPC分类号: B29C44/445 , B29K2023/12
摘要: An expanded bead of polypropylene-based resin formed with a through hole that is defined by an inner peripheral surface and that has an average hole diameter of 1 mm or less. The expanded bead has a closed cell content of 85% or more, an average cell diameter of 50 to 300 μm and an inner surface portion that extends along the inner peripheral surface that has an average cell diameter of 5 to 150 μm which is smaller than the average cell diameter of the expanded bead.
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公开(公告)号:US20240017451A1
公开(公告)日:2024-01-18
申请号:US18033741
申请日:2021-10-08
申请人: JSP Corporation
IPC分类号: B29C44/20 , B29K23/00 , B29K105/04
CPC分类号: B29C44/206 , B29K2023/00 , B29K2995/0082 , B29K2995/0094 , B29K2105/048
摘要: The present invention relates to a method for producing a laminate, wherein the laminate is obtained by integrally laminating an expanded beads molded article (a) composed of expanded beads A and having interconnected voids and an expanded beads molded article (b) composed of expanded particles B and having interconnected voids, the difference [Pb−Pa] between the voidage (Pa) of the expanded beads molded article (a) and the voidage (Pb) of the expanded beads molded article (b) is 5% or more, and the expanded beads A and the expanded beads B satisfy the following (1) to (3): (1) a difference [dB−dA] between an average hole diameter (dA) of the through-holes of the expanded beads (A) and an average hole diameter (dB) of the through-holes of the expanded beads (B) is 0.3 mm or more and 2 mm or less; (2) the expanded beads (B) have an average outer diameter DB of 3.5 mm or more and 5 mm or less; (3) a difference [DB−DA] between an average outer diameter DA of the expanded beads (A) and an average outer diameter DB of the expanded beads (B) is −0.3 mm or more and 2 mm or less.
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公开(公告)号:US11680148B2
公开(公告)日:2023-06-20
申请号:US16761467
申请日:2018-11-08
申请人: JSP Corporation
发明人: Toshio Morita , Hidehiro Sasaki , Tomohiro Hoshino
摘要: Provided are composite particles in which reinforcing fibers adhere to the surface of thermoplastic resin expanded beads via a thermosetting resin being in an uncured state, a cured product of the composite particles, an in-mold molded article of the composite particles, a laminate of the composite particles and a reinforcing fiber sheet material, a composite of the composite particles, and a method for producing composite particles.
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公开(公告)号:US20230119472A1
公开(公告)日:2023-04-20
申请号:US17905890
申请日:2021-02-12
申请人: JSP CORPORATION
发明人: Takashi OI , Hajime OHTA
摘要: A molded article of polypropylene-based resin expanded beads, obtained by in-mold molding of the polypropylene-based resin expanded beads, each bead including: a core layer, in a foamed state, having a polypropylene-based resin; and a covering layer, which covers the core layer, having a polyethylene-based resin. A molded article magnification X [times] of the molded article is 55 times to 90 times, a value of a product X·σ50 of a 50% compressive stress σ50 [kPa] and the molded article magnification X is 6500 or more, and a 5% compressive stress σ5 of the expanded beads molded article is 5 kPa to 25 kPa.
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公开(公告)号:US20230075291A1
公开(公告)日:2023-03-09
申请号:US17760410
申请日:2021-02-17
申请人: JSP CORPORATION
发明人: Yohei KANEKO , Kenji HARAGUCHI
IPC分类号: C08F220/18 , C08F212/08 , C08F2/32 , C08F218/04 , C08J9/22
摘要: A HIPE foam may including a vinyl-based crosslinked polymer as a base material resin. The vinyl-based crosslinked polymer may be formed by crosslinking a polymer of a styrene-based monomer and/or an acryl-based monomer. An apparent density ρ of the HIPE foam may be 35 kg/m3 or more and 500 kg/m3 or less. A molecular weight between crosslinking points of the vinyl-based crosslinked polymer forming the HIPE foam may be 2×103 or more and 2×105 or less. The HIPE foam may be used as, for example, a machinable material or an impact absorbing material.
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