Abstract:
Measuring probe for non-destructive measuring of the thickness of thin layers, in particular in cavities, which are accessible by an opening or on curved surfaces, with a measuring head, which includes at least one sensor element and at least one contact spherical cap, assigned to the sensor element on a surface, to be checked, of the cavity, and with a gripping element for positioning and guiding the measuring probe on and/or along the surface to be measured, wherein on the gripping element, a long, elastically yielding guide bar is provided, which accepts the at least one measuring head on its end opposing the gripping element, in such a way that it is moveable with at least one degree of freedom in relation to the guide bar.
Abstract:
The invention relates to an optoelectronic semiconductor component, comprising a substrate-free optoelectronic semiconductor chip (1), which has a first main surface (1a) on an upper face and a second main surface (1b) on a lower face, and a metal carrier (2), which is arranged on the lower face of the optoelectronic semiconductor chip (1), wherein the metal carrier (2) protrudes over the optoelectronic semiconductor chip (1) in at least one lateral direction (1) and the metal carrier (2) is deposited on the second main surface (1b) of the optoelectronic semiconductor chip (1) using a galvanic or electroless plating method.
Abstract:
Method for emitting measuring values on a display (27) for a display device. According to the method, the measuring values that are recorded by a measuring device (24) on at least one test object (11) are forwarded to a signal processing device; a measuring value is detected at each measuring point (14-21) on the test object (11), or a plurality of measuring values are detected at each measuring point (14-21) on the test object (11); the average value is determined at each measuring point (14-21), from the number of detected measuring values; the average values of the respective measuring points (14-21) on at least one test object (11) are sorted according to the rank thereof in an evaluation device including an electronic calculator; and the average values are represented on the display (27) together with an upper and a lower boundary line.
Abstract:
The invention relates to a method and a device for measuring the thickness of thin layers over large-area surfaces to be measured (12), in which at least one measuring probe (28), which comprises at least one sensor element (29) and at least one contact spherical cap (31) associated with the sensor element (29), is applied to the surface to be measured (12) in order to obtain a measured value, wherein the large-area surface to be measured (12) is subdivided into individual partial areas (14), a matrix of measurement points (16) is determined for each partial area (14) to be inspected, measured values are ascertained at equidistant measurement points (16) along at least one row (17) of the matrix of the partial area (14) using a device (21) carrying the at least one measuring probe (28), and the measured values are ascertained successively for all rows (17) in the matrix in the partial area (14) and evaluated for this partial area (14).
Abstract:
A method is disclosed in which a base body is prepared that comprises a layer sequence intended for the LED chip and suitable for emitting electromagnetic radiation. A cap layer is applied to at least one main surface of the base body. A cavity is introduced into the cap layer and is completely or partially filled with a luminescence conversion material. The luminescence conversion material comprises at least one phosphor. A method is also disclosed in which the cap layer comprises photostructurable material and at least one phosphor, such that it is able to function as a luminescence conversion material and can be photostructured directly. LED chips that are producible by means of the method are also described.
Abstract:
The invention relates to a method and an apparatus for measurement of the thickness of thin layers by means of a measurement probe (11) which has a housing (14) which holds at least one sensor element (17) whose longitudinal axis lies in particular on a longitudinal axis (16) of the housing (14), in which at least during the measurement process, a gaseous medium is supplied to a supply opening (21) of the measurement probe (11) on a measurement surface (28), and is supplied via at least one connection channel (24), which is connected to the supply opening (21), to one or more outlet openings (26) which are provided on an end face (29), pointing towards the measurement surface (28), of the measurement probe (11), and in which at least one mass flow, which flows out of one or more outlet openings (26), of the gaseous medium is directed at the measurement surface (28), and in which the measurement probe (11) is held in a non-contacting manner with respect to the measurement surface (28) during the measurement process.
Abstract:
A measurement stand for holding a measuring device (26), in particular a measuring arrangement (26) for measuring the thickness of thin layers, said measurement stand comprising a housing (18) in which a cam follower (23) is guided such that it can be moved up and down and the measuring device (26) is arranged at that end of said housing (18) that faces the measuring object (14), wherein a drive unit (29) with an electric drive (28) drives the lifting movement of the cam follower (23), wherein said drive unit (29) initiates in the down movement at least one first movement phase with a rapid motion and at least one further movement phase of the cam follower (23) with a creep motion until the measuring device (26) touches down on the measuring object (14).
Abstract:
A method is disclosed in which a base body is prepared that comprises a layer sequence intended for the LED chip and suitable for emitting electromagnetic radiation. A cap layer is applied to at least one main surface of the base body. A cavity is introduced into the cap layer and is completely or partially filled with a luminescence conversion material. The luminescence conversion material comprises at least one phosphor. A method is also disclosed in which the cap layer comprises photostructurable material and at least one phosphor, such that it is able to function as a luminescence conversion material and can be photostructured directly. LED chips that are producible by means of the method are also described.
Abstract:
The invention relates to a Measuring probe for a device for the measurement of the thickness of thin layers, with a housing (14) comprising at least one sensor element (17), which is accepted along a longitudinal axis (16) of the housing (14) at least slightly movable to the housing (14) and with a contact spherical cap (21) assigned to the at least one sensor element (17) for setting the measuring probe (11) onto a surface of a measuring object, wereby in that the at least one sensor element (17) is accepted by a holding element (18)—along the longitudinal axis (16) of the housing (14)—which is designed spring-loaded resiliently and which is fastened on the housing (14).
Abstract:
A data memory circuit is provided. In one embodiment, the data memory circuit comprises a plurality of addressable memory cells, a command decoding device for decoding external commands and a control device for controlling or initiating operations for the operation of the data memory circuit in each case in a manner dependent on the decoded commands. The memory circuit has critical operating states in which the execution of specific commands is impermissible resulting in the course of specific operations in the data memory circuit, wherein a command buffer device buffer-stores commands received during the duration of their impermissibility and releases them for execution after the end of their impermissibility.