MEASURING PROBE FOR NON-DESTRUCTIVE MEASURING OF THE THICKNESS OF THIN LAYERS
    121.
    发明申请
    MEASURING PROBE FOR NON-DESTRUCTIVE MEASURING OF THE THICKNESS OF THIN LAYERS 审中-公开
    用于非破坏性测量薄层厚度的测量探针

    公开(公告)号:US20150253122A1

    公开(公告)日:2015-09-10

    申请号:US14723027

    申请日:2015-05-27

    Inventor: Helmut Fischer

    CPC classification number: G01B7/10 G01B7/001 G01B7/105 G01B21/08

    Abstract: Measuring probe for non-destructive measuring of the thickness of thin layers, in particular in cavities, which are accessible by an opening or on curved surfaces, with a measuring head, which includes at least one sensor element and at least one contact spherical cap, assigned to the sensor element on a surface, to be checked, of the cavity, and with a gripping element for positioning and guiding the measuring probe on and/or along the surface to be measured, wherein on the gripping element, a long, elastically yielding guide bar is provided, which accepts the at least one measuring head on its end opposing the gripping element, in such a way that it is moveable with at least one degree of freedom in relation to the guide bar.

    Abstract translation: 用于非破坏性地测量薄层厚度的测量探针,特别是在具有开口或弯曲表面的空腔中,测量头包括至少一个传感器元件和至少一个接触球形盖, 分配给待检查的空腔的表面上的传感器元件,以及用于在测量表面上和/或沿着待测量表面定位和引导测量探针的夹持元件,其中在夹持元件上具有长的,弹性的 提供了屈服导杆,其在其与夹紧元件相对的端部上接纳至少一个测量头,使得其能够相对于引导杆至少一个自由度移动。

    Method for outputting measured values and display device
    123.
    发明授权
    Method for outputting measured values and display device 有权
    输出测量值和显示装置的方法

    公开(公告)号:US08560269B2

    公开(公告)日:2013-10-15

    申请号:US11664402

    申请日:2005-09-30

    Applicant: Helmut Fischer

    Inventor: Helmut Fischer

    CPC classification number: G05B23/0267 G01D1/14 G05B2219/32195 Y02P90/22

    Abstract: Method for emitting measuring values on a display (27) for a display device. According to the method, the measuring values that are recorded by a measuring device (24) on at least one test object (11) are forwarded to a signal processing device; a measuring value is detected at each measuring point (14-21) on the test object (11), or a plurality of measuring values are detected at each measuring point (14-21) on the test object (11); the average value is determined at each measuring point (14-21), from the number of detected measuring values; the average values of the respective measuring points (14-21) on at least one test object (11) are sorted according to the rank thereof in an evaluation device including an electronic calculator; and the average values are represented on the display (27) together with an upper and a lower boundary line.

    Abstract translation: 用于在显示装置的显示器(27)上发射测量值的方法。 根据该方法,由测量装置(24)在至少一个测试对象(11)上记录的测量值被转发到信号处理装置; 在测试对象(11)上的每个测量点(14-21)处检测测量值,或者在测试对象(11)上的每个测量点(14-21)处检测到多个测量值; 根据检测到的测量值的数量,在每个测量点(14-21)确定平均值; 在包括电子计算器的评估装置中,根据其等级对至少一个测试对象(11)上的相应测量点(14-21)的平均值进行排序; 并且平均值与上边界线和下边界线一起在显示器(27)上表示。

    Method and device for measuring the thickness of thin layers over large-area surfaces to be measured
    124.
    发明授权
    Method and device for measuring the thickness of thin layers over large-area surfaces to be measured 有权
    用于测量要测量的大面积表面上的薄层厚度的方法和装置

    公开(公告)号:US08474151B2

    公开(公告)日:2013-07-02

    申请号:US13068407

    申请日:2011-05-10

    Applicant: Helmut Fischer

    Inventor: Helmut Fischer

    CPC classification number: G01B7/105

    Abstract: The invention relates to a method and a device for measuring the thickness of thin layers over large-area surfaces to be measured (12), in which at least one measuring probe (28), which comprises at least one sensor element (29) and at least one contact spherical cap (31) associated with the sensor element (29), is applied to the surface to be measured (12) in order to obtain a measured value, wherein the large-area surface to be measured (12) is subdivided into individual partial areas (14), a matrix of measurement points (16) is determined for each partial area (14) to be inspected, measured values are ascertained at equidistant measurement points (16) along at least one row (17) of the matrix of the partial area (14) using a device (21) carrying the at least one measuring probe (28), and the measured values are ascertained successively for all rows (17) in the matrix in the partial area (14) and evaluated for this partial area (14).

    Abstract translation: 本发明涉及一种用于测量要测量的大面积表面(12)上的薄层的厚度的方法和装置,其中至少一个测量探针(28)包括至少一个传感器元件(29)和 将与传感器元件(29)相关联的至少一个接触球形盖(31)施加到被测量表面(12)以获得测量值,其中待测量的大面积表面(12)为 被分为单独的部分区域(14),对于要检查的每个部分区域(14)确定测量点(16)的矩阵,测量值沿着至少一行(17)的等距测量点(16)确定 使用承载至少一个测量探针(28)的装置(21)的部分区域(14)的矩阵以及在部分区域(14)中的矩阵中的所有行(17)连续地确定测量值,以及 评估该部分区域(14)。

    Chip and method for producing a chip
    125.
    发明授权
    Chip and method for producing a chip 有权
    用于制造芯片的芯片和方法

    公开(公告)号:US07906352B2

    公开(公告)日:2011-03-15

    申请号:US12064556

    申请日:2006-07-20

    Abstract: A method is disclosed in which a base body is prepared that comprises a layer sequence intended for the LED chip and suitable for emitting electromagnetic radiation. A cap layer is applied to at least one main surface of the base body. A cavity is introduced into the cap layer and is completely or partially filled with a luminescence conversion material. The luminescence conversion material comprises at least one phosphor. A method is also disclosed in which the cap layer comprises photostructurable material and at least one phosphor, such that it is able to function as a luminescence conversion material and can be photostructured directly. LED chips that are producible by means of the method are also described.

    Abstract translation: 公开了一种方法,其中准备了包括用于LED芯片并适于发射电磁辐射的层序列的基体。 盖层施加到基体的至少一个主表面。 空腔被引入盖层中,并且被完全或部分地填充有发光转换材料。 发光转换材料包括至少一种荧光体。 还公开了一种方法,其中盖层包括光可固化材料和至少一种磷光体,使得其能够用作发光转换材料并且可以直接光致结构化。 还描述了可通过该方法生产的LED芯片。

    Method and apparatus for measurement of the thickness of thin layers by means of measurement probe
    126.
    发明授权
    Method and apparatus for measurement of the thickness of thin layers by means of measurement probe 有权
    通过测量探头测量薄层厚度的方法和装置

    公开(公告)号:US07690243B2

    公开(公告)日:2010-04-06

    申请号:US11803703

    申请日:2007-05-15

    Applicant: Helmut Fischer

    Inventor: Helmut Fischer

    CPC classification number: G01B7/105

    Abstract: The invention relates to a method and an apparatus for measurement of the thickness of thin layers by means of a measurement probe (11) which has a housing (14) which holds at least one sensor element (17) whose longitudinal axis lies in particular on a longitudinal axis (16) of the housing (14), in which at least during the measurement process, a gaseous medium is supplied to a supply opening (21) of the measurement probe (11) on a measurement surface (28), and is supplied via at least one connection channel (24), which is connected to the supply opening (21), to one or more outlet openings (26) which are provided on an end face (29), pointing towards the measurement surface (28), of the measurement probe (11), and in which at least one mass flow, which flows out of one or more outlet openings (26), of the gaseous medium is directed at the measurement surface (28), and in which the measurement probe (11) is held in a non-contacting manner with respect to the measurement surface (28) during the measurement process.

    Abstract translation: 本发明涉及一种用于通过测量探头(11)测量薄层厚度的方法和装置,所述测量探针具有容纳至少一个传感器元件(17)的壳体,所述传感器元件(17)的纵轴特别位于 至少在测量过程期间,将气体介质供应到测量表面(28)上的测量探针(11)的供应开口(21)的壳体(14)的纵向轴线(16),以及 通过连接到供应开口(21)的至少一个连接通道(24)供应到设置在端面(29)上的一个或多个出口开口(26),所述端面指向测量表面(28) ),并且其中从所述气体介质的一个或多个出口(26)流出的至少一个质量流指向所述测量表面(28),其中所述测量表面 测量探针(11)相对于测量表面(28)以非接触的方式被保持 在测量过程中。

    Measurement stand for holding a measuring instrument
    127.
    发明授权
    Measurement stand for holding a measuring instrument 有权
    测量仪器用于固定测量仪器

    公开(公告)号:US07610690B2

    公开(公告)日:2009-11-03

    申请号:US11490382

    申请日:2006-07-20

    Applicant: Helmut Fischer

    Inventor: Helmut Fischer

    CPC classification number: G01B7/105 G01B5/0004

    Abstract: A measurement stand for holding a measuring device (26), in particular a measuring arrangement (26) for measuring the thickness of thin layers, said measurement stand comprising a housing (18) in which a cam follower (23) is guided such that it can be moved up and down and the measuring device (26) is arranged at that end of said housing (18) that faces the measuring object (14), wherein a drive unit (29) with an electric drive (28) drives the lifting movement of the cam follower (23), wherein said drive unit (29) initiates in the down movement at least one first movement phase with a rapid motion and at least one further movement phase of the cam follower (23) with a creep motion until the measuring device (26) touches down on the measuring object (14).

    Abstract translation: 用于保持测量装置(26)的测量台,特别是用于测量薄层厚度的测量装置(26),所述测量支架包括壳体(18),凸轮从动件(23)被引导到所述壳体 可以上下移动,并且测量装置(26)布置在所述壳体(18)的面向测量对象(14)的端部处,其中具有电驱动器(28)的驱动单元(29)驱动提升 凸轮从动件(23)的运动,其中所述驱动单元(29)以向下运动启动具有快速运动的至少一个第一运动相位和凸轮从动件(23)的至少一个进一步运动相位,其具有蠕变运动,直到 测量装置(26)在测量对象(14)上接触。

    METHOD FOR PRODUCING AN LED CHIP AND LED CHIP
    128.
    发明申请
    METHOD FOR PRODUCING AN LED CHIP AND LED CHIP 有权
    生产LED芯片和LED芯片的方法

    公开(公告)号:US20090212308A1

    公开(公告)日:2009-08-27

    申请号:US12064556

    申请日:2006-07-20

    Abstract: A method is disclosed in which a base body is prepared that comprises a layer sequence intended for the LED chip and suitable for emitting electromagnetic radiation. A cap layer is applied to at least one main surface of the base body. A cavity is introduced into the cap layer and is completely or partially filled with a luminescence conversion material. The luminescence conversion material comprises at least one phosphor. A method is also disclosed in which the cap layer comprises photostructurable material and at least one phosphor, such that it is able to function as a luminescence conversion material and can be photostructured directly. LED chips that are producible by means of the method are also described.

    Abstract translation: 公开了一种方法,其中准备了包括用于LED芯片并适于发射电磁辐射的层序列的基体。 盖层施加到基体的至少一个主表面。 空腔被引入盖层中,并且被完全或部分地填充有发光转换材料。 发光转换材料包括至少一种荧光体。 还公开了一种方法,其中盖层包括光可固化材料和至少一种磷光体,使得其能够用作发光转换材料并且可以直接光致结构化。 还描述了可通过该方法生产的LED芯片。

    Measuring probe, especially for a device for the measurement of the thickness of thin layers
    129.
    发明授权
    Measuring probe, especially for a device for the measurement of the thickness of thin layers 有权
    测量探针,特别是用于测量薄层厚度的装置

    公开(公告)号:US07472491B2

    公开(公告)日:2009-01-06

    申请号:US11599627

    申请日:2006-11-14

    Applicant: Helmut Fischer

    Inventor: Helmut Fischer

    CPC classification number: G01B7/105

    Abstract: The invention relates to a Measuring probe for a device for the measurement of the thickness of thin layers, with a housing (14) comprising at least one sensor element (17), which is accepted along a longitudinal axis (16) of the housing (14) at least slightly movable to the housing (14) and with a contact spherical cap (21) assigned to the at least one sensor element (17) for setting the measuring probe (11) onto a surface of a measuring object, wereby in that the at least one sensor element (17) is accepted by a holding element (18)—along the longitudinal axis (16) of the housing (14)—which is designed spring-loaded resiliently and which is fastened on the housing (14).

    Abstract translation: 本发明涉及一种用于测量薄层厚度的装置的测量探针,其中壳体(14)包括至少一个传感器元件(17),沿着壳体的纵向轴线(16)接受 14),至少可移动到壳体(14)并且具有分配给至少一个传感器元件(17)的接触式球形盖(21),用于将测量探针(11)设置在测量对象的表面上, 所述至少一个传感器元件(17)被所述壳体(14)的纵向轴线(16)接受,所述保持元件(18)被弹性地设计为弹簧加载并且被紧固在所述壳体(14)上 )。

    Data memory circuit
    130.
    发明授权
    Data memory circuit 失效
    数据存储电路

    公开(公告)号:US07360036B2

    公开(公告)日:2008-04-15

    申请号:US10817504

    申请日:2004-04-02

    CPC classification number: G11C7/109 G11C7/1078 G11C11/4093

    Abstract: A data memory circuit is provided. In one embodiment, the data memory circuit comprises a plurality of addressable memory cells, a command decoding device for decoding external commands and a control device for controlling or initiating operations for the operation of the data memory circuit in each case in a manner dependent on the decoded commands. The memory circuit has critical operating states in which the execution of specific commands is impermissible resulting in the course of specific operations in the data memory circuit, wherein a command buffer device buffer-stores commands received during the duration of their impermissibility and releases them for execution after the end of their impermissibility.

    Abstract translation: 提供数据存储电路。 在一个实施例中,数据存储器电路包括多个可寻址存储器单元,用于解码外部命令的命令解码装置和用于在每种情况下以取决于数据存储器电路的方式控制或启动用于数据存储器电路的操作的操作的控制装置 解码命令。 存储器电路具有关键的操作状态,其中特定命令的执行是不允许的,导致数据存储器电路中的特定操作的过程,其中命令缓冲器设备缓冲存储在其不允许期间期间接收到的命令并将其释放以执行 结束不了之后。

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