公开(公告)号：US20170360413A1

公开(公告)日：2017-12-21

申请号：US15629666

申请日：2017-06-21

Applicant: Butterfly Network, Inc.

Inventor： Jonathan M. Rothberg ,  Susan A. Alie ,  Nevada J. Sanchez ,  Tyler S. Ralston ,  Christopher Thomas McNulty ,  Jaime Scott Zahorian ,  Paul Francis Cristman ,  Matthew de Jonge ,  Keith G. Fife

IPC: A61B8/00 ,  A61B8/12 ,  B06B1/02

CPC classification number: A61B8/145 ,  A61B8/12 ,  A61B8/4236 ,  A61B8/4427 ,  A61B8/4444 ,  A61B8/4488 ,  A61B8/4494 ,  A61B8/465 ,  A61B8/467 ,  A61B8/54 ,  A61B8/56 ,  B06B1/0292 ,  B06B1/0622

Abstract: A universal ultrasound device having an ultrasound probe includes a semiconductor die; a plurality of ultrasonic transducers integrated on the semiconductor die, the plurality of ultrasonic transducers configured to operate a first mode associated with a first frequency range and a second mode associated with a second frequency range, wherein the first frequency range is at least partially non-overlapping with the second frequency range; and control circuitry configured to: control the plurality of ultrasonic transducers to generate and/or detect ultrasound signals having frequencies in the first frequency range, in response to receiving an indication to operate the ultrasound probe in the first mode; and control the plurality of ultrasonic transducers to generate and/or detect ultrasound signals having frequencies in the second frequency range, in response to receiving an indication to operate the ultrasound probe in the second mode.

公开(公告)号：US20170296144A1

公开(公告)日：2017-10-19

申请号：US15638331

申请日：2017-06-29

Applicant: Butterfly Network, Inc.

Inventor： Jonathan M. Rothberg ,  Keith G. Fife ,  Tyler S. Ralston ,  Gregory L. Charvat ,  Nevada J. Sanchez

IPC: A61B8/00 ,  G01S15/89 ,  A61B8/14 ,  G01S15/02 ,  G01S7/52 ,  B81C1/00 ,  B06B1/02 ,  A61N7/02 ,  A61N7/00 ,  H04R1/00 ,  A61B8/08

CPC classification number: A61B8/4494 ,  A61B8/14 ,  A61B8/145 ,  A61B8/4483 ,  A61B8/4488 ,  A61B8/485 ,  A61B8/54 ,  A61N7/00 ,  A61N7/02 ,  B06B1/02 ,  B81C1/00246 ,  G01S7/52019 ,  G01S7/52034 ,  G01S7/52047 ,  G01S7/5208 ,  G01S15/02 ,  G01S15/8915 ,  G01S15/8977 ,  H04R1/00

Abstract: To implement a single-chip ultrasonic imaging solution, on-chip signal processing may be employed in the receive signal path to reduce data bandwidth and a high-speed serial data module may be used to move data for all received channels off-chip as digital data stream. The digitization of received signals on-chip allows advanced digital signal processing to be performed on-chip, and thus permits the full integration of an entire ultrasonic imaging system on a single semiconductor substrate. Various novel waveform generation techniques, transducer configuration and biasing methodologies, etc., are likewise disclosed. HIFU methods may additionally or alternatively be employed as a component of the “ultrasound-on-a-chip” solution disclosed herein.

公开(公告)号：US20170258443A1

公开(公告)日：2017-09-14

申请号：US15606131

申请日：2017-05-26

Applicant: Butterfly Network, Inc.

Inventor： Jonathan M. Rothberg ,  Keith G. Fife ,  Nevada J. Sanchez ,  Tyler S. Ralston ,  Gregory L. Charvat ,  Gregory Corteville

IPC: A61B8/00 ,  A61B8/08 ,  A61B8/13

CPC classification number: A61B8/4444 ,  A61B8/13 ,  A61B8/14 ,  A61B8/4411 ,  A61B8/4477 ,  A61B8/4483 ,  A61B8/4488 ,  A61B8/4494 ,  A61B8/483 ,  A61B8/5207 ,  A61B8/54 ,  A61B8/56 ,  A61N7/02 ,  A61N2007/0078 ,  B06B1/0292 ,  G01S7/003 ,  G01S7/5208 ,  G01S7/52084 ,  G01S15/8915 ,  G03B27/423 ,  G03B27/52 ,  Y10T29/49005

Abstract: Ultrasound devices and methods are described, including a repeatable ultrasound transducer probe having ultrasonic transducers and corresponding circuitry. The repeatable ultrasound transducer probe may be used individually or coupled with other instances of the repeatable ultrasound transducer probe to create a desired ultrasound device. The ultrasound devices may optionally be connected to various types of external devices to provide additional processing and image rendering functionality.

公开(公告)号：US20160379973A1

公开(公告)日：2016-12-29

申请号：US15259243

申请日：2016-09-08

Applicant: Butterfly Network, Inc.

Inventor： Jonathan M. Rothberg ,  Keith G. Fife ,  Nevada J. Sanchez ,  Susan A. Alie

IPC: H01L27/06 ,  H01L21/56 ,  H01L21/768 ,  H01L21/8238 ,  H01L23/522 ,  A61B8/00 ,  H01L27/092 ,  B06B1/02 ,  B81B3/00 ,  B81B7/00 ,  B81C1/00 ,  H01L21/3213 ,  H01L23/528

CPC classification number: H01L27/0617 ,  A61B8/00 ,  A61B8/4494 ,  B06B1/02 ,  B06B1/0292 ,  B06B2201/51 ,  B81B3/0021 ,  B81B7/0006 ,  B81B2201/0271 ,  B81C1/00158 ,  B81C1/00246 ,  B81C2203/0735 ,  B81C2203/0771 ,  H01L21/32134 ,  H01L21/56 ,  H01L21/768 ,  H01L21/76838 ,  H01L21/823871 ,  H01L23/5226 ,  H01L23/528 ,  H01L27/0688 ,  H01L27/092 ,  H01L2224/16225

Abstract: Micromachined ultrasonic transducers formed in complementary metal oxide semiconductor (CMOS) wafers are described, as are methods of fabricating such devices. A metallization layer of a CMOS wafer may be removed by sacrificial release to create a cavity of an ultrasonic transducer. Remaining layers may form a membrane of the ultrasonic transducer.

Abstract translation: 还描述了形成在互补金属氧化物半导体（CMOS）晶片中的微加工超声换能器，以及制造这种器件的方法。 可以通过牺牲释放去除CMOS晶片的金属化层，以产生超声换能器的空腔。 剩余的层可以形成超声换能器的膜。

公开(公告)号：US09499395B2

公开(公告)日：2016-11-22

申请号：US15042931

申请日：2016-02-12

Applicant: Butterfly Network, Inc.

Inventor： Jonathan M. Rothberg ,  Keith G. Fife ,  Tyler S. Ralston ,  Gregory L. Charvat ,  Nevada J. Sanchez

IPC: B06B1/02 ,  H01L29/84 ,  B81B7/00 ,  B81C1/00

CPC classification number: B81C1/00301 ,  B06B1/02 ,  B06B1/0292 ,  B81B7/007 ,  B81C1/00134 ,  B81C1/00158 ,  B81C1/00246 ,  B81C2201/0195 ,  B81C2203/0735 ,  B81C2203/0771 ,  G01N29/2406 ,  H01L29/84 ,  H04R19/005

Abstract: Complementary metal oxide semiconductor (CMOS) ultrasonic transducers (CUTs) and methods for forming CUTs are described. The CUTs may include monolithically integrated ultrasonic transducers and integrated circuits for operating in connection with the transducers. The CUTs may be used in ultrasound devices such as ultrasound imaging devices and/or high intensity focused ultrasound (HIFU) devices.

公开(公告)号：US09327142B2

公开(公告)日：2016-05-03

申请号：US14561328

申请日：2014-12-05

Applicant: Butterfly Network, Inc.

Inventor： Jonathan M. Rothberg ,  Keith G. Fife ,  Tyler S. Ralston ,  Gregory L. Charvat ,  Nevada J. Sanchez

IPC: A61N7/02 ,  A61B8/00 ,  A61B8/14 ,  A61N7/00 ,  G01S15/02 ,  G01S15/89 ,  H04R1/00 ,  B81C1/00 ,  G01S7/52 ,  B06B1/02 ,  A61B8/08

CPC classification number: A61B8/4494 ,  A61B8/14 ,  A61B8/145 ,  A61B8/4483 ,  A61B8/4488 ,  A61B8/485 ,  A61B8/54 ,  A61N7/00 ,  A61N7/02 ,  B06B1/02 ,  B81C1/00246 ,  G01S7/52019 ,  G01S7/52034 ,  G01S7/52047 ,  G01S7/5208 ,  G01S15/02 ,  G01S15/8915 ,  G01S15/8977 ,  H04R1/00 ,  Y10T29/41

Abstract: To implement a single-chip ultrasonic imaging solution, on-chip signal processing may be employed in the receive signal path to reduce data bandwidth and a high-speed serial data module may be used to move data for all received channels off-chip as digital data stream. The digitization of received signals on-chip allows advanced digital signal processing to be performed on-chip, and thus permits the full integration of an entire ultrasonic imaging system on a single semiconductor substrate. Various novel waveform generation techniques, transducer configuration and biasing methodologies, etc., are likewise disclosed. HIFU methods may additionally or alternatively be employed as a component of the “ultrasound-on-a-chip” solution disclosed herein.

Abstract translation: 为了实现单芯片超声成像解决方案，可以在接收信号路径中采用片上信号处理以减少数据带宽，并且可以使用高速串行数据模块来将数据作为数字的片外移动数据 数据流。 片上接收信号的数字化允许在芯片上执行高级数字信号处理，从而允许整个超声波成像系统完全集成在单个半导体衬底上。 同样公开了各种新颖的波形产生技术，换能器配置和偏置方法等。 HIFU方法可以额外地或替代地用作本文公开的“片上超声”解决方案的组件。

公开(公告)号：US20160069989A1

公开(公告)日：2016-03-10

申请号：US14940837

申请日：2015-11-13

Applicant: Butterfly Network, Inc.

Inventor： Jonathan M. Rothberg ,  Tyler S. Ralston ,  Nevada J. Sanchez ,  Andrew J. Casper

IPC: G01S7/52 ,  H03K5/13

CPC classification number: G01S7/52019 ,  B06B1/0292 ,  B06B1/0607 ,  G01S7/52017 ,  G01S7/5202 ,  G10K11/346 ,  H03K5/13 ,  H03K2005/00019

Abstract: Aspects of the technology described herein relate to ultrasound device circuitry as may form part of a single substrate ultrasound device having integrated ultrasonic transducers. The ultrasound device circuitry may facilitate the generation of ultrasound waveforms in a manner that is power- and data-efficient.

Abstract translation: 本文描述的技术的方面涉及超声装置电路，其可以形成具有集成的超声换能器的单个衬底超声装置的一部分。 超声波装置电路可以以功率和数据效率的方式促进产生超声波形。

公开(公告)号：US20160009544A1

公开(公告)日：2016-01-14

申请号：US14799484

申请日：2015-07-14

Applicant: Butterfly Network, Inc.

Inventor： Jonathan M. Rothberg ,  Susan A. Alie ,  Keith G. Fife ,  Nevada J. Sanchez ,  Tyler S. Ralston

IPC: B81B3/00 ,  H01L23/00 ,  H01L21/78 ,  B81C1/00

Abstract: Micromachined ultrasonic transducers integrated with complementary metal oxide semiconductor (CMOS) substrates are described, as well as methods of fabricating such devices. Fabrication may involve two separate wafer bonding steps. Wafer bonding may be used to fabricate sealed cavities in a substrate. Wafer bonding may also be used to bond the substrate to another substrate, such as a CMOS wafer. At least the second wafer bonding may be performed at a low temperature.

公开(公告)号：US20150301165A1

公开(公告)日：2015-10-22

申请号：US14689090

申请日：2015-04-17

Applicant: Butterfly Network, Inc.

Inventor： Jonathan M. Rothberg ,  Tyler S. Ralston ,  Nevada J. Sanchez ,  Andrew J. Casper

IPC: G01S7/52 ,  H03K5/13

CPC classification number: G01S7/52019 ,  B06B1/0292 ,  B06B1/0607 ,  G01S7/52017 ,  G01S7/5202 ,  G10K11/346 ,  H03K5/13 ,  H03K2005/00019

Abstract: Aspects of the technology described herein relate to ultrasound device circuitry as may form part of a single substrate ultrasound device having integrated ultrasonic transducers. The ultrasound device circuitry may facilitate the generation of ultrasound waveforms in a manner that is power- and data-efficient.

Abstract translation: 本文描述的技术的方面涉及超声装置电路，其可以形成具有集成的超声换能器的单个衬底超声装置的一部分。 超声波装置电路可以以功率和数据效率的方式促进产生超声波形。

公开(公告)号：US20150298170A1

公开(公告)日：2015-10-22

申请号：US14689119

申请日：2015-04-17

Applicant: Butterfly Network, Inc.

Inventor： Jonathan M. Rothberg ,  Keith G. Fife ,  Nevada J. Sanchez ,  Susan A. Alie

IPC: B06B1/02 ,  B81B7/00 ,  H01L21/8238 ,  H01L21/768 ,  B81B3/00 ,  H01L21/56 ,  H01L23/528 ,  B81C1/00 ,  H01L23/522 ,  H01L27/06 ,  H01L21/3213

CPC classification number: H01L27/0617 ,  A61B8/00 ,  A61B8/4494 ,  B06B1/02 ,  B06B1/0292 ,  B06B2201/51 ,  B81B3/0021 ,  B81B7/0006 ,  B81B2201/0271 ,  B81C1/00158 ,  B81C1/00246 ,  B81C2203/0735 ,  B81C2203/0771 ,  H01L21/32134 ,  H01L21/56 ,  H01L21/768 ,  H01L21/76838 ,  H01L21/823871 ,  H01L23/5226 ,  H01L23/528 ,  H01L27/0688 ,  H01L27/092 ,  H01L2224/16225

Abstract: Micromachined ultrasonic transducers formed in complementary metal oxide semiconductor (CMOS) wafers are described, as are methods of fabricating such devices. A metallization layer of a CMOS wafer may be removed by sacrificial release to create a cavity of an ultrasonic transducer. Remaining layers may form a membrane of the ultrasonic transducer.

Abstract translation: 还描述了形成在互补金属氧化物半导体（CMOS）晶片中的微加工超声换能器，以及制造这种器件的方法。 可以通过牺牲释放去除CMOS晶片的金属化层，以产生超声换能器的空腔。 剩余的层可以形成超声换能器的膜。