摘要:
Joint classification functionality is provided for natural language call routing (NLCR) or other type of natural language processing (NLP) application implemented in a communication system switch or other processor-based device. The processor-based device is configured to identify a plurality of words contained within a given communication, and to process the plurality of words utilizing a joint classifier. The joint classifier determines at least one category for the plurality of words based on application of a combination of word information and word class information to the plurality of words. Words and word classes utilized to provide the respective word information and word class information for use in the joint classifier may be selected using information gain based term selection.
摘要:
A method and apparatus for a planarizing or polishing article for Electrochemical Mechanical Planarization (ECMP) is disclosed. The polishing article is a pad assembly having a plurality of conductive domains and a plurality of abrasive domains on a processing surface. The abrasive domains and the conductive domains comprise a plurality of contact elements that are adapted to bias a semiconductor substrate while also providing abrasive qualities to enhance removal of material deposited on the substrate.
摘要:
Embodiments of a polishing article for processing a substrate are provided. In one embodiment, a polishing article for processing a substrate comprises a fabric layer having a conductive layer disposed thereover. The conductive layer has an exposed surface adapted to polish a substrate. The fabric layer may be woven or non-woven. The conductive layer may be comprised of a soft metal and, in one embodiment, the exposed surface may be planar.
摘要:
Embodiments of the invention generally provide a method and apparatus for processing a substrate in an electrochemical mechanical planarizing system. In one embodiment, a cell for polishing a substrate includes a processing pad disposed on a top surface of a platen assembly. A plurality of conductive elements are arranged in a spaced-apart relation across the upper planarizing surface and adapted to bias the substrate relative to an electrode disposed between the pad and the platen assembly. A plurality of passages are formed through the platen assembly between the top surface and a plenum defined within the platen assembly. In another embodiment, a system is provided having a bulk processing cell and a residual processing cell. The residual processing cell includes a biased conductive planarizing surface. In further embodiments, the conductive element is protected from attack by process chemistries.
摘要:
Compositions and methods for identifying nucleotide fragments that contain an open reading frame are provided. Compositions comprise a nucleotide sequence that encodes, in each of the three possible reading frames, an ATG start codon and a histidine tag, and vectors comprising such a nucleotide sequence. The vectors may be provided with cloning sites for insertion of nucleotide sequences of interest 5′ or 3′ to the 3-frame His-tag DNA sequence. Vectors also are provided with cloning sites for inserting nucleotide sequences of interest 3′ of the ATG start codon and 5′ of the 3-frame His-tag DNA sequence.
摘要:
Compositions and methods for identifying nucleotide fragments that contain an open reading frame are provided. Compositions comprise a nucleotide sequence that encodes histidine tags in each of the three possible reading frames and vectors comprising such a nucleotide sequence. The vectors may be provided with cloning sites for insertion of nucleotide sequences 5′ or 3′ to the 3-frame His-tag DNA sequence.
摘要:
The present invention relates to apparatus, procedures and compositions for avoiding and reducing damage to low dielectric constant materials and other soft materials, such as Cu and Al, used in fabricating semiconductor devices. Damage reduction can be achieved by decreasing the role of mechanical abrasion in the CMP of these materials and increasing the role of chemical polishing, which can also improve material removal rates. Increasing the role of chemical polishing can be accomplished by creating a polishing slurry, which contains components that interact chemically with the surface to be polished. This slurry may or may not also contain soft abrasive particles, which replace the hard abrasive particles of conventional slurries. Use of soft abrasive particles can reduce the role of mechanical abrasion in the CMP process. Use of this slurry in CMP can reduce surface scratches and device damage.
摘要:
A method for the “one-pot” synthesis of insulin derivatives wherein insulin is modified at the &agr;-amino group of the PheB1 residue is described. The method comprises protecting the &agr;-amino group of the GlyA1 residue and the &egr;-amino group of the LysB29 residue by reaction of insulin with a cyclic anhydride of a dicarboxylic acid in the presence of a tertiary amine. The protected insulin is then reacted with an activated hydrophilic compound, preferably an activated polyethylene glycol, resulting in a conjugate of the hydrophilic compound coupled to the PheB1 residue of insulin. The protecting groups are then removed from the conjugate under mild acidic conditions, and the resulting insulin derivative can be purified by conventional methods. Monosubstituted insulin derivatives wherein polyethylene glycol or derivatives thereof or glycosides are coupled to the PheB1 residue of insulin are also described.