公开(公告)号：US20050000801A1

公开(公告)日：2005-01-06

申请号：US10880752

申请日：2004-06-30

申请人： Yan Wang ,  Siew Neo ,  Feng Liu ,  Stan Tsai ,  Yongqi Hu ,  Alain Duboust ,  Antoine Manens ,  Ralph Wadensweiler ,  Rashid Mavliev ,  Liang-Yuh Chen ,  Donald Olgado ,  Paul Butterfield ,  Ming-Kuei Tseng ,  Shou-Sung Chang ,  Lizhong Sun

发明人： Yan Wang ,  Siew Neo ,  Feng Liu ,  Stan Tsai ,  Yongqi Hu ,  Alain Duboust ,  Antoine Manens ,  Ralph Wadensweiler ,  Rashid Mavliev ,  Liang-Yuh Chen ,  Donald Olgado ,  Paul Butterfield ,  Ming-Kuei Tseng ,  Shou-Sung Chang ,  Lizhong Sun

IPC分类号： B23H5/06 ,  B23H5/08 ,  B23H5/10 ,  B24B37/04 ,  B24B49/16 ,  B24B53/007 ,  B24D13/14 ,  H01L21/321 ,  C25D17/00

CPC分类号： B23H5/06 ,  B23H5/08 ,  B23H5/10 ,  B24B37/046 ,  B24B37/16 ,  B24B49/16 ,  B24B53/017 ,  H01L21/32125

摘要： Embodiments of the invention generally provide a method and apparatus for processing a substrate in an electrochemical mechanical planarizing system. In one embodiment, a cell for polishing a substrate includes a processing pad disposed on a top surface of a platen assembly. A plurality of conductive elements are arranged in a spaced-apart relation across the upper planarizing surface and adapted to bias the substrate relative to an electrode disposed between the pad and the platen assembly. A plurality of passages are formed through the platen assembly between the top surface and a plenum defined within the platen assembly. In another embodiment, a system is provided having a bulk processing cell and a residual processing cell. The residual processing cell includes a biased conductive planarizing surface. In further embodiments, the conductive element is protected from attack by process chemistries.

摘要翻译： 本发明的实施方案通常提供用于在电化学机械平面化系统中处理基底的方法和装置。 在一个实施例中，用于抛光衬底的单元包括设置在压板组件的顶表面上的处理衬垫。 多个导电元件跨过上平坦化表面以间隔的关系布置，并且适于相对于设置在垫和压板组件之间的电极偏压衬底。 多个通道通过压板组件形成在顶表面和限定在压板组件内的气室之间。 在另一个实施例中，提供了具有批处理单元和残余处理单元的系统。 残余处理单元包括偏置的导电平面化表面。 在另外的实施方案中，保护导电元件免受过程化学物质的侵蚀。

公开(公告)号：US07678245B2

公开(公告)日：2010-03-16

申请号：US10880752

申请日：2004-06-30

申请人： Yan Wang ,  Siew Neo ,  Feng Liu ,  Stan D. Tsai ,  Yongqi Hu ,  Alain Duboust ,  Antoine Manens ,  Ralph M. Wadensweiler ,  Rashid Mavliev ,  Liang-Yuh Chen ,  Donald J. K. Olgado ,  Paul D. Butterfield ,  Ming-Kuei Tseng ,  Shou-Sung Chang ,  Lizhong Sun

发明人： Yan Wang ,  Siew Neo ,  Feng Liu ,  Stan D. Tsai ,  Yongqi Hu ,  Alain Duboust ,  Antoine Manens ,  Ralph M. Wadensweiler ,  Rashid Mavliev ,  Liang-Yuh Chen ,  Donald J. K. Olgado ,  Paul D. Butterfield ,  Ming-Kuei Tseng ,  Shou-Sung Chang ,  Lizhong Sun

IPC分类号： C25B9/00

CPC分类号： B23H5/06 ,  B23H5/08 ,  B23H5/10 ,  B24B37/046 ,  B24B37/16 ,  B24B49/16 ,  B24B53/017 ,  H01L21/32125

摘要： Embodiments of the invention generally provide a method and apparatus for processing a substrate in an electrochemical mechanical planarizing system. In one embodiment, a cell for polishing a substrate includes a processing pad disposed on a top surface of a platen assembly. A plurality of conductive elements are arranged in a spaced-apart relation across the upper planarizing surface and adapted to bias the substrate relative to an electrode disposed between the pad and the platen assembly. A plurality of passages are formed through the platen assembly between the top surface and a plenum defined within the platen assembly. In another embodiment, a system is provided having a bulk processing cell and a residual processing cell. The residual processing cell includes a biased conductive planarizing surface. In further embodiments, the conductive element is protected from attack by process chemistries.

摘要翻译： 本发明的实施方案通常提供用于在电化学机械平面化系统中处理基底的方法和装置。 在一个实施例中，用于抛光衬底的单元包括设置在压板组件的顶表面上的处理衬垫。 多个导电元件跨过上平坦化表面以间隔的关系布置，并且适于相对于设置在垫和压板组件之间的电极偏压衬底。 多个通道通过压板组件形成在顶表面和限定在压板组件内的气室之间。 在另一个实施例中，提供了具有批处理单元和残余处理单元的系统。 残余处理单元包括偏置的导电平面化表面。 在另外的实施方案中，保护导电元件免受过程化学物质的侵蚀。

公开(公告)号：US20050284770A1

公开(公告)日：2005-12-29

申请号：US11215254

申请日：2005-08-30

申请人： Paul Butterfield ,  Liang-Yuh Chen ,  Yonqi Hu ,  Antoine Manens ,  Rashid Mavliev ,  Stan Tsai ,  Feng Liu ,  Ralph Wadensweiler ,  Lizhong Sun ,  Siew Neo ,  Alain Duboust

发明人： Paul Butterfield ,  Liang-Yuh Chen ,  Yonqi Hu ,  Antoine Manens ,  Rashid Mavliev ,  Stan Tsai ,  Feng Liu ,  Ralph Wadensweiler ,  Lizhong Sun ,  Siew Neo ,  Alain Duboust

IPC分类号： B23H5/00 ,  B23H5/06 ,  B23H5/08 ,  B23H5/10 ,  B24B37/04 ,  B24B49/16 ,  B24B53/007 ,  B24D13/14 ,  C25D17/00 ,  C25D17/10 ,  H01L21/321

CPC分类号： B23H5/06 ,  B23H5/08 ,  B23H5/10 ,  B24B37/046 ,  B24B37/11 ,  B24B37/22 ,  B24B37/24 ,  B24B37/26 ,  B24B49/16 ,  B24B53/017 ,  C25D17/10 ,  H01L21/32125

摘要： Embodiments of a polishing article for polishing a substrate are provided. In one embodiment, the polishing article includes a ring-shaped upper layer having a polishing surface, and a conductive layer coupled to the upper layer and forming a replaceable assembly therewith.

摘要翻译： 提供了用于研磨衬底的抛光制品的实施例。 在一个实施例中，抛光制品包括具有抛光表面的环形上层，以及耦合到上层并与其形成可更换组件的导电层。

公开(公告)号：US20080026681A1

公开(公告)日：2008-01-31

申请号：US11868829

申请日：2007-10-08

申请人： PAUL BUTTERFIELD ,  Liang-Yuh Chen ,  Yonqi Hu ,  Antoine Manens ,  Rashid Mavliev ,  Stan Tsai ,  Feng Liu ,  Ralph Wadensweiler ,  Lizhong Sun ,  Siew Neo ,  Alain Duboust

发明人： PAUL BUTTERFIELD ,  Liang-Yuh Chen ,  Yonqi Hu ,  Antoine Manens ,  Rashid Mavliev ,  Stan Tsai ,  Feng Liu ,  Ralph Wadensweiler ,  Lizhong Sun ,  Siew Neo ,  Alain Duboust

IPC分类号： B24B29/00

CPC分类号： B23H5/06 ,  B23H5/08 ,  B23H5/10 ,  B24B37/046 ,  B24B37/11 ,  B24B37/22 ,  B24B37/24 ,  B24B37/26 ,  B24B49/16 ,  B24B53/017 ,  C25D17/10 ,  H01L21/32125

摘要： Embodiments of a polishing article for polishing a substrate are provided. In one embodiment, the polishing article includes an annular upper layer made of a dielectric material coupled to an annular lower layer made of a conductive material, and an annular subpad sandwiched between the annular upper layer and the annular lower layer forming a replaceable assembly therewith.

摘要翻译： 提供了用于研磨衬底的抛光制品的实施例。 在一个实施例中，抛光制品包括由与由导电材料制成的环形下层耦合的电介质材料制成的环形上层，以及夹在环形上层和环形下层之间的环形子垫，其与之形成可更换组件。

公开(公告)号：US20050133363A1

公开(公告)日：2005-06-23

申请号：US11031545

申请日：2005-01-08

申请人： Yongqi Hu ,  Yan Wang ,  Alain Duboust ,  Feng Liu ,  Antoine Manens ,  Siew Neo ,  Stan Tsai ,  Liang-Yuh Chen ,  Paul Butterfield ,  Yuan Tian ,  Sen-Hou Ko

发明人： Yongqi Hu ,  Yan Wang ,  Alain Duboust ,  Feng Liu ,  Antoine Manens ,  Siew Neo ,  Stan Tsai ,  Liang-Yuh Chen ,  Paul Butterfield ,  Yuan Tian ,  Sen-Hou Ko

IPC分类号： B23H5/08 ,  B23H5/10 ,  B24B37/04 ,  B24B53/007 ,  B24D13/14 ,  H01L21/321 ,  C25D17/00

CPC分类号： B82Y30/00 ,  B23H5/08 ,  B23H5/10 ,  B24B37/046 ,  B24B37/14 ,  B24B37/16 ,  B24B37/205 ,  B24B37/22 ,  B24B37/24 ,  B24B37/26 ,  B24B53/017 ,  H01L21/32125 ,  Y10T428/249924

摘要： Embodiments of a polishing article for processing a substrate are provided. In one embodiment, a polishing article for processing a substrate comprises a fabric layer having a conductive layer disposed thereover. The conductive layer has an exposed surface adapted to polish a substrate. The fabric layer may be woven or non-woven. The conductive layer may be comprised of a soft metal and, in one embodiment, the exposed surface may be planar.

摘要翻译： 提供了用于处理基板的抛光制品的实施例。 在一个实施例中，用于处理衬底的抛光制品包括其上设置有导电层的织物层。 导电层具有适于抛光衬底的暴露表面。 织物层可以是编织的或非织造的。 导电层可以由软金属构成，并且在一个实施例中，暴露的表面可以是平面的。

公开(公告)号：US20070099552A1

公开(公告)日：2007-05-03

申请号：US11555145

申请日：2006-10-31

申请人： Liang-Yuh Chen ,  Yuchun Wang ,  Yan Wang ,  Alain Duboust ,  Daniel Carl ,  Ralph Wadensweiler ,  Manoocher Birang ,  Paul Butterfield ,  Rashid Mavliev ,  Stan Tsai ,  You Wang ,  Jie Diao ,  Renhe Jia ,  Lakshmanan Karuppiah ,  Robert Ewald

发明人： Liang-Yuh Chen ,  Yuchun Wang ,  Yan Wang ,  Alain Duboust ,  Daniel Carl ,  Ralph Wadensweiler ,  Manoocher Birang ,  Paul Butterfield ,  Rashid Mavliev ,  Stan Tsai ,  You Wang ,  Jie Diao ,  Renhe Jia ,  Lakshmanan Karuppiah ,  Robert Ewald

IPC分类号： B23F21/03

CPC分类号： B24B37/046 ,  B24B27/0023 ,  B24B37/24 ,  B24B37/26 ,  B24D3/34 ,  B82Y30/00

摘要： An article of manufacture and apparatus are provided for processing a substrate surface. In one aspect, an article of manufacture is provided for polishing a substrate including polishing article comprising a body having at least a partially conductive polishing surface. An electrode is disposed below the polishing surface having a dielectric material therebetween. A plurality of apertures may be formed in the polishing surface and the dielectric material to at least partially expose the electrode to the polishing surface. A membrane may be disposed between the electrode and the polishing surface that is permeable to ions and current to promote continuity between the electrode and the polishing surface.

摘要翻译： 提供了一种用于处理基板表面的制造和设备。 在一个方面，提供了一种用于抛光衬底的制品，所述衬底包括具有至少部分导电的抛光表面的主体的抛光制品。 电极设置在其间具有介电材料的抛光表面下方。 可以在抛光表面和电介质材料中形成多个孔，以至少部分地将电极暴露于抛光表面。 可以在电极和抛光表面之间设置膜，其可透过离子和电流，以促进电极和抛光表面之间的连续性。

公开(公告)号：US20070066201A1

公开(公告)日：2007-03-22

申请号：US11556011

申请日：2006-11-02

申请人： Liang-Yuh Chen ,  Yuchun Wang ,  Yan Wang ,  Alain Duboust ,  Daniel Carl ,  Ralph Wadensweiler ,  Manoocher Birang ,  Paul Butterfield ,  Rashid Mavliev ,  Stan Tsai

发明人： Liang-Yuh Chen ,  Yuchun Wang ,  Yan Wang ,  Alain Duboust ,  Daniel Carl ,  Ralph Wadensweiler ,  Manoocher Birang ,  Paul Butterfield ,  Rashid Mavliev ,  Stan Tsai

IPC分类号： B23F21/03

CPC分类号： B82Y30/00 ,  B24B37/046 ,  B24B37/24 ,  B24B37/26 ,  B24D3/34

摘要： An article of manufacture and apparatus are provided for planarizing a substrate surface. In one aspect, an article of manufacture is provided for polishing a substrate including polishing article comprising a body having at least a partially conductive surface adapted to polish the substrate. A plurality of perforations may be formed in the polishing article for flow of material therethrough. An electrode is also exposed to the polishing surface by at least a portion of the plurality of perforations. The article of manufacture may also include a polishing surface having a plurality of grooves, wherein a portion of the plurality of grooves intersect with a portion of the plurality of perforations.

摘要翻译： 提供了一种用于平坦化基板表面的制造和设备。 在一个方面，提供了一种用于抛光衬底的制品，所述衬底包括抛光制品，所述抛光制品包括具有适于抛光所述衬底的至少部分导电表面的主体。 可以在抛光制品中形成多个穿孔，以使材料流过其中。 电极还通过多个穿孔的至少一部分暴露于抛光表面。 制品还可以包括具有多个凹槽的抛光表面，其中多个凹槽的一部分与多个穿孔的一部分相交。

公开(公告)号：US20060172671A1

公开(公告)日：2006-08-03

申请号：US11393220

申请日：2006-03-30

申请人： Liang-Yuh Chen ,  Yuchun Wang ,  Yan Wang ,  Alain Duboust ,  Daniel Carl ,  Ralph Wadensweiler ,  Manoocher Birang ,  Paul Butterfield ,  Rashid Mavliev ,  Stan Tsai

发明人： Liang-Yuh Chen ,  Yuchun Wang ,  Yan Wang ,  Alain Duboust ,  Daniel Carl ,  Ralph Wadensweiler ,  Manoocher Birang ,  Paul Butterfield ,  Rashid Mavliev ,  Stan Tsai

IPC分类号： B23F21/03

CPC分类号： B82Y30/00 ,  B24B37/046 ,  B24B37/24 ,  B24B37/26 ,  B24D3/34

摘要： An article of manufacture and apparatus are provided for planarizing a substrate surface. In one aspect, an article of manufacture is provided for polishing a substrate including polishing article comprising a body having at least a partially conductive surface adapted to polish the substrate and a mounting surface. A plurality of perforations may be formed in the polishing article for flow of material therethrough. In another aspect, a polishing article for polishing a substrate includes a body having a polishing surface and a conductive element disposed therein. The conductive element may have a contact surface that extends beyond a plane defined by the polishing surface. The polishing surface may have one or more pockets formed therein. The conductive element may be disposed in each of the polishing pockets.

公开(公告)号：US20070295611A1

公开(公告)日：2007-12-27

申请号：US11764726

申请日：2007-06-18

申请人： FENG LIU ,  Stan Tsai ,  Yongqi Hu ,  Siew Neo ,  Yan Wang ,  Alain Duboust ,  Liang-Yuh Chen

发明人： FENG LIU ,  Stan Tsai ,  Yongqi Hu ,  Siew Neo ,  Yan Wang ,  Alain Duboust ,  Liang-Yuh Chen

IPC分类号： B23H9/00 ,  B23H7/00

CPC分类号： B23H7/08 ,  B23H1/022 ,  B23H1/06

摘要： Polishing compositions and methods for removing conductive materials from a substrate surface are provided. In one aspect, a composition includes an acid based electrolyte system, one or more chelating agents, one or more corrosion inhibitors, one or more inorganic or organic acid salts, one or more pH adjusting agents to provide a pH between about 2 and about 10, a polishing enhancing material selected from the group of abrasive particles, one or more oxidizers, and combinations thereof, and a solvent. The composition may be used in an conductive material removal process including disposing a substrate having a conductive material layer formed thereon in a process apparatus comprising an electrode, providing the composition between the electrode and substrate, applying a bias between the electrode and the substrate, and removing conductive material from the conductive material layer. The ECMP polishing compositions and methods described herein improve the effective removal rate of materials from the substrate surface, such as copper, with a reduction in planarization type defects and yielding a desirable surface finish.

摘要翻译： 提供了抛光组合物和从衬底表面去除导电材料的方法。 一方面，组合物包括酸性电解质体系，一种或多种螯合剂，一种或多种腐蚀抑制剂，一种或多种无机或有机酸盐，一种或多种pH调节剂，以提供约2至约10 ，选自磨料颗粒，一种或多种氧化剂及其组合的研磨增强材料和溶剂。 该组合物可用于导电材料去除工艺中，包括在包括电极的处理设备中设置其上形成有导电材料层的衬底，在电极和衬底之间提供组合物，在电极和衬底之间施加偏压，以及 从导电材料层去除导电材料。 本文所述的ECMP抛光组合物和方法提高了材料从衬底表面（例如铜）的有效去除速率，同时平坦化型缺陷减少并产生理想的表面光洁度。

公开(公告)号：US20070111638A1

公开(公告)日：2007-05-17

申请号：US11562320

申请日：2006-11-21

申请人： SHOU-SUNG CHANG ,  Stan Tsai ,  Donald Olgado ,  Liang-Yuh Chen ,  Alain Duboust ,  Ralph Wadensweiler

发明人： SHOU-SUNG CHANG ,  Stan Tsai ,  Donald Olgado ,  Liang-Yuh Chen ,  Alain Duboust ,  Ralph Wadensweiler

IPC分类号： B24B51/00

CPC分类号： B24B37/22 ,  B23H5/06 ,  B23H5/08 ,  B23H5/10 ,  B24B37/046 ,  B24B37/11 ,  B24B37/24 ,  B24B37/26 ,  B24B49/16 ,  B24B53/017 ,  C25D17/10 ,  H01L21/32125

摘要： Embodiments of a pad assembly for processing a substrate are provided. The pad assembly includes a processing layer having a working surface adapted to process a substrate, a lower layer coupled to and disposed below the processing layer, and an electrode having an upper surface disposed above the lower layer and below the working surface of the processing layer. The upper surface of the electrode is at least partially exposed to the working surface by a plurality of apertures to provide an electrolyte pathway between the upper surface of the electrode and the working surface of the pad assembly.

摘要翻译： 提供了用于处理基板的垫组件的实施例。 焊盘组件包括处理层，其具有适于处理衬底的工作表面，耦合到处理层的下层并设置在处理层下面的工作表面;以及电极，具有设置在处理层的工作表面下方的下表面上方的上表面 。 电极的上表面通过多个孔至少部分地暴露于工作表面，以在电极的上表面和焊盘组件的工作表面之间提供电解质通路。