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公开(公告)号：US20160339537A1
公开(公告)日：2016-11-24
申请号：US15111533
申请日：2014-02-12
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor： Kuan-Ting Wu , YU-CHUAN KANG
CPC classification number: B23K20/023 , B21D22/022 , B21D51/16 , B23K20/16 , B23K2101/36 , B23K2103/10 , B23K2103/15
Abstract: A method of forming a casing of an electronic device is described in which heat and pressure are applied to a metal substrate and a metal layer in a molding device. The metal substrate and the metal layer are molded into a shape of the casing. At the same time, an intermediate phase between the metal substrate and the metal layer is formed by inter-diffusion bonding.
Abstract translation: 描述了一种形成电子装置的壳体的方法，其中在模制装置中的金属基底和金属层上施加热和压力。 将金属基板和金属层模制成壳体的形状。 同时，通过相互扩散接合形成金属基板和金属层之间的中间相。
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公开(公告)号：US20160252096A1
公开(公告)日：2016-09-01
申请号：US14632548
申请日：2015-02-26
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor： Chienlung Yang , Kuan-Ting Wu
IPC: F04D19/02
CPC classification number: F04D17/04 , F04D17/127 , F04D25/0613 , F05B2250/312 , F05B2250/36 , F05B2260/4031 , F05D2250/312 , F05D2250/36 , F05D2260/4031
Abstract: Example implementations relate to a fan module. The fan module may include an outer impeller having a first plurality of radial blades arranged between an inner circumference of the outer impeller and an outer circumference of the outer impeller. The outer impeller may be rotatable about a first axis of rotation. The fan module may include an inner impeller having a second plurality of radial blades, the inner impeller disposed within the inner circumference of the outer impeller and rotatable about a second axis of rotation.
Abstract translation: 示例实现涉及风扇模块。 风扇模块可以包括具有布置在外叶轮的内圆周与外叶轮的外圆周之间的第一多个径向叶片的外叶轮。 外部叶轮可以围绕第一旋转轴线旋转。 风扇模块可以包括具有第二多个径向叶片的内叶轮，内叶轮设置在外叶轮的内圆周内并可围绕第二旋转轴线旋转。
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公开(公告)号：US12125460B1
公开(公告)日：2024-10-22
申请号：US18352003
申请日：2023-07-13
Applicant: Hewlett-Packard Development Company, L.P.
Inventor： Hsing-Hung Hsieh , Cheng-Chien Chen , Kuan-Ting Wu
IPC: G09G5/391
CPC classification number: G09G5/391 , G09G2330/021 , G09G2340/0435
Abstract: A system that can intelligently help a user judge the resolution requirement of the image content. In an example, the display panel can show in different virtual resolutions or the system can automatically judge whether the image content requires high or low resolution using a similarity judgement. The system can then inform the display panel what virtual resolution should be shown or what the optimal resolution is using the similarity judgment and send the image content to the display panel with that resolution.
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公开(公告)号：US12118944B2
公开(公告)日：2024-10-15
申请号：US17997086
申请日：2020-05-15
Applicant: Hewlett-Packard Development Company, L.P.
Inventor： Hsing-Hung Hsieh , Super Liao , Kuan-Ting Wu
IPC: G09G3/3258
CPC classification number: G09G3/3258 , G09G2310/0213
Abstract: In examples, an electronic device comprises a camera and a display having a transparent area aligned with the camera. The display comprises a first line corresponding to a pixel row or column of the display, the first line extending from a first end of the display to the transparent area. The display comprises a second line corresponding to the pixel row or column and extending from a second end of the display to the transparent area, the first and second lines separated by a gap. The electronic device includes a controller coupled to the display, the controller to drive the first and second lines consecutively.
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公开(公告)号：US12054654B2
公开(公告)日：2024-08-06
申请号：US17424002
申请日：2019-05-15
Applicant: Hewlett-Packard Development Company, L.P.
Inventor： Kuan-Ting Wu , Super Liao , Chung-Hua Ku
CPC classification number: C09J7/35 , C09J7/385 , C09J2203/318 , C09J2301/162 , C09J2301/302 , C09J2301/304 , C09J2400/163 , C09J2433/00 , C09J2475/00 , C09J2477/00
Abstract: The present disclosure is drawn to re-workable adhesives for electronic devices. In one example, a re-workable adhesive for an electronic device can include a hot-melt adhesive present in an amount from about 60 wt % to about 90 wt % with respect to the total weight of the re-workable adhesive. The hot-melt adhesive can have a reduced bond strength at an elevated temperature. The re-workable adhesive can also include a pressure-sensitive adhesive present in an amount from about 10 wt % to about 40 wt % with respect to the total weight of the re-workable adhesive, wherein the pressure-sensitive adhesive has a higher bond strength compared to the hot-melt adhesive when at the elevated temperature.
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Patent Agency Ranking
公开(公告)号：US20240168332A1
公开(公告)日：2024-05-23
申请号：US18428631
申请日：2024-01-31
Applicant: Hewlett-Packard Development Company, L.P.
Inventor： Hsing-Hung Hsieh , Kuan-Ting Wu , Chi-Hao Chang
IPC: G02F1/13357 , G02F1/1335 , G02F1/1337 , G02F1/1343 , G02F1/1368 , G02F1/137 , H10N30/20
CPC classification number: G02F1/133606 , G02F1/133514 , G02F1/133528 , G02F1/1337 , G02F1/134309 , G02F1/1368 , G02F1/137 , H10N30/206
Abstract: Examples of light source distance alterations are described herein. An example device for providing light source distance alterations can include a display that includes a light source coupled to a piezo material to alter a distance between the light source and a corresponding aperture of an aperture layer.
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公开(公告)号：US20230222980A1
公开(公告)日：2023-07-13
申请号：US17997086
申请日：2020-05-15
Applicant: Hewlett-Packard Development Company, L.P.
Inventor： Hsing-Hung Hsieh , Super Liao , Kuan-Ting Wu
IPC: G09G3/3258
CPC classification number: G09G3/3258 , G09G2310/0213
Abstract: In examples, an electronic device comprises a camera and a display having a transparent area aligned with the camera. The display comprises a first line corresponding to a pixel row or column of the display, the first line extending from a first end of the display to the transparent area. The display comprises a second line corresponding to the pixel row or column and extending from a second end of the display to the transparent area, the first and second lines separated by a gap. The electronic device includes a controller coupled to the display, the controller to drive the first and second lines consecutively.
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公开(公告)号：US20230031605A1
公开(公告)日：2023-02-02
申请号：US17788361
申请日：2020-01-08
Applicant: Hewlett-Packard Development Company, L.P.
Inventor： Kuan-Ting Wu , Chi Hao Chang , Chien-Ting Lin
Abstract: This application describes covers for electronic devices, electronic devices, and methods for making the covers. In one example, described herein is a cover for an electronic device comprising: a substrate comprising a metal; a passivation layer or a micro-arc oxidation layer deposited on at least one surface of the substrate; a primer coating layer on the passivation layer or the micro-arc oxidation layer; an optional base coating layer on the primer coating layer; a top coating layer on the optional base coating layer or on the primer coating layer; and a hydrophobic coating layer.
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公开(公告)号：US11523102B2
公开(公告)日：2022-12-06
申请号：US16770477
申请日：2017-12-06
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor： Kuan-Ting Wu , Wei-Chung Chen , Hsing-Hung Hsieh
Abstract: In example implementations, an apparatus is provided. The apparatus includes a movable light emitting diode (LED) base. A plurality of LED arrays is coupled to the movable LED base. The apparatus includes a grid that includes a plurality of walls. The grid is positioned such that each LED array of the plurality of LED arrays is adjacent to a wall of the plurality of walls.
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公开(公告)号：US20220349082A1
公开(公告)日：2022-11-03
申请号：US17296931
申请日：2019-08-12
Applicant: Hewlett-Packard Development Company, L.P.
Inventor： Qingyong Guo , Ya Cheng Chuang , Yong-Jun Li , Kuan-Ting Wu
Abstract: A coated metal alloy substrate, a process for producing a coated metal alloy substrate, and an electronic device having a housing comprising a coated metal alloy substrate are described. The coated metal alloy substrate comprises an electrolytic sealing layer on the metal alloy substrate, and an electrophoretic deposition layer deposited on the electrolytic sealing layer.
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