THERMALLY CONDUCTIVE SILICONE COMPOSITION AND METHOD FOR PRODUCING SAME

    公开(公告)号:US20210253927A1

    公开(公告)日:2021-08-19

    申请号:US16972726

    申请日:2019-05-28

    发明人: Nobuhiro ICHIROKU

    摘要: The present invention provides a thermally conductive silicone composition which contains: an organopolysiloxane which is a reaction product obtained by reacting (A) an organopolysiloxane having an alkenyl group bonded to a silicon atom and (B) an organohydrogen polysiloxane with each other at a molar ratio of the Si—H group in the component (B) to the alkenyl group bonded to a silicon atom in the component (A), namely (Si—H/Si-Vi) of 2.0-9.0; (C) an inorganic filler which is selected from among metal oxides and metal nitrides, and which has an average particle diameter of 3 μm or less; and (D) a thermally conductive inorganic filler which has an average particle diameter of 5 μm or more. This thermally conductive silicone composition has excellent displacement resistance and excellent coatability by setting the total of the component (C) and the component (D) to 200-6,000 parts by mass relative to 100 parts by mass of the total of the component (A) and the component (B), and having an absolute viscosity at 25° C. of 100-800 Pa·s. The present invention also provides a method for producing this thermally conductive silicone composition.

    Thermally conductive silicone rubber composite sheet

    公开(公告)号:US11077647B2

    公开(公告)日:2021-08-03

    申请号:US16313795

    申请日:2017-07-12

    摘要: Provided is an inexpensive thermally conductive silicone rubber composite sheet. The thermally conductive silicone rubber composite sheet of the invention includes a laminated structure body comprised of an intermediate layer and an outer layer laminated on both surfaces of the intermediate layer, in which
    (A) the intermediate layer is an electrical insulating synthetic resin film layer having a thermal conductivity of not lower than 0.20 W/m·K and a tensile elastic modulus of not lower than 5 GPa, and
    (B) the outer layer is a silicone rubber layer of a cured product of a composition containing: (a) an organopolysiloxane; (b) a curing agent; (c) a thermally conductive filler; and (d) a silicon compound-based adhesion imparting agent having at least one kind of group selected from the group consisting of an epoxy group, an alkoxy group, a methyl group, a vinyl group and a Si—H group.

    HIGH EFFICIENCY SOLAR CELL AND METHOD FOR MANUFACTURING HIGH EFFICIENCY SOLAR CELL

    公开(公告)号:US20210226080A1

    公开(公告)日:2021-07-22

    申请号:US17222281

    申请日:2021-04-05

    摘要: A solar cell including a semiconductor substrate having a first conductivity type an emitter region, having a second conductivity type opposite to the first conductivity type, on a first main surface of the semiconductor substrate an emitter electrode which is in contact with the emitter region a base region having the first conductivity type a base electrode which is in contact with the base region and an insulator film for preventing an electrical short-circuit between the emitter region and the base region, wherein the insulator film is made of a polyimide, and the insulator film has a C6H11O2 detection count number of 100 or less when the insulator film is irradiated with Bi5++ ions with an acceleration voltage of 30 kV and an ion current of 0.2 pA by a TOF-SIMS method. The solar cell can have excellent weather resistance and high photoelectric conversion characteristics.

    Method of transferring device layer to transfer substrate and highly thermal conductive substrate

    公开(公告)号:US11069560B2

    公开(公告)日:2021-07-20

    申请号:US16346176

    申请日:2017-10-13

    IPC分类号: H01L21/762 H01L21/683

    摘要: A method of transferring a device layer in a SOI wafer obtained by stacking a Si layer, an insulator layer, and the device layer to a transfer substrate, includes a step of temporarily bonding a surface on which the device layer is formed of the SOI wafer to a supporting substrate using an adhesive for temporary bonding, a step of removing the Si layer of the SOI wafer until the insulator layer is exposed and obtaining a thinned device wafer, a step of coating only the transfer substrate with an adhesive for transfer and then bonding the insulator layer in the thinned device wafer to the transfer substrate via the adhesive for transfer, a step of thermally curing the adhesive for transfer under a load at the same time as or after bonding, a step of peeling off the supporting substrate, and a step of removing the adhesive.

    Photomask blank and making method
    139.
    发明授权

    公开(公告)号:US11061319B2

    公开(公告)日:2021-07-13

    申请号:US15996926

    申请日:2018-06-04

    IPC分类号: G03F1/38 G03F1/84

    摘要: A photomask blank is processed into a transmissive photomask for use in photolithography for forming a pattern on a recipient using exposure light. The photomask blank comprises a transparent substrate, a first film of a material which is etchable by chlorine/oxygen-based dry etching, and a second film of a silicon-containing material. The second film includes a layer having a refractive index n of at least 1.6 or an extinction coefficient k of at least 0.3 with respect to the wavelength of inspection light which is longer than the exposure light.

    Outer blade cutting wheel and making method

    公开(公告)号:US11052511B2

    公开(公告)日:2021-07-06

    申请号:US16001585

    申请日:2018-06-06

    发明人: Harukazu Maegawa

    IPC分类号: B24D5/12 B24D18/00 B28D1/12

    摘要: An outer blade cutting wheel is provided comprising an annular thin disc base and a blade section of bonded abrasive grains on the periphery of the base. Provided that an imaginary range is delineated by two imaginary planes extending parallel to the planar surfaces of the base and tangent to widthwise side portions of the blade section and two imaginary circumferences defined about the rotational axis and extending tangent to inner and outer perimeters of the blade section, the blade section occupies 10-40% by volume of the imaginary range minus the region of the base, and the widthwise side portions of the blade section have a dented shape relative to the imaginary planes. The cutting wheel is capable of cutoff machining at a high feed speed while maintaining a high accuracy and a low cutting load.