Abstract:
A method for manufacturing a printed circuit board assembled panel by a simple process with an excellent material yield and a high conforming product rate. Unit printed circuit boards previously manufactured are arranged in a frame in a prescribed relationship. Then, the printed circuit boards are fixed to one another, and the printed circuit board and the frame body are fixed to one another.
Abstract:
A computer-readable recording medium has an entry support program embodied therein for causing a computer to perform detecting text being entered, extracting text examples corresponding to the detected text from a storage unit, the storage unit storing text examples and frequencies of use of the text examples such that the frequencies of use are associated with the respective text examples, classifying the extracted text examples into text-example groups each containing one or more text examples based on comparison of letters included in the extracted text examples, determining display order of the text-example groups, based on the frequencies of use that are associated in the storage unit with text examples belonging to the text-example groups, and displaying the extracted text examples in the determined display order.
Abstract:
A variation simulation system providing for facilitated circuit design with suppressed deterioration in performance otherwise caused by variations. A variation analysis unit 100 extracts statistical features of variations from a large number of samples beforehand. A model analysis unit 200 checks response of a circuit simulation output to parameter variations. A fitting execution unit 300 collates the information, obtained in this manner, to each other to determine the manner of variations of the parameters which will reproduce statistical features of the device samples.
Abstract:
A semiconductor device is provided with an SRAM cell unit. The SRAM cell unit is provided with a data storing section composed of a pair of drive transistors and a pair of load transistors; a data write section composed of a pair of access transistors; and a data read section composed of an access transistor and a drive transistor. Each of the transistors is provided with a semiconductor layer protruding from a base plane; a gate electrode extending on the both facing side planes over the semiconductor layer from above; a gate insulating film between a gate electrode and a semiconductor layer; and a source/drain region. Each semiconductor layer is arranged to have its longitudinal direction along a first direction. In the adjacent SRAM cell units in the first direction, all the corresponding transistors have the semiconductor layer of one transistor on a center line which is along the first direction of the semiconductor layer of the other transistor.
Abstract:
A rigid-flexible board and a method for manufacturing the same can be provided, whereby the material yield ratio can be enhanced and the productive yield can be also enhanced. A rigid board with a step for connection and a flexible board with a connector at the edge thereof are formed independently. Then, the connecting area is spot facing processed so that the depth of the thus obtained depressed portion is equal to or lower than the thickness of the flexible board. The connector of the flexible board is electrically connected to the vertical wiring area of the depressed portion.
Abstract:
A sheet plasma film forming apparatus includes: a pressure reducing container; a plasma gun; an anode; plasma flowing means; a sheet plasma converting chamber as part of the pressure reducing container; a pair of permanent magnets which forms a sheet-shaped plasma; and a film forming chamber as a part of the pressure reducing container. The pressure reducing container includes first and second bottle neck portions that are openings of the film forming chamber formed such that the plasma flows from the sheet plasma converting chamber through the first bottle neck portion to the film forming chamber, and the flown sheet-shaped plasma flows through the second bottle neck portion to the anode. In the thickness direction of the sheet-shaped plasma, a size of the first and second bottle neck portions is smaller than an internal size of the film forming chamber.
Abstract:
A π gate FinFET structure having reduced variations in off-current and parasitic capacitance and a method for production thereof are provided. The structure of an element is improved so that an off-current suppressing capability can be exhibited more strongly. A field effect transistor, wherein a first insulating film and a semiconductor region are provided so as to protrude upward with respect to the flat surface of a base, the field effect transistor has a gate electrode, a gate insulating film and a source/drain region, and a channel is formed at least on the side surface of the semiconductor region, wherein that the first insulating film is provided on an etch stopper layer composed of a material having an etching rate lower than at least the lowermost layer of the first insulating film for etching under a predetermined condition.
Abstract:
A variation simulation system providing for facilitated circuit design with suppressed deterioration in performance otherwise caused by variations. A variation analysis unit 100 extracts statistical features of variations from a large number of samples beforehand. A model analysis unit 200 checks response of a circuit simulation output to parameter variations. A fitting execution unit 300 collates the information, obtained in this manner, to each other to determine the manner of variations of the parameters which will reproduce statistical features of the device samples.
Abstract:
There is provided a semiconductor device comprising an n-type and a p-type field effect transistors, meeting the conditions that in terms of a crystal orientation of the protruding semiconductor region constituting the n-type field effect transistor, its plane parallel to the substrate is substantially a {100} plane and its side surface is a {100} plane substantially orthogonal to the {100} plane, and that in terms of a crystal orientation of the protruding semiconductor region constituting the p-type field effect transistor, its plane parallel to the substrate is substantially a {100} plane and its side surface is a {110} plane substantially orthogonal to the {100} plane.