Abstract:
A semiconductor device with an OTP memory cell includes a first MOS transistor having a first gate terminal connected to a first line, and a first terminal connected to a first node, a second MOS transistor having a second gate terminal connected to a second line, and a first terminal connected to the first node, and a third MOS transistor having a gate terminal connected to a three line, and a first terminal of the third MOS transistor connected to the first node.
Abstract:
A liquid crystal display including a first substrate; a second substrate facing the first substrate; a thin film transistor disposed on the first substrate; an organic layer disposed on the thin film transistor; a pixel electrode disposed on the organic layer; a lower alignment layer disposed on the pixel electrode; a common electrode disposed on the second substrate; and an upper alignment layer disposed on the common electrode, wherein a first free radical included in the organic layer and a second free radical included in at least one of the lower alignment layer and the upper alignment layer are radical bonded.
Abstract:
Disclosed herein is a semiconductor package, including: a first heat dissipation substrate; a first lead frame that is formed on the first heat dissipation substrate by patterning; a first semiconductor device formed on the first lead frame; a second semiconductor device that is stacked on the first semiconductor device; a second lead frame that is patterned and bonded to the second semiconductor device; and a second heat dissipation substrate formed on the first lead frame.
Abstract:
Disclosed herein is a method of manufacturing a build-up printed circuit board (PCB), the method including: providing a first resin substrate; forming a roughness by coating an epoxy emulsion solution on a surface of the first resin substrate; and providing a core layer by forming a core circuit layer on the first resin substrate on which the roughness is formed. According to the present invention, roughness of a substrate can be formed in an environment-friendly and economical way by introducing a process of coating epoxy emulsion on a resin substrate. Further, a highly reliable fine circuit can be implemented by enhancing an adhesive bond between a build-up board material and a metal circuit layer.
Abstract:
There is provided an even-level inverter, including: a voltage-dividing circuit dividing input DC power into an even number of voltage levels; a plurality of switching devices connected to individual nodes of the voltage-dividing circuit having the even number of voltage levels; and a bidirectional switching device connected to the individual nodes of the voltage-dividing circuit through at least one of the plurality of switching devices and including at least two transistors. According to the present invention, the bidirectional switching device is implemented without a diode to thereby reduce conduction loss caused due to an anti-parallel diode included in the related art bidirectional switching device, and a neutral point of the voltage-dividing circuit is electrically separated from the switching devices to thereby control reactive power.
Abstract:
A semiconductor device with OTP memory cell includes a first switching unit for transferring a first bias voltage, a first MOS transistor having a first gate coupled to a first gate signal and a first terminal coupled to the first bias voltage by the first switching unit, and a second switching unit for coupling a second terminal of the first MOS transistor to a first bit line.
Abstract:
The present invention relates to a system for authentication management of a sensor node having a subscription processing function, and a method for operating the system. Upon receiving information about a sensor node allocated with an IP address, the system supports the access of only authorized user equipment to a corresponding sensor node, which blocking any direct access of unauthorized user equipment to the sensor node, thereby strengthening the security of the sensor node. According to the present invention, a relay server receives subscription information from user equipment. The relay server checks permission validity of corresponding user equipment. If the user equipment has a valid permission, the relay server transmits the subscription information to a sensor node, and transmits subscription acceptance information to the user equipment. Then the sensor node transmits the collected and stored information to the user equipment having a valid permission.
Abstract:
The present invention provides a radiant heat substrate comprising: a conductive substrate which is formed of a metal material and includes a front surface having a luminous element mounted thereon and a rear surface opposed to the front surface; an insulating film which covers the front surface of the conductive substrate; a metal oxide film which covers the rear surface of the conductive substrate; and a metal pattern which covers the insulating film, wherein the metal pattern comprises: a heat transfer pad which is bonded to the luminous element; and a circuit line which is disposed at a region except from the mounting region of the luminous element and is electrically connected to the luminous element.
Abstract:
Disclosed are new compound semiconductors which may be used for solar cells or as thermoelectric materials, and their application. The compound semiconductor may be represented by a chemical formula: InxMyCo4-mAmSb12-n-zXnTez, where M is at least one selected from the group consisting of Ca, Sr, Ba, Ti, V, Cr, Mn, Cu, Zn, Pd, Ag, Cd, Sc, Y, La, Ce, Pr, Nd, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb and Lu, A is at least one selected from the group consisting of Fe, Ni, Ru, Rh, Pd, Ir and Pt, X is at least one selected from the group consisting of Si, Ga, Ge and Sn, 0
Abstract translation:公开了可用于太阳能电池或作为热电材料的新型化合物半导体及其应用。 化合物半导体可以由化学式:In x M y Co 4-mA m Sb 12 -n-z X n Te z表示,其中M是选自Ca,Sr,Ba,Ti,V,Cr,Mn,Cu,Zn,Pd ,Ag,Cd,Sc,Y,La,Ce,Pr,Nd,Sm,Eu,Gd,Tb,Dy,Ho,Er,Tm,Yb和Lu中的至少一种,A是选自Fe, Ni,Ru,Rh,Pd,Ir和Pt中的至少一种,X是选自Si,Ga,Ge和Sn中的至少一种,0
Abstract:
Disclosed herein is an electric generating system using a solar cell which converts a voltage generated in the solar cell into an Alternating Current (AC) voltage, and applies the converted voltage to a power system. The electric generating system includes; a Direct Current (DC)/DC converter that converts the voltage generated in the solar cell into a DC voltage, and has a synchronous rectifier including a synchronous switch; and a controller that detects one of a phase and a voltage of the power system, and selectively connects the synchronous switch of the synchronous rectifier in accordance with one of the phase and voltage of the power system. Here, the electric generating system reduces a conduction loss, and increases overall efficiency of the electric generation system.