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    CIRCUIT SUBSTRATE WITH HEAT DISSIPATION BLOCK AND PACKAGING STRUCTURE HAVING THE SAME
    143.
    发明申请
    CIRCUIT SUBSTRATE WITH HEAT DISSIPATION BLOCK AND PACKAGING STRUCTURE HAVING THE SAME 有权

    公开(公告)号：US20220157687A1

    公开(公告)日：2022-05-19

    申请号：US17156848

    申请日：2021-01-25

    Applicant: UNIMICRON TECHNOLOGY CORP.

    Inventor： Chien-Chen LIN ,  Ho-Shing LEE

    IPC: H01L23/367 ,  H01L23/538

    Abstract: A circuit substrate has an open substrate, a heat-dissipation block, multiple high thermal conductivity members, a first dielectric layer, a second dielectric layer, multiple first heat conductive members, and multiple second heat conductive members. The heat-dissipation block is disposed in the open substrate. Multiple high thermal conductivity members are mounted through the heat-dissipation block. The first dielectric layer exposes a part of one of two surfaces of the heat-dissipation block. The second dielectric layer exposes a part of the other surface of the heat-dissipation block. The first heat conductive members are in contact with the heat-dissipation block exposed from the first dielectric layer. The second heat conductive members are in contact with the part of the heat-dissipation block exposed from the second dielectric layer. Therefore, heat can be transferred quickly via the heat-dissipation block and the high thermal conductivity members to improve heat-dissipating capacity of the circuit substrate.

    LIGHT-EMITTING PACKAGE AND METHOD OF MANUFACTURING THE SAME
    145.
    发明申请
    LIGHT-EMITTING PACKAGE AND METHOD OF MANUFACTURING THE SAME 有权

    公开(公告)号：US20220131054A1

    公开(公告)日：2022-04-28

    申请号：US17102458

    申请日：2020-11-24

    Applicant: Unimicron Technology Corp.

    Inventor： Kai-Ming YANG ,  Chen-Hao LIN ,  Tzu-Nien LEE

    IPC: H01L33/54 ,  H01L33/62 ,  H01L33/00 ,  H01L33/56

    Abstract: A light-emitting package includes a black encapsulating member, a plurality of light-emitting components and a circuit structure. The black encapsulating member has a first surface and a second surface opposite to the first surface. The light-emitting components are embedded in the black encapsulating member. Each light-emitting component has a light-emitting surface, a back surface opposite to the light-emitting surface, and a plurality of pads disposed on the back surface. The light-emitting surface of each light-emitting component is exposed on the first surface and is flush with the first surface. The pads of each light-emitting component are exposed on the second surface. The circuit structure is disposed on the second surface and electrically connected to the pads.

    CIRCUIT SUBSTRATE STRUCTURE AND MANUFACTURING METHOD THEREOF
    146.
    发明申请
    CIRCUIT SUBSTRATE STRUCTURE AND MANUFACTURING METHOD THEREOF 有权

    公开(公告)号：US20220130781A1

    公开(公告)日：2022-04-28

    申请号：US17567883

    申请日：2022-01-04

    Applicant: Unimicron Technology Corp.

    Inventor： Tzyy-Jang Tseng ,  Pu-Ju Lin ,  Cheng-Ta Ko ,  John Hon-Shing Lau

    IPC: H01L23/00 ,  H01L23/538 ,  H01L25/00 ,  H01L21/48

    Abstract: A circuit substrate structure includes a circuit substrate, at least two chips, and a bridge element. The circuit substrate has a first surface and a second surface opposite to each other. The chips are arranged in parallel on the first surface of the circuit substrate and electrically connected to the circuit substrate. The chips have active surfaces, back surfaces opposite to the active surfaces, and side surfaces connecting the active surfaces and the back surfaces. The chips include side circuits. The side circuits are arranged on the side surfaces and have first ends and second ends, the first ends extend to the active surfaces along the side surfaces, and the second ends extend to the back surfaces along the side surfaces. The bridge element is arranged on the back surfaces of the chips and electrically connected to the active surfaces of the chips through the side circuits.

    Wiring board and manufacture method thereof
    147.
    发明授权
    Wiring board and manufacture method thereof 有权

    公开(公告)号：US11289413B2

    公开(公告)日：2022-03-29

    申请号：US16747548

    申请日：2020-01-21

    Applicant: Unimicron Technology Corp.

    Inventor： Shih-Liang Cheng

    IPC: H05K1/11 ,  H01L23/498 ,  H01L21/48 ,  H05K3/40

    Abstract: A wiring board and a method of manufacturing the same are provided. The method includes the following steps. A substrate is provided. The substrate is perforated to form at least one through hole. A first conductive layer is integrally formed on a surface of the substrate and an inner wall of the through hole. An etch stop layer is formed on a portion of the first conductive layer on the surface of the substrate and another portion of the first conductive layer on the inner wall of the through hole. A second conductive layer is integrally formed on the etch stop layer and the first conductive layer on the inner wall of the through hole. A plug-hole column is formed by filling with a plugged-hole material in the through hole. The second conductive layer is removed. The etch stop layer is then removed.

    EMBEDDED COMPONENT STRUCTURE AND MANUFACTURING METHOD THEREOF
    149.
    发明申请
    EMBEDDED COMPONENT STRUCTURE AND MANUFACTURING METHOD THEREOF 有权

    公开(公告)号：US20220022317A1

    公开(公告)日：2022-01-20

    申请号：US17406115

    申请日：2021-08-19

    Applicant: Unimicron Technology Corp.

    Inventor： Yu-Shen Chen ,  I-Ta Tsai ,  Chien-Chih Chen

    IPC: H05K1/11 ,  H05K3/46 ,  H05K3/40 ,  H05K1/18

    Abstract: An embedded component structure includes a circuit board, an electronic component, a first conductive terminal, and a second conductive terminal. The circuit board includes a first electrical connection layer and a second electrical connection layer. The electronic component is embedded in the circuit board and includes a first contact and a second contact. The first conductive terminal and the second conductive terminal respectively at least cover a part of top surfaces and side walls of the first contact and the second contact, and the first electrical connection layer and the second electrical connection layer are respectively electrically connected to the first contact and the second contact through the first conductive terminal and the second conductive terminal. A method for manufacturing an embedded component structure is also provided.

    PACKAGE CARRIER AND MANUFACTURING METHOD THEREOF
    150.
    发明申请
    PACKAGE CARRIER AND MANUFACTURING METHOD THEREOF 有权

    公开(公告)号：US20220022316A1

    公开(公告)日：2022-01-20

    申请号：US16996911

    申请日：2020-08-19

    Applicant: Unimicron Technology Corp.

    Inventor： Po-Wei Chen ,  Wei-Ti Lin ,  Chun-Hsien Chien

    IPC: H05K1/11 ,  H05K3/10 ,  H05K3/46 ,  H05K3/18 ,  H01L23/498

    Abstract: A package carrier includes a build-up circuit structure, a first insulation protective layer, a plurality of connection pads, and a plurality of metal balls. The build-up circuit structure has an upper surface. The first insulation protective layer is disposed on the upper surface of the build-up circuit structure and has a plurality of first openings. The connection pads are respectively disposed in the first openings of the first insulation protective layer and are structurally and electrically connected to the build-up circuit structure. Each of the connection pads has an arc-shaped groove. The metal balls are respectively disposed in the arc-shaped groove of the connection pads. The metal balls and the corresponding connection pads define a plurality of bump structures, and a plurality of top surfaces of the bump structures are on a same plane.

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