公开(公告)号：US09786777B2

公开(公告)日：2017-10-10

申请号：US14913980

申请日：2013-08-30

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Ning Ge ,  Leong Yap Chia ,  Pin Chin Lee ,  Jose Jehrome Rando

IPC: H01L21/00 ,  H01L29/74 ,  H01L29/78 ,  H01L29/66 ,  H01L21/28 ,  H01L29/08 ,  H01L21/8234

CPC classification number: H01L29/66575 ,  H01L21/28035 ,  H01L21/28123 ,  H01L21/823437 ,  H01L21/823481 ,  H01L29/0847 ,  H01L29/66659 ,  H01L29/78 ,  H05K2203/013

Abstract: A semiconductor device and method of forming the same is described. In an example, a polysilicon layer is deposited on a substrate having at least one polysilicon ring. The substrate is doped using the polysilicon layer as a mask to form doped regions in the substrate. A dielectric layer is deposited over the polysilicon layer and the substrate. The dielectric layer is etched to expose portions of the polysilicon layer. A metal layer is deposited on the dielectric layer. The metal layer, the dielectric layer, and the exposed portions of the polysilicon layer are etched such that at least a portion of each polysilicon ring is removed.

公开(公告)号：US09776412B2

公开(公告)日：2017-10-03

申请号：US15287008

申请日：2016-10-06

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Ning Ge ,  Joseph M. Torgerson ,  Patrick Leonard

IPC: B41J2/175 ,  B41J2/165 ,  B41J2/045 ,  B41J2/14

CPC classification number: B41J2/165 ,  B41J2/04541 ,  B41J2/0458 ,  B41J2/1404 ,  B41J2/14129 ,  B41J2/1753 ,  B41J2/17546 ,  B41J2/17566 ,  B41J2002/14354 ,  B41J2002/17579

Abstract: In an embodiment, a fluid ejection device includes an ink slot formed in a printhead die. The fluid ejection device also includes a printhead-integrated ink level sensor (PILS) to sense an ink level of a chamber in fluid communication with the slot, and a clearing resistor circuit disposed within the chamber to clear the chamber of ink.

公开(公告)号：US20170246866A1

公开(公告)日：2017-08-31

申请号：US15594068

申请日：2017-05-12

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Ning Ge ,  Mun Hooi Yaow ,  Bee Ling Peh

IPC: B41J2/14

CPC classification number: B41J2/14032 ,  B41J2/14016 ,  B41J2/14072 ,  B41J2/1412 ,  B41J2/14129 ,  B41J2/1601 ,  B41J2/1626 ,  B41J2/164

Abstract: A fluid ejection device is described. In an example, a device includes a substrate having a chamber formed thereon to Ncontain a fluid. A metal layer includes a resistor under the chamber having a surface thermally coupled to the chamber. At least one layer is deposited on the metal layer. A polysilicon layer is under the metal layer comprising a polysilicon structure under the resistor to change topography of the resistor such that the surface is uneven.

公开(公告)号：US09701115B2

公开(公告)日：2017-07-11

申请号：US15032551

申请日：2013-10-31

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Jianhua Yang ,  Ning Ge ,  Zhiyong Li

IPC: B41J2/14 ,  B41J2/16 ,  B41J2/045

CPC classification number: B41J2/14072 ,  B41J2/04541 ,  B41J2/0458 ,  B41J2/14016 ,  B41J2/14129 ,  B41J2/1601 ,  B41J2/1607 ,  B41J2/1626 ,  B41J2/1631 ,  B41J2202/13 ,  H01L21/02565 ,  H01L27/24 ,  H01L27/2463 ,  H01L45/00 ,  H01L45/04 ,  H01L45/08 ,  H01L45/145 ,  H01L45/146 ,  H01L45/147 ,  H01L45/1633 ,  H01L45/1675

Abstract: Printheads having memories formed thereon are disclosed. An example apparatus includes a printhead body comprising a first metal layer. The example apparatus also include a memory formed on the print-head body. The memory includes the first metal layer as a first electrode, a second metal layer as a second electrode, and a switching oxide layer between the first and second metal layers.

公开(公告)号：US20170036452A1

公开(公告)日：2017-02-09

申请号：US15107420

申请日：2014-01-03

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Ning Ge ,  Patrick Leonard

IPC: B41J2/175

CPC classification number: B41J2/17566 ,  B41J2/04541 ,  B41J2/0458 ,  B41J2/14153 ,  B41J2002/14354

Abstract: In an embodiment, a fluid ejection device includes a fluid feed slot formed in a printhead die and a plurality of printhead-integrated ink level sensors (PILS). A fluid ejection device may include a first PILS to sense an ink level of a first chamber in fluid communication with the fluid feed slot, the first PILS to detect an empty ink level of the first chamber when the fluid ejection device is at a first ink level state, and a second PILS to sense an ink level of a second chamber in fluid communication with the fluid feed slot, the second PILS to detect an empty ink level of the second chamber when the fluid ejection device is at a second ink level state, different than the first ink level state

Abstract translation: 在一个实施例中，流体喷射装置包括形成在打印头芯片中的流体供给槽和多个打印头集成的油墨水平传感器（PILS）。 流体喷射装置可以包括用于感测与流体供给槽流体连通的第一室的油墨水平的第一PILS，当流体喷射装置处于第一油墨时，第一PILS检测第一室的空墨水平 以及第二PILS，用于感测与所述流体供给槽流体连通的第二室的墨水量，所述第二PILS在所述流体喷射装置处于第二墨水量状态时检测所述第二腔室的空墨水平 ，与第一墨水量状态不同

公开(公告)号：US09457571B2

公开(公告)日：2016-10-04

申请号：US14890551

申请日：2013-06-28

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Ning Ge ,  Chaw Sing Ho ,  Adam L. Ghozeil ,  Michael W. Cumbie

IPC: B41J2/145 ,  B41J2/16 ,  B41J2/14

CPC classification number: B41J2/145 ,  B41J2/14 ,  B41J2/14016 ,  B41J2/14129 ,  B41J2/1603 ,  B41J2/162 ,  B41J2/1626 ,  B41J2/1628 ,  B41J2/1629 ,  B41J2202/13

Abstract: Examples of fluid ejection apparatuses and methods for making fluid ejection apparatuses are described. An example method may include forming a fluid feed slot in a bulk layer of a substrate, forming a plurality of ink feed channels in at least an epitaxial layer of the substrate, each of the ink feed channels fluidically coupled to the fluid feed slot, and forming a plurality of drop generators over the substrate such that the epitaxial layer of the substrate is between the plurality of drop generators and the bulk layer and such that the each of the drop generators is fluidically coupled to the fluid feed slot by at least one of the ink feed channels.

Abstract translation: 对流体喷射装置和制造流体喷射装置的方法进行说明。 一个示例性方法可以包括在衬底的本体层中形成流体馈送槽，在衬底的至少外延层中形成多个供墨通道，每个供墨通道流体耦合到流体供给槽，以及 在所述衬底上形成多个液滴发生器，使得所述衬底的所述外延层位于所述多个液滴发生器和所述主体层之间，并且使得所述液滴发生器中的每一个通过以下中的至少一个流体耦合到所述流体供给槽 供墨通道。

公开(公告)号：US09331278B2

公开(公告)日：2016-05-03

申请号：US14169375

申请日：2014-01-31

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Jianhua Yang ,  Ning Ge ,  Zhiyong Li ,  Minxian Max Zhang

IPC: H01L21/02 ,  H01L45/00 ,  B41J2/16 ,  H01L27/24 ,  B41J2/14

CPC classification number: B41J2/14072 ,  B41J2/04541 ,  B41J2/0458 ,  B41J2/14016 ,  B41J2/14129 ,  B41J2/1601 ,  B41J2/1607 ,  B41J2/1626 ,  B41J2/1631 ,  B41J2202/13 ,  H01L21/02565 ,  H01L27/24 ,  H01L27/2463 ,  H01L45/00 ,  H01L45/04 ,  H01L45/08 ,  H01L45/145 ,  H01L45/146 ,  H01L45/147 ,  H01L45/1633 ,  H01L45/1675

Abstract: Forming memristors on imaging devices can include forming a printhead body comprising a first conductive material, forming a memory on the printhead body by performing an oxidation process to form a switching oxide material on the first conductive material, and forming a second conductive material on the switching oxide material.

Abstract translation: 在成像装置上形成忆阻器可以包括形成包括第一导电材料的打印头主体，通过执行氧化处理在第一导电材料上形成切换氧化物材料，在开关上形成第二导电材料，在打印头主体上形成存储器 氧化物。

公开(公告)号：US20160114580A1

公开(公告)日：2016-04-28

申请号：US14787233

申请日：2013-07-29

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Ning Ge ,  Mun Hooi Yaow ,  Bee Ling Peh

IPC: B41J2/14 ,  B41J2/16

CPC classification number: B41J2/14032 ,  B41J2/14016 ,  B41J2/14072 ,  B41J2/1412 ,  B41J2/14129 ,  B41J2/1601 ,  B41J2/1626 ,  B41J2/164

Abstract: A fluid ejection device is described. In an example, a device includes a substrate having a chamber formed thereon to contain a fluid. A metal layer includes a resistor under the chamber having a surface thermally coupled to the chamber. At least one layer is deposited on the metal layer. A polysilicon layer is under the metal layer comprising a polysilicon structure under the resistor to change topography of the resistor such that the surface is uneven.

Abstract translation: 描述了流体喷射装置。 在一个示例中，装置包括具有形成在其上以容纳流体的腔室的基底。 金属层包括在腔室下面的电阻器，其具有热耦合到腔室的表面。 在金属层上沉积至少一层。 多晶硅层位于电阻器下方的包含多晶硅结构的金属层下，以改变电阻器的形貌，使得表面不均匀。

公开(公告)号：US20140320558A1

公开(公告)日：2014-10-30

申请号：US13870123

申请日：2013-04-25

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Ning Ge ,  Trudy Benjamin ,  Teck Khim Neo

IPC: B41J2/045

CPC classification number: B41J2/04541 ,  B41J2/04521 ,  B41J2/0458

Abstract: An integrated circuit (IC) erasable programmable read-only memory (EPROM) structure for a thermal inkjet printhead includes: a fire line to provide fire line data; a select line to provide selecting data; a firing cell coupled to the fire line; an EPROM cell coupled to the fire line; a selector cell coupled to the select line, the firing cell and the EPROM cell; and a data switching circuit to provide address data to the firing cell or the EPROM cell. The data switching circuit and the selector cell selectively enable transfer of the fire line data from the fire line to the firing cell or the EPROM cell as a function of state of the selecting data on the select line and the address data from the data switching circuit.

Abstract translation: 用于热喷墨打印头的集成电路（IC）可擦除可编程只读存储器（EPROM）结构包括：用于提供火线数据的火线; 提供选择数据的选择行; 联接到火线的点火单元; 耦合到火线的EPROM单元; 耦合到选择线的选择器单元，点火单元和EPROM单元; 以及数据切换电路，用于向点火单元或EPROM单元提供地址数据。 数据切换电路和选择器单元选择性地使得能够根据选择线上的选择数据的状态和来自数据切换电路的地址数据将火线数据从火线传送到点火单元或EPROM单元 。