公开(公告)号：US20070045823A1

公开(公告)日：2007-03-01

申请号：US11467282

申请日：2006-08-25

Applicant: James Miller

Inventor： James Miller

IPC: H01L23/34

CPC classification number: H01L23/295 ,  H01L33/641 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A composition and method for die-level packaging of microelectronics is disclosed. The composition includes about 20% to about 80% of a thermoplastic base matrix; about 20% to about 70% of a non-metallic, thermally conductive material such that the composition has a coefficient of thermal expansion of less than 20 ppm/C and a thermal conductivity of greater than 1.0 W/mK. Using injection molding techniques, the composition can be molten and then injected into a die containing the microelectronics to encapsulate the microelectronics therein.

Abstract translation: 公开了一种用于微电子学模具级封装的组合物和方法。 该组合物包括约20％至约80％的热塑性基质; 约20％至约70％的非金属导热材料，使得组合物的热膨胀系数小于20ppm /℃，导热系数大于1.0W / mK。 使用注射成型技术，可以将组合物熔化，然后注入包含微电子学的模具中以将微电子学封装在其中。

公开(公告)号：US20070016691A1

公开(公告)日：2007-01-18

申请号：US11181614

申请日：2005-07-14

Applicant: Brian Pepin ,  James Miller ,  Jeffrey Richter ,  Thomas Quinn

Inventor： Brian Pepin ,  James Miller ,  Jeffrey Richter ,  Thomas Quinn

IPC: G06F15/16

CPC classification number: H04L69/18

Abstract: Node-to-node communication pipelines may include code modules that are configured and assembled across a protocol according to dynamically input module-specific parameters. The parameters may be input to a service into which the modules are registered, and one or more appropriate pipelines may be dynamically assembled.

Abstract translation: 节点到节点通信管线可以包括根据动态输入模块特定参数在协议上配置和组合的代码模块。 可以将参数输入到模块被注册到的服务中，并且可以动态地组合一个或多个适当的管道。

公开(公告)号：US20060253324A1

公开(公告)日：2006-11-09

申请号：US11404373

申请日：2006-04-14

Applicant: James Miller

Inventor： James Miller

IPC: G06Q30/00

CPC classification number: G06Q30/02 ,  G06Q30/0212 ,  G06Q30/0235 ,  G06Q30/0236

Abstract: A method includes, in response to a request by a subscriber for a subscription to a product or service, wherein the subscription has a subscription period and wherein the subscription period is initially for a first period of time, automatically providing the subscriber with the product or service for the first period of time. The method also includes automatically entering the subscriber into one or more sweepstakes drawings which occur during the first period of time. The one or more sweepstakes drawings have one or more corresponding jackpots. The method also includes, at the end of the subscription period, automatically renewing the subscription for a next period of time; and in connection with the renewed subscription, automatically entering the subscriber into one or more sweepstakes drawings which occur during the next period of time. The operations of automatic renewing the subscription for a next period of time, and automatically entering the subscriber into one or more sweepstakes drawings occurring during that period of time are repeated until the subscriber terminates the subscription.

Abstract translation: 一种方法包括响应于订户对产品或服务的订阅的请求，其中订阅具有订阅周期，并且其中订阅周期最初是第一时间段，自动向用户提供产品或 服务第一期。 该方法还包括将用户自动地输入到在第一时间段期间发生的一个或多个抽奖图。 一个或多个抽奖图纸具有一个或多个相应的累积奖金。 该方法还包括在订阅周期结束时自动续订订阅下一段时间; 并且与更新的订阅有关，自动地将用户输入到在下一段时间内发生的一个或多个抽奖图。 在下一个时间段内自动更新订阅的操作以及在该时间段内自动进入一个或多个抽奖绘图的用户被重复直到订阅者终止订阅。

公开(公告)号：US20060207963A1

公开(公告)日：2006-09-21

申请号：US11430610

申请日：2006-05-09

Applicant: J. Little ,  James Miller

Inventor： J. Little ,  James Miller

IPC: B65D90/02

CPC classification number: B65D1/14 ,  B65D25/2897 ,  Y10S220/12 ,  Y10S220/13 ,  Y10S220/14

Abstract: A blow molded, hollow plastic container including two opposed, relatively longer sidewall portions which alternate with two opposed, relatively shorter sidewall portions. A first of the relatively shorter sidewall portions includes a grip area, and the opposed second relatively shorter sidewall portion includes a pour area.

Abstract translation: 吹塑成型的中空塑料容器，其包括两个相对的相对较长的侧壁部分，其与两个相对较短的侧壁部分交替。 相对较短的侧壁部分中的第一个包括握持区域，并且相对的第二相对较短的侧壁部分包括倾倒区域。

公开(公告)号：US07077990B2

公开(公告)日：2006-07-18

申请号：US10607352

申请日：2003-06-26

Applicant: James Miller

Inventor： James Miller

IPC: B29C70/70 ,  B29C70/88

CPC classification number: H02K5/08 ,  H02K1/187 ,  H02K5/163 ,  H02K9/22 ,  Y10T29/49009 ,  Y10T29/53143

Abstract: A method for making a stator assembly having a thermally-conductive, plastic housing for a high speed motor is provided. A thermally-conductive, high-density polymer composition is used to make the housing, and the stator is uniformly encapsulated therein. The polymer composition comprises a base polymer matrix such as polyphenylene sulfide, and a thermally-conductive, high-density filler material such as zinc oxide.

Abstract translation: 提供一种用于制造具有用于高速电动机的导热塑料壳体的定子组件的方法。 使用导热高密度聚合物组合物制造壳体，并且定子被均匀地包封在其中。 聚合物组合物包括聚苯硫醚等基础聚合物基质，氧化锌等导热性高密度填料。

公开(公告)号：US20060154469A1

公开(公告)日：2006-07-13

申请号：US11033008

申请日：2005-01-11

Applicant: Kevin Hess ,  Susan Downey ,  James Miller ,  Cheng Yong

Inventor： Kevin Hess ,  Susan Downey ,  James Miller ,  Cheng Yong

IPC: H01L21/4763

CPC classification number: H01L24/05 ,  H01L23/522 ,  H01L23/53214 ,  H01L23/53228 ,  H01L24/03 ,  H01L2224/05624 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01025 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/00014

Abstract: A method provides an interconnect structure having enhanced structural support when underlying functional metal layers are insulated with a low modulus dielectric. A first metal layer having a plurality of openings overlies the substrate. A first electrically insulating layer overlies the first metal layer. A second metal layer overlies the first electrically insulating layer, the second metal layer having a plurality of openings. An interconnect pad that defines an interconnect pad area overlies the second metal layer. At least a certain amount of the openings in the two metal layers are aligned to improve structural strength of the interconnect structure. The amount of alignment may differ depending upon the application and materials used. A bond wire connection or conductive bump may be used with the interconnect structure.

公开(公告)号：US20060133564A1

公开(公告)日：2006-06-22

申请号：US11018030

申请日：2004-12-21

Applicant: David Langan ,  Peter Edic ,  Abdalmajeid Alyassin ,  Bernhard Claus ,  Joseph Manak ,  James Miller

Inventor： David Langan ,  Peter Edic ,  Abdalmajeid Alyassin ,  Bernhard Claus ,  Joseph Manak ,  James Miller

IPC: A61B6/00 ,  G01N23/00 ,  G21K1/12 ,  H05G1/60

CPC classification number: G06T11/005 ,  A61B6/5258 ,  G01N23/046 ,  G01N2223/419 ,  G01N2223/612 ,  G06T7/20 ,  G06T2211/412 ,  G06T2211/436

Abstract: A plurality of projection images are acquired over an angular range during the slow rotation of a C-arm gantry having a source and detector. Phase-specific reconstructions are generated from the plurality of projections, wherein each phase-specific reconstruction is generated generally from projections acquired at or near the respective phase. In one embodiment, a plurality of motion estimates are generated based upon the phase-specific reconstructions. One or more motion-corrected reconstructions may be generated using the respective motion estimates and projections. The motion-corrected reconstructions may be associated to form motion-corrected volume renderings.

Abstract translation: 在具有源和检测器的C臂架的慢旋转期间，在角度范围内获取多个投影图像。 从多个投影产生相位特定的重建，其中每个相位特定的重建通常来自于在各个相位处或附近获取的投影。 在一个实施例中，基于相位特定重建产生多个运动估计。 可以使用相应的运动估计和投影来生成一个或多个运动校正重建。 可以将运动校正的重建相关联以形成运动校正的体积渲染。

公开(公告)号：US20060028776A1

公开(公告)日：2006-02-09

申请号：US10914442

申请日：2004-08-09

Applicant: Michael Stockinger ,  James Miller

Inventor： Michael Stockinger ,  James Miller

IPC: H02H9/00

CPC classification number: H01L27/0255 ,  H01L27/0292

Abstract: An ESD protection circuit (40) uses parasitic drain-body diodes (47, 49) of the output buffer transistors (46, 48) as the main, or dominant, ESD protection diodes. Specifically, butted source-body ties in the output buffer transistors (46, 48) provide the ESD diodes (47, 49). Using parasitic drain-body diodes of output buffer transistors with butted source-body ties as the dominant ESD diodes reduces the layout area required to implement the ESD protection circuit as compared to an ESD protection circuit having stand alone diodes. Also, the butted source-body ties reduce susceptibility to latch-up and reduce capacitive loading because there are no added diffusion regions tied to the pad.

Abstract translation: ESD保护电路（40）使用输出缓冲晶体管（46,48）的寄生漏极体二极管（47,49）作为主要或主要的ESD保护二极管。 具体地说，输出缓冲晶体管（46,48）中的对接源体连接提供ESD二极管（47,49）。 与具有独立二极管的ESD保护电路相比，使用具有对接源体束带的输出缓冲晶体管的寄生漏极体二极管作为主要ESD二极管减少了实现ESD保护电路所需的布局面积。 此外，对接的源体相关性降低了闩锁的敏感性并降低了电容负载，因为没有附加的扩散区域与焊盘相连。

公开(公告)号：US06976769B2

公开(公告)日：2005-12-20

申请号：US10459234

申请日：2003-06-11

Applicant: Kevin McCullough ,  James Miller ,  E. Mikhail Sagal

Inventor： Kevin McCullough ,  James Miller ,  E. Mikhail Sagal

IPC: B29C45/00 ,  B29C45/14 ,  F21V7/20 ,  F21V7/22 ,  F21V15/01 ,  F21V29/00 ,  F28D15/02

CPC classification number: F21V29/51 ,  B29C45/006 ,  B29C45/14598 ,  B29L2031/747 ,  F21S41/37 ,  F21S45/47 ,  F21V7/0008 ,  F21V7/22 ,  F21V15/01 ,  F21V29/505 ,  F21Y2115/10 ,  F28D15/02 ,  H05K1/0203 ,  H05K1/0209 ,  H05K2201/10106

Abstract: A light-emitting diode reflector assembly having a heat pipe and a reflector body is provided. The assembly further includes a mounting member for mounting a circuit board having an array of light-emitting diodes. The mounting member and reflector body are made from a thermally-conductive polymer composition comprising: i) about 20% to about 80% by weight of a base polymer matrix such as polycarbonate; and ii) about 20% to about 80% by weight of a thermally-conductive material such as carbon graphite.

Abstract translation: 提供具有热管和反射体的发光二极管反射器组件。 组件还包括用于安装具有发光二极管阵列的电路板的安装构件。 安装构件和反射体由导热聚合物组合物制成，其包含：i）约20重量％至约80重量％的基础聚合物基质如聚碳酸酯; 和ii）约20重量％至约80重量％的导热材料如碳石墨。

公开(公告)号：US20050272845A1

公开(公告)日：2005-12-08

申请号：US11138118

申请日：2005-05-26

Applicant: James Miller

Inventor： James Miller

IPC: C08K3/18 ,  C08K3/34 ,  C08K3/38

CPC classification number: C08K3/38 ,  C08K2003/382 ,  Y10T428/31507 ,  Y10T428/31663 ,  Y10T428/31725 ,  Y10T428/31786

Abstract: An injection moldable, thermally conductive polymer composition that has ultra low CTE properties is provided. The composition is suitable both for substrate applications in high precision electronics assemblies as well as over molding applications in conjunction with ceramic substrates. The composition includes a base polymer matrix material loaded with thermally conductive filler, which imparts thermal conductivity to the polymer matrix while also maintaining or enhancing the dielectric properties of the base polymer. The resultant composition exhibits CTE properties in the range of between 9 ppm/° C. and 2 ppm/° C., exhibits an optical anisotropy of below 1.5, and a thermal conductivity of greater than 2 W/m° K. The composition is suitable for use in over molding applications in conjunction with virtually any suitable electronics substrate material without the introduction of mechanical stresses produced by large CTE differentials.

Abstract translation: 提供了具有超低CTE性能的可注射成型的导热聚合物组合物。 该组合物适用于高精度电子组件中的基底应用以及与陶瓷基底结合的超模塑应用。 组合物包括负载有导热填料的基础聚合物基体材料，其赋予聚合物基质导热性，同时还维持或增强基础聚合物的介电性能。 所得组合物在9ppm /℃和2ppm /℃之间的范围内显示CTE性质，其光学各向异性低于1.5，热导率大于2W / m°K.组合物为 适用于超模塑应用，并结合实际上任何合适的电子基板材料，而不会引入由大型CTE差速器产生的机械应力。