Abstract:
Disclosed are an RF signal of karaoke data receiving pack and karaoke system using thereof. The RF Karaoke data receiving pack includes an RF receiver for receiving a voice signal and key data signal radio-transmitted from a wireless microphone device via a receiving antenna; an audio/key data signal separator for separating the voice signal and key data signal from the signal demodulated by the demodulator; a receiver MCU controlling the internal operation of the RF karaoke data signal receiving pack while transmitting the digital voice signal and key data signal to the external computing device; and an extension pack in which additional songs are recorded, the extension pack being connected to an extension pack slot to transmit data of the additional songs under the control of the receiver MCU.
Abstract:
An exemplary method of manufacturing a semiconductor device according to an embodiment of the present invention includes forming a P-well and an N-well for high voltage (HV) devices and a first well in a low voltage/medium voltage (LV/MV) region for a logic device, in a semiconductor substrate; simultaneously forming a second well in the LV/MV region for a logic device and a drift region for one of the HV devices using the same mask; and respectively forming gate oxide layers on the semiconductor substrate in the HV/MV/LV regions. According to the present invention, the number of photolithography processes can be reduced by replacing or combining an additional mask for forming an extended drain region of a high voltage depletion-enhancement CMOS (DECMOS) with a mask for forming a typical well of a logic device, so productivity of the total process of the device can be enhanced.
Abstract:
Disclosed is a submount integrated photodiode package with an improved metal layer configuration and laser diode package using the same. In particular, a unitary laser diode of the invention provides a light receiving area overlying a semiconductor substrate to correspond to a radiation area of light emitted from a laser diode so as to reduce chip size in respect to a conventional one while maintaining a monitoring current identical to the conventional one as well as improve heat-radiating features. The invention provides a unitary laser diode package which comprises a light receiving area overlying a semiconductor substrate and having the same configuration as a radiation area of emission light from the laser diode and a metal layer adjacent to the light receiving area.
Abstract:
Disclosed is a method of fabricating a metal semiconductor field effect transistor, comprising the steps for, forming the channel using an ion-implantation, sequentially forming a first insulator layer at a first predetermined temperature and a second insulation layer at second predetermined temperature over the surface of the substrate, etching the first and second insulation layers using a gate pattern of a photo-resist pattern to expose the channel region as a mask, forming a refractory metal over the surface of the first and second insulation layer add the exposed channel region, etching the refractory metal, thereby dividing it into two parts of which one is formed on the channel region and the other is formed on the second insulation layer, selectively etching the first and second insulation layers to lift-off the refractory metal over the first and second insulation layers, thereby forming a gate of a T-shape on the channel region, ion implanting Si into a substrate using the gate and a channel pattern of a photo-resist film to form a self-aligned high concentration ion implantation region, forming a third insulation layer for preventing As of evaporation, carrying out a rapid thermal annealing for activation, removing the third insulation layer; and forming an ohmic electrode using a lift-off process.
Abstract:
A method of manufacturing a GaAs field effect transistor comprises depositing a silicon thin film 202 on a semi-insulating semiconductor substrate 201, forming a first sensitive film 203 by a photolithography to define channel areas and ion-implanting n-type dopants into the substrate to form an activation layer, removing the first sensitive film, forming a second sensitive film 203a on the silicon thin film by photolithography to define an ohmic contact area and then forming a highly doped impurity layer on the side of the activation layer by way of an ion-implantation process, depositing a passivation film 206 over the entire surface of the substrate 201 after the removal of the sensitive film, and effecting an annealing or heat treatment, forming a third sensitive film of a predetermined pattern by using an ohmic contact forming mask, effecting a recess etching process to the surface of the substrate and forming an ohmic contact on the etched portion, and patterning a gate region by using the gate forming mask, recess-etching the surface of the substrate and depositing a low resistivity metal to form a gate.