Method for manufacturing semiconductor device having trench in silicon carbide semiconductor substrate
    181.
    发明授权
    Method for manufacturing semiconductor device having trench in silicon carbide semiconductor substrate 有权
    一种在碳化硅半导体衬底中制造具有沟槽的半导体器件的方法

    公开(公告)号:US07241694B2

    公开(公告)日:2007-07-10

    申请号:US11105587

    申请日:2005-04-14

    CPC classification number: H01L29/045 H01L29/66068 H01L29/7828 H01L29/8083

    Abstract: A method for manufacturing a silicon carbide semiconductor device includes the steps of: forming a trench mask on an upper surface of a semiconductor substrate; forming the trench such that the trench having an aspect ratio equal to or larger than 2 and having a trench slanting angle equal to or larger than 80 degrees is formed; and removing a damage portion in such a manner that the damage portion disposed on an inner surface of the trench formed in the semiconductor substrate in the step of forming the trench is etched and removed in hydrogen atmosphere under decompression pressure at a temperature equal to or higher than 1600° C.

    Abstract translation: 一种制造碳化硅半导体器件的方法包括以下步骤:在半导体衬底的上表面上形成沟槽掩模; 形成沟槽,使得形成具有等于或大于2并且具有等于或大于80度的沟槽倾斜角的纵横比的沟槽; 并且以这样的方式去除损伤部分,即在形成沟槽的步骤中形成在半导体衬底的沟槽的内表面上的损伤部分在氢气气氛中在等于或等于更高的温度的减压下被蚀刻和去除 比1600℃

    MODULAR FORCE SENSOR
    182.
    发明申请
    MODULAR FORCE SENSOR 有权
    模块式传感器

    公开(公告)号:US20070151391A1

    公开(公告)日:2007-07-05

    申请号:US11553303

    申请日:2006-10-26

    Abstract: A modular force sensor apparatus, method, and system are provided to improve force and torque sensing and feedback to the surgeon performing a telerobotic surgery. In one embodiment, a modular force sensor includes a tube portion including a plurality of strain gauges, a proximal tube portion for operably coupling to a shaft of a surgical instrument that may be operably coupled to a manipulator arm of a robotic surgical system, and a distal tube portion for proximally coupling to a wrist joint coupled to an end portion.

    Abstract translation: 提供了一种模块式力传感器装置,方法和系统,以改善对外科医生执行远程外科手术的力和转矩检测和反馈。 在一个实施例中,模块化力传感器包括包括多个应变计的管部分,用于可操作地联接到外科器械的轴的近侧管部分,其可操作地联接到机器人手术系统的操纵臂,以及 用于向近侧联接到联接到端部的腕关节的远端管部分。

    Gate wiring layout for silicon-carbide-based junction field effect transistor
    183.
    发明授权
    Gate wiring layout for silicon-carbide-based junction field effect transistor 有权
    基于碳化硅的结型场效应晶体管的栅极布线布局

    公开(公告)号:US07164154B2

    公开(公告)日:2007-01-16

    申请号:US10995566

    申请日:2004-11-24

    CPC classification number: H01L29/8083 H01L29/1608

    Abstract: A silicon carbide semiconductor device includes: a semiconductor substrate including first and second gate layers, a channel layer, a source layer, and a trench; a gate wiring having a first portion and a plurality of second portions; and a source wiring having a third portion and a plurality of fourth portions. The trench extends in a predetermined extending direction. The first portion connects to the first gate layer in the trench, and extends to the extending direction. The second portions protrude perpendicularly to be a comb shape. The third portion extends to the extending direction. The fourth portions protrude perpendicularly to be a comb shape, and electrically connect to the source layer. Each of the second portions connects to the second gate layer through a contact hole.

    Abstract translation: 碳化硅半导体器件包括:包括第一和第二栅极层,沟道层,源极层和沟槽的半导体衬底; 栅极布线,具有第一部分和多个第二部分; 以及具有第三部分和多个第四部分的源极布线。 沟槽沿预定的延伸方向延伸。 第一部分连接到沟槽中的第一栅极层,并延伸到延伸方向。 第二部分垂直突出成为梳形。 第三部分延伸到延伸方向。 第四部分垂直突出成梳状,并且电连接到源层。 每个第二部分通过接触孔连接到第二栅极层。

    Silicon carbide semiconductor device having junction field effect transistor and method for manufacturing the same
    186.
    发明申请
    Silicon carbide semiconductor device having junction field effect transistor and method for manufacturing the same 有权
    具有结场效应晶体管的碳化硅半导体器件及其制造方法

    公开(公告)号:US20050139859A1

    公开(公告)日:2005-06-30

    申请号:US10984957

    申请日:2004-11-10

    CPC classification number: H01L29/1608 H01L29/66068 H01L29/8083 Y10S438/931

    Abstract: A silicon carbide semiconductor device includes a substrate and a junction field effect transistor. The transistor includes: a first semiconductor layer disposed on the substrate; a first gate layer disposed on a surface of the first semiconductor layer; a first channel layer adjacent to the first gate layer on the substrate; a first source layer connecting to the first channel layer electrically; a second gate layer adjacent to the first channel layer to sandwich the first channel layer; a second channel layer adjacent to the second gate layer to sandwich the second gate layer; a third gate layer adjacent to the second channel layer to sandwich the second channel layer; and a second source layer connecting to the second channel layer electrically.

    Abstract translation: 碳化硅半导体器件包括衬底和结场效应晶体管。 晶体管包括:设置在基板上的第一半导体层; 设置在所述第一半导体层的表面上的第一栅极层; 与所述基板上的所述第一栅极层相邻的第一沟道层; 电连接到第一沟道层的第一源极层; 与所述第一沟道层相邻以夹住所述第一沟道层的第二栅极层; 与所述第二栅极层相邻以夹住所述第二栅极层的第二沟道层; 与所述第二沟道层相邻以夹住所述第二沟道层的第三栅极层; 以及电连接到第二沟道层的第二源极层。

    Silicon carbide power device having protective diode
    188.
    发明授权
    Silicon carbide power device having protective diode 有权
    具有保护二极管的碳化硅功率器件

    公开(公告)号:US06855981B2

    公开(公告)日:2005-02-15

    申请号:US10230152

    申请日:2002-08-29

    Abstract: A silicon carbide power device includes a junction field effect transistor and a protective diode, which is a Zener or PN junction diode. The PN junction of the protective diode has a breakdown voltage lower than the PN junction of the transistor. Another silicon carbide power device includes a protective diode, which is a Schottky diode. The Schottky diode has a breakdown voltage lower than the PN junction of the transistor by adjusting Schottky barrier height or the depletion layer formed in the semiconductor included in the Schottky diode. Another silicon carbide power device includes three protective diodes, which are Zener diodes. Two of the protective diodes are used to clamp the voltages applied to the gate and the drain of the transistor due to surge energy and used to release the surge energy. The last diode is a thermo-sensitive diode, with which the temperature of the JFET is measured.

    Abstract translation: 碳化硅功率器件包括结场效应晶体管和作为齐纳二极管或PN结二极管的保护二极管。 保护二极管的PN结的击穿电压低于晶体管的PN结。 另一种碳化硅功率器件包括一个保护二极管,它是肖特基二极管。 通过调整肖特基势垒高度或肖特基二极管中包含的半导体中形成的耗尽层,肖特基二极管的击穿电压低于晶体管的PN结。 另一种碳化硅功率器件包括三个保护二极管,它们是齐纳二极管。 两个保护二极管用于钳位由于浪涌能量施加到晶体管的栅极和漏极的电压,并用于释放浪涌能量。 最后一个二极管是热敏二极管,测量JFET的温度。

    Macroscopic ordered assembly of carbon nanotubes
    189.
    发明授权
    Macroscopic ordered assembly of carbon nanotubes 有权
    宏观有序的碳纳米管组装

    公开(公告)号:US06790425B1

    公开(公告)日:2004-09-14

    申请号:US09890030

    申请日:2001-07-24

    Abstract: The present invention is directed to the creation of macroscopic materials and objects comprising aligned nanotube segments. The invention entails aligning single-wall carbon nanotube (SWNT) segments that are suspended in a fluid medium and then removing the aligned segments from suspension in a way that macroscopic, ordered assemblies of SWNT are formed. The invention is further directed to controlling the natural proclivity of nanotube segments to self assemble into ordered structures by modifying the environment of the nanotubes and the history of that environment prior to and during the process. The materials and objects are “macroscopic” in that they are large enough to be seen without the aid of a microscope or of the dimensions of such objects. These macroscopic, ordered SWNT materials and objects have the remarkable physical, electrical, and chemical properties that SWNT exhibit on the microscopic scale because they are comprised nanotubes, each of which is aligned in the same direction and in contact with its nearest neighbors. An ordered assembly of closest SWNT also serves as a template for growth of more and larger ordered assemblies. An ordered assembly further serves as a foundation for post processing treatments that modify the assembly internally to specifically enhance selected material properties such as shear strength, tensile strength, compressive strength, toughness, electrical conductivity, and thermal conductivity.

    Abstract translation: 本发明涉及包括对准的纳米管段的宏观材料和物体的产生。 本发明需要将悬浮在流体介质中的单壁碳纳米管(SWNT)段对准,然后以形成SWNT的宏观有序组件的方式从悬浮液中除去对准的段。 本发明进一步涉及通过在过程之前和过程中修改纳米管的环境和该环境的历史来控制纳米管段的自然倾向自我组装成有序结构。 材料和物体是“宏观的”,因为它们足够大以便在没有显微镜或这些物体的尺寸的情况下被看到。 这些宏观有序的SWNT材料和物体具有显着的物理,电学和化学性质,SWNT在微观尺度上显示,因为它们包含纳米管,每个纳米管沿相同方向排列并与其最近的邻近物接触。 最近的SWNT的有序组件也可以作为增加更多和更大订单组件的模板。 订购的组件还用作后处理处理的基础,其在内部改变组件以特异性地增强选定的材料性能,例如剪切强度,抗拉强度,抗压强度,韧性,导电性和导热性。

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