公开(公告)号：US07237938B2

公开(公告)日：2007-07-03

申请号：US11088791

申请日：2005-03-25

Applicant: Bily Wang ,  Jonnie Chuang ,  Chuanfa Lin

Inventor： Bily Wang ,  Jonnie Chuang ,  Chuanfa Lin

IPC: F21V8/00

CPC classification number: G02B6/0018 ,  G02B6/005 ,  G02B6/0083 ,  G02F1/133615

Abstract: A backlight module arranged under a flat display includes a printed circuit board being parallel to the flat display and including a plurality of LEDs, a reflection portion being a reflection wall bent from a fringe of the LEDs to extend over the LEDs, and a guide light plate being parallel to the printed circuit board. The reflection portion includes an orientation wall parallel to the reflection wall and an outlet with a direction parallel to the printed circuit board. The guide light plate has an end connecting inside the outlet of the reflection portion, a light delivering surface adjacent to the flat display, and a reflection surface arranged at a bottom thereof.

Abstract translation: 布置在平坦显示器下方的背光模块包括平行于平面显示器并包括多个LED的印刷电路板，反射部分是从LED的边缘弯曲以在LED上延伸的反射壁，以及引导光 板平行于印刷电路板。 反射部分包括平行于反射壁的定向壁和具有平行于印刷电路板的方向的出口。 引导光板具有连接在反射部分的出口内部的端部，与平面显示器相邻的光输送表面和布置在其底部的反射表面。

公开(公告)号：US20060261488A1

公开(公告)日：2006-11-23

申请号：US11492816

申请日：2006-07-26

Applicant: Bily Wang ,  Jonnie Chuang ,  Chuan-Fa Lin ,  Chi-Wen Hung

Inventor： Bily Wang ,  Jonnie Chuang ,  Chuan-Fa Lin ,  Chi-Wen Hung

IPC: H01L23/48

CPC classification number: H01L23/60 ,  H01L23/544 ,  H01L24/48 ,  H01L25/167 ,  H01L27/0248 ,  H01L2223/54493 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/0401 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A wafer-level electro-optical semiconductor fabrication mechanism and method for the same which improves upon traditional electro-optical semiconductor grain packaging methods. The present invention electrically connects semiconductor grains to the grains on a top surface of a wafer. this is done by either screen-printing or steel board-printing solder or silver paste onto the wafer. After that, the wafer is processed using the following steps: processing the devices, bonding with wire, packaging the wafer and finally cutting the wafer. Using this method raises the production yield while production times and costs are reduced. The wafer-level electro-optical semiconductor fabrication mechanism comprises: a wafer, an electro-optical semiconductor grain and conductive materials.

Abstract translation: 一种用于改进传统电光半导体晶粒封装方法的晶片级电光半导体制造机构及其方法。 本发明将半导体晶粒与晶片的顶表面上的晶粒电连接。 这可以通过丝网印刷或钢板印刷焊料或银浆在晶片上完成。 之后，使用以下步骤处理晶片：处理器件，用导线接合，封装晶片并最终切割晶片。 使用这种方法提高了生产率，同时降低了生产时间和成本。 晶片级电光半导体制造机构包括：晶片，电光半导体晶粒和导电材料。

公开(公告)号：US20060261455A1

公开(公告)日：2006-11-23

申请号：US11488852

申请日：2006-07-19

Applicant: Bily Wang ,  Jonnie Chuang ,  Heng-Yen Lee ,  Hui-Yen Huang

Inventor： Bily Wang ,  Jonnie Chuang ,  Heng-Yen Lee ,  Hui-Yen Huang

IPC: H01L23/02

CPC classification number: H01L33/62 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/49 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

Abstract: An LED package structure and a method for making the same are described. The LED package structure has at least one LED die, at least one metallic frame relating to the LED die, and an insulative body packaging the LED die and the metallic frame. The metallic frame has a first contact corresponding to the LED die and a second contact being relative to the first contact. The first and the second contacts inside the insulative body are electrically isolated from each other. The first contact has at least one recess around the LED die, and the second contact has at least one groove formed thereon.

Abstract translation: 描述了LED封装结构及其制造方法。 LED封装结构具有至少一个LED管芯，至少一个与LED管芯相关的金属框架，以及封装LED管芯和金属框架的绝缘体。 金属框架具有对应于LED管芯的第一接触件和相对于第一接触件的第二接触件。 绝缘体内的第一和第二触点彼此电隔离。 第一接触件具有围绕LED管芯的至少一个凹部，并且第二接触件具有形成在其上的至少一个凹槽。

公开(公告)号：US20060251355A1

公开(公告)日：2006-11-09

申请号：US11416163

申请日：2006-05-03

Applicant: Bily Wang ,  John Lin

Inventor： Bily Wang ,  John Lin

IPC: G02B6/12

CPC classification number: G09F9/33 ,  F21K9/00 ,  H01L2224/97

Abstract: A photoelectric chip array package structure is convenient for chip installation and prevents external light interference. The photoelectric chip array package structure of the present invention has a substrate, multiple photoelectric chips, a package structure, and multiple contacts. It can be applied for advertising signs and improve the defect-free ratio and packaging quality. When applied for packaging light-emitting diodes (LEDs) or optical sensors, it easily meets the packaging requirements of electronic chips. The present invention disposes contacts at one side or multiple predetermined sides of the substrate to improve airtightness and convenience for installation. In addition, the present invention also disposes an external frame or optical gratings to prevent external light interference. Thus, the package structure of the present invention is superior to conventional package structures, and is cheap.

Abstract translation: 光电芯片阵列封装结构方便芯片安装，防止外部光干扰。 本发明的光电芯片阵列封装结构具有基板，多个光电芯片，封装结构和多个触点。 可广泛应用于广告招牌，提高无缺陷率和包装质量。 当应用于包装发光二极管（LED）或光学传感器时，它很容易满足电子芯片的包装要求。 本发明在基板的一侧或多个预定侧配置触点，以提高气密性和便于安装。 此外，本发明还配置外部框架或光栅以防止外部光干扰。 因此，本发明的封装结构优于常规的封装结构，并且便宜。

公开(公告)号：US20060250343A1

公开(公告)日：2006-11-09

申请号：US11416162

申请日：2006-05-03

Applicant: Bily Wang ,  John Lin

Inventor： Bily Wang ,  John Lin

IPC: G09G3/36

CPC classification number: G09G3/3659 ,  G09G3/3648 ,  G09G3/3677 ,  G09G2300/0842

Abstract: A drive circuit of display and method for the same are described. Each drive circuit in an LCD panel is sequentially controlled by scanning signals so as to store temporarily a frame of image data in each storage capacitor. Then, a synchronization drive element in each drive circuit receives a synchronization control signal, so that a frame of each storage capacitor may be meanwhile sent to light-emitting units for achievement of the synchronization display on the LCD panel. Besides, a discharge transistor may be added and is controlled by a discharge signal before the synchronization drive element turns ON, which may effectively eliminate a pre-frame on the LCD panel.

Abstract translation: 描述了显示器的驱动电路及其方法。 LCD面板中的每个驱动电路由扫描信号依次控制，从而临时存储每个存储电容器中的一帧图像数据。 然后，每个驱动电路中的同步驱动元件接收同步控制信号，从而可以将每个存储电容器的帧同时发送到用于实现LCD面板上的同步显示的发光单元。 此外，可以在同步驱动元件导通之前添加放电晶体管并由放电信号控制，这可以有效地消除LCD面板上的预帧。

公开(公告)号：US07080924B2

公开(公告)日：2006-07-25

申请号：US10307546

申请日：2002-12-02

Applicant: Tzyy Jang Tseng ,  Bily Wang ,  Alen Ke

Inventor： Tzyy Jang Tseng ,  Bily Wang ,  Alen Ke

IPC: F21V11/00

CPC classification number: F21V3/049 ,  F21K9/232 ,  F21K9/60 ,  F21V3/061 ,  F21V7/04 ,  F21Y2115/10 ,  Y10S362/80

Abstract: A light emitting diode chip or chips array mounted on a substrate is surrounded by one or more side walls. The wall has an uneven reflecting surface to diverge the light emitted from the LED chip or chip array. The wall may have a triangular cross-section so that the emitted light diverges in all directions. When three double-sided reflecting walls surround three LED panels, the reflected light becomes omnidirectional hemispherically and can be used in a light bulb.

Abstract translation: 安装在基板上的发光二极管芯片或芯片阵列被一个或多个侧壁包围。 该壁具有不均匀的反射表面，以使从LED芯片或芯片阵列发射的光发散。 壁可以具有三角形横截面，使得发射的光在所有方向上发散。 当三个双面反射壁围绕三个LED面板时，反射光成为全向半球，可用于灯泡。

公开(公告)号：US20060082994A1

公开(公告)日：2006-04-20

申请号：US10965852

申请日：2004-10-18

Applicant: Bily Wang ,  Jonnie Chuang ,  Ching-Hung Ko ,  Chun-Cheng Weng

Inventor： Bily Wang ,  Jonnie Chuang ,  Ching-Hung Ko ,  Chun-Cheng Weng

IPC: B60Q1/26

CPC classification number: F21V29/83 ,  F21K9/00 ,  F21V29/70 ,  F21Y2103/33 ,  F21Y2115/10 ,  H05K1/0206 ,  H05K3/0058

Abstract: An LED lamp uses a plurality of LEDs as a light source. The LED lamp has a casing, a conduction layer, a PCB, a plurality of LED and a drive electronics. The conduction layer is placed in an inner of the casing. The conduction layer is metal, copper or aluminum, or nonmetal, silica gel or mica, for conducting the heat of the PCB caused by the current heating effects. The PCB placed on an upper surface of the conduction layer is for mounting the LED. Each LED is electrically connected to the PCB by way of shunt winding or in series for providing a light source. The drive electronics is electrically connected to the PCB for driving color rendering.

Abstract translation: LED灯使用多个LED作为光源。 LED灯具有壳体，导电层，PCB，多个LED和驱动电子器件。 导电层被放置在壳体的内部。 导电层是金属，铜或铝，或非金属，硅胶或云母，用于传导由当前的加热效应引起的PCB的热量。 放置在导电层上表面的PCB用于安装LED。 每个LED通过并联绕组或串联电连接到PCB，以提供光源。 驱动电路与PCB电连接，用于驱动显色。

公开(公告)号：US20060035407A1

公开(公告)日：2006-02-16

申请号：US11081527

申请日：2005-03-17

Applicant: Bily Wang ,  Jonnie Chuang ,  Hui-Yen Huang

Inventor： Bily Wang ,  Jonnie Chuang ,  Hui-Yen Huang

IPC: H01L21/50 ,  H01L21/48 ,  H05K1/02 ,  H01L21/30 ,  H05K1/00

CPC classification number: H05K3/445 ,  H05K1/056 ,  H05K3/0052 ,  H05K2201/09881 ,  H05K2203/0228 ,  H05K2203/0278 ,  H05K2203/1536

Abstract: A semiconductor substrate structure includes a substrate having a trench formed thereon, a polymer composite material supplied into the trench and an electroplate conductive layer formed on the substrate. Further, a semiconductor substrate processing method includes the steps of: providing a substrate forming a trench thereon, supplying a polymer composite material into the trench, polishing a surface of the substrate and forming a covering material on the surface of the substrate. Therefore, the method is provided for combining the polymer composite material into the substrate, thereby to raise cutting precision and strength of the semiconductor substrate structure.

Abstract translation: 半导体衬底结构包括其上形成有沟槽的衬底，提供到沟槽中的聚合物复合材料和形成在衬底上的电镀导电层。 此外，半导体衬底处理方法包括以下步骤：提供在其上形成沟槽的衬底，将聚合物复合材料供应到沟槽中，抛光衬底的表面并在衬底的表面上形成覆盖材料。 因此，提供了将聚合物复合材料组合到基板中的方法，从而提高半导体基板结构的切割精度和强度。

公开(公告)号：US20060034071A1

公开(公告)日：2006-02-16

申请号：US10915537

申请日：2004-08-11

Applicant: Bily Wang ,  Jonnie Chuang ,  Ching-Hung Ko ,  Chun-Cheng Weng

Inventor： Bily Wang ,  Jonnie Chuang ,  Ching-Hung Ko ,  Chun-Cheng Weng

IPC: F21L4/00

CPC classification number: F21S8/00 ,  F21W2111/02 ,  F21Y2115/10

Abstract: An LED lamp is enabled to evenly emit lights, and is provided with a single set of indicators to provide different colors of light, and as least comprises a tubular case, a circuit board and at least an LED. The inner wall of the tubular case has a rough, light-homogenizing layer disposed thereon. The circuit board is provided together with a control unit on the bottom of the tubular case. The color mixing LED is provided on the circuit board.

Abstract translation: LED灯能够均匀地发光，并且设置有单组指示器以提供不同颜色的光，并且至少包括管状外壳，电路板和至少LED。 管状壳体的内壁具有设置在其上的粗糙的轻质均质层。 电路板与管状外壳底部的控制单元一起提供。 混色LED设在电路板上。

公开(公告)号：US20050207156A1

公开(公告)日：2005-09-22

申请号：US10805346

申请日：2004-03-22

Applicant: Bily Wang ,  Jonnie Chuang

Inventor： Bily Wang ,  Jonnie Chuang

IPC: F21K99/00 ,  F21S4/00 ,  F21V1/00 ,  H05K1/18

CPC classification number: F21K9/90 ,  F21K9/00 ,  F21S4/20 ,  F21Y2105/10 ,  F21Y2105/12 ,  F21Y2107/90 ,  F21Y2115/10 ,  H05K1/189

Abstract: A flexible light array is constructed to have a flexible substrate with conducting circuits therein, a LED array formed of longitudinally and transversely aligned light emitting diodes respectively electrically connected to the conducting circuits and controllable by a driving circuit to produce a video display, and a flexible plastic member packed on the flexible substrate and the LED array.

Abstract translation: 柔性光阵列被构造成具有其中具有导电电路的柔性基板，由纵向和横向对准的发光二极管形成的LED阵列，其分别电连接到导电电路并且可由驱动电路控制以产生视频显示器，以及柔性光阵列 塑料构件包装在柔性基板和LED阵列上。